Xinhuan Niu

ORCID: 0000-0002-3046-0046
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Research Areas
  • Advanced Surface Polishing Techniques
  • Integrated Circuits and Semiconductor Failure Analysis
  • Diamond and Carbon-based Materials Research
  • Advanced machining processes and optimization
  • Advanced Machining and Optimization Techniques
  • Semiconductor materials and devices
  • Corrosion Behavior and Inhibition
  • Copper Interconnects and Reliability
  • Advanced Sensor and Energy Harvesting Materials
  • Metal and Thin Film Mechanics
  • Conducting polymers and applications
  • Polysaccharides and Plant Cell Walls
  • Nanofabrication and Lithography Techniques
  • Plant Disease Resistance and Genetics
  • Plant Reproductive Biology
  • Metal Extraction and Bioleaching
  • Laser Material Processing Techniques
  • Fungal Biology and Applications
  • Advanced materials and composites
  • Plant Molecular Biology Research
  • Plant Gene Expression Analysis
  • Analytical Chemistry and Sensors
  • Electrodeposition and Electroless Coatings
  • Mycorrhizal Fungi and Plant Interactions
  • Gas Sensing Nanomaterials and Sensors

Tianjin Polytechnic University
2020-2025

Hebei University of Technology
2014-2024

Institute of Microelectronics
2006-2024

China University of Petroleum, East China
2024

Dali University
2024

Tianjin University of Technology
2016-2023

Nanjing Agricultural University
2021-2023

Shandong Provincial Hospital
2023

Nankai University
2023

Shandong First Medical University
2023

As a superfamily of transcription factors (TFs), the basic helix-loop-helix (bHLH) proteins have been characterized functionally in many plants with vital role regulation diverse biological processes including growth, development, response to various stresses, and so on. However, no systemic analysis bHLH TFs has reported Brachypodium distachyon, an emerging model plant Poaceae. A total 146 were identified distachyon genome classified into 24 subfamilies. BdbHLHs same subfamily share similar...

10.1186/s12864-017-4044-4 article EN cc-by BMC Genomics 2017-08-15

Flexible wearable pressure sensors have attracted special attention in the last 10 years due to their great potential health monitoring, activity detection and as electronic skin. However, it is still a challenge develop high sensitivity, fast response, good reliable stability through simple reproducible large-scale fabrication process. Here, we efficient method fabricate three-dimensional (3D) light-weight piezoresistive sensing materials by coating multi-walled carbon nanotubes (MWCNTs) on...

10.1039/d2ra01291j article EN cc-by-nc RSC Advances 2022-01-01

The elongation growth of the mushroom stipe is a characteristic but not well-understood morphogenetic event basidiomycetes. We found that extending native cell walls Coprinopsis cinerea were associated with release N-acetylglucosamine and chitinbiose chitinase activity. Two chitinases among all detected from C. cinerea, ChiE1 ChiIII, reconstituted heat-inactivated wall extension released chitinbiose. Interestingly, both ChiIII hydrolyze insoluble crystalline chitin powder, while other do...

10.1128/aem.00532-19 article EN Applied and Environmental Microbiology 2019-05-21

Achieving a continuously adjustable micro–nanostructure of sensing materials is crucial and still challenge for the flexible pressure sensor. We proposed new method to prepare ultrathin ordered nanocone array films by designing tunable tapered anodized aluminum oxide templates highly sensitive sensors interlocking arrays. Meanwhile, theoretical prediction model sensitivity interlocked arrays proposed, its result shows that resistance change rate positively correlated with height contact area...

10.1021/acsami.0c16456 article EN ACS Applied Materials & Interfaces 2020-11-30

The microstructured surfaces of bioelectrical dry electrodes are important aspects electrode design. However, traditional for costly to produce and require complex fabrication methods. In this study, a novel stacked-template method is proposed the first time, rapidly producing at low cost with large surface area. Three types Ag/AgCl thermoplastic polyurethane (TPU) Fructus xanthii-inspired barb structure (FXbs) prepared using method; then, dynamic friction, hair interference resistance,...

10.1021/acsami.1c22303 article EN ACS Applied Materials & Interfaces 2022-01-19

The adoption of super electrochemical capacitors (SECs) as replacements for aluminum electrolytic (AECs) in alternating current (AC) filter circuits has attracted significant research interest. This trend is primarily driven by their high specific capacitance and low space occupancy, making SECs promising candidates future portable electronic devices. In this work, MBene was prepared through a simple one-pot hydrothermal reaction first used the electrode material AC filtering symmetric SECs....

10.1021/acsmaterialslett.3c00521 article EN ACS Materials Letters 2023-08-14

Fabric electrodes are an important part of long-term medical-health-monitoring garments, but sweat corrosion can greatly affect their longevity and stability. In this study, the metal fabric biopotential sensor was chemically modified with 3-mercaptopropyltrimethoxysilane (MPTS). Ag/AgCl formed on electrode surface by constant voltage deposition. Ag/AgCl/3-Mercaptopropyltrimethoxysilane/silver-plated nylon (Ag/AgCl/MPTS/SPNE), Ag/AgCl/3-mercaptopropyltrimethoxysilane/silver-plated copper...

10.1021/acsami.4c22905 article EN ACS Applied Materials & Interfaces 2025-03-27

MYB transcription factors are widespread in plants and play key roles plant development. Although have been thoroughly characterized many plants, genome-wide analysis of the gene family has not yet undertaken Brachypodium distachyon. In this study, 122 BdMYB were identified, comprising 85 MYB-R2R3, 34 MYB-related three MYB-R1R2R3. Phylogenetic showed that BdMYBs, OsMYBs AtMYBs with similar functions clustered same subgroup, phylogenetic relationships supported by highly conserved motifs...

10.1093/pcp/pcx115 article EN Plant and Cell Physiology 2017-08-10

As the feature size of integrated circuits (ICs) shrinks down to 14nm and below, Cobalt (Co) is identified as a suitable barrier layer material. Copper (Cu) has been widely used most basic interconnection metallic material for Giant-large scale (GLSI). A higher removal rate (RR) selectivity between Cu Co desired obtain in copper film chemical mechanical polishing (CMP) because traditional three-step replaced by two-step under lower technology nodes. The purpose achieve effective ultimately...

10.1149/2.0101902jss article EN ECS Journal of Solid State Science and Technology 2019-01-01
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