A5074230267- Physical Unclonable Functions (PUFs) and Hardware Security
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- VLSI and Analog Circuit Testing
- 3D IC and TSV technologies
- Information and Cyber Security
- Advanced Photonic Communication Systems
- Advanced Malware Detection Techniques
- Security and Verification in Computing
- Material Properties and Processing
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- RFID technology advancements
- Geophysics and Sensor Technology
- Mechanical and Optical Resonators
- Optical Systems and Laser Technology
- Neural Networks and Reservoir Computing
- Advanced Memory and Neural Computing
- Optical Wireless Communication Technologies
- Safety Systems Engineering in Autonomy
- Radio Wave Propagation Studies
- Electrostatic Discharge in Electronics
- Cryptographic Implementations and Security
- Photonic and Optical Devices
University of Florida
2022-2025
Florida Institute for Conservation Science
2022
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach Heterogeneous Integration (HI), which involves advanced packaging techniques integrate independently designed manufactured components using most suitable process technology. However, adopting HI...
Various probing methodologies have been developed in the semiconductor industry to perform failure analysis of an integrated circuit. However, these techniques can be misused launch security attacks and extract sensitive information from hardware. In this article, authors provide overview such present probable countermeasures their limitations.
Abstract Probing and imaging techniques that are conventionally used for failure analysis pose a major threat to the confidentiality integrity of data stored in non-volatile memory (NVM) cells integrated into silicon chip. These fall under umbrella physical attacks, which unlock tremendous capabilities an attacker trying access secret information target NVM. How vulnerable NVM cell is these attacks depends on device physics operational principles cell. The wide range emerging technologies...
Recent decades have witnessed a remarkable pace of innovation and performance improvements in integrated circuits (ICs), which become indispensable an array critical applications ranging from military infrastructure to personal healthcare. Meanwhile, recent developments brought physical security the forefront concern, particularly considering valuable assets handled stored within ICs. Among various invasive attack vectors, micro-probing attacks risen as menacing threat. These leverage...
As most silicon photonics (SiPH) foundries are located internationally, significant security concerns exist when such devices outsourced. We investigate critical vulnerabilities in the SiPH supply chain, including Denial of Service (DoS), data leakage, and reliability, propose physical inspection as a potential measure.
Abstract The increasing demand for semiconductor chips and the outsourcing of chip fabrication have heightened vulnerability to hardware security threats. While optical probing has been used extensively semi-invasive/non-invasive attacks, its resolution limits obsolescence in advanced technologies necessitated exploring other techniques. Electron-beam (EBP) emerged as a powerful method, offering 20x better spatial than probing, applies sub- 7nm flip-chips 3D architecture systems. However,...
Abstract Antenna-in-packaging (AiP) enables the next generation of high-performance wireless 5G mmWave communication and beyond by incorporating antenna arrays in small form factors using System Package (SiP) technology. The trend toward heterogeneous integration advanced packaging will likely introduce more complexity to semiconductor supply chain. In addition, there is also risk becoming susceptible security vulnerabilities associated with packaging. This paper provides an overview chain...
Abstract This article describes how physical attacks can be launched on different types of nonvolatile memory (NVM) cells using failure analysis tools. It explains the bit information stored inside these devices is susceptible to read-out and fault injection defines vulnerability parameters help quantify risks associated with modalities attack. also presents an in-depth security emerging NVM technologies discusses potential countermeasures.