- Integrated Circuits and Semiconductor Failure Analysis
- Physical Unclonable Functions (PUFs) and Hardware Security
- Industrial Vision Systems and Defect Detection
- Neuroscience and Neural Engineering
- Security and Verification in Computing
- Electron and X-Ray Spectroscopy Techniques
- Electrostatic Discharge in Electronics
- VLSI and Analog Circuit Testing
- Terahertz technology and applications
- Advanced Malware Detection Techniques
- Photonic and Optical Devices
- Semiconductor materials and devices
- Neural Networks and Reservoir Computing
- Cryptographic Implementations and Security
- Orbital Angular Momentum in Optics
- 3D IC and TSV technologies
- Image and Object Detection Techniques
- Cell Image Analysis Techniques
- Advancements in Photolithography Techniques
- 2D Materials and Applications
- Electronic Packaging and Soldering Technologies
- Advanced X-ray and CT Imaging
- Optical Network Technologies
- Nanowire Synthesis and Applications
- Phase-change materials and chalcogenides
University of Florida
2016-2025
Florida College
2023
Florida Institute for Conservation Science
2018-2022
University of Connecticut
2011-2021
The reverse engineering (RE) of electronic chips and systems can be used with honest dishonest intentions. To inhibit RE for those intentions (e.g., piracy counterfeiting), it is important that the community aware state-of-the-art capabilities available to attackers today. In this article, we will presenting a survey anti-RE techniques on chip, board, system levels. We also highlight current challenges limitations research needed overcome them. This should interest both governmental...
Logic locking has been proposed as an obfuscation technique to protect outsourced IC designs from IP piracy by untrusted entities in the design and fabrication process. In this case, netlist is locked adding extra key-gates, will be unlocked only if a correct key applied key-gates. The assumed written into non-volatile memory after owner. past several years, focus of research community mostly on Oracle-guided attacks, such SAT logic proposing proper countermeasures against attacks. However,...
In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, aims to retrieve information from a product, i.e., integrated circuits (ICs) printed circuit boards (PCBs) in security-related scenarios, hope understanding functionality device determining its constituent components. Hence, it can raise serious issues concerning Intellectual Property (IP) infringement, (in)effectiveness measures, even new opportunities for...
Abstract Hardware Trojans are malicious changes to the design of integrated circuits (ICs) at different stages and fabrication processes. Different approaches have been developed detect namely non-destructive (electrical tests like run-time monitoring, functional structural tests) destructive (full chip reverse engineering). However, these methods cannot all types they suffer from a number disadvantages such as slow speed detection lack confidence in detecting Trojans. Majority hardware...
Over the past two decades, globalized outsourcing in semiconductor supply chain has lowered manufacturing costs and shortened time-to-market for original equipment manufacturers (OEMs). However, such rendered printed circuit boards (PCBs) vulnerable to malicious activities alterations on a global scale. In this article, we take an in-depth look into one attack, called “Big Hack,” that was recently reported by Bloomberg Buisnessweek. The article provides background Big Hack from three...
Due to the global offshore fabrication of semiconductors, hardware security problems such as counterfeit ICs and Hardware Trojans (HTs) have affected semiconductor device trustworthiness in critical applications. Previous research has proven encapsulant material difference exists ICs. What's more by using a pulsed THz signal, Terahertz Time-Domain Spectroscopy (THz-TDS) is able detect effective refractive index between authentic IC packaging. This also successfully observed reflective...
Hardware security has been a significant challenge in semiconductor devices, leading to serious issues such as denial of service, data leakage etc at both transistor well package level. Detecting the usage state target sample or generating unique fingerprint can provide critical information about sample, aiding prevention counterfeiting avoid hardware risks. Terahertz Time-Domain Spectroscopy (THz-TDS) stands out powerful and non-destructive tool, capable probing analyzing polymer materials....
Reverse engineering (RE) of electronic systems is performed for many different reasons, including, but not limited to, failure analysis and fault isolation, obsolescence management, proof IP rights infringement, security assessment, development attacks, counterfeiting. Regardless the goal, it imperative that community understands requirements, complexities, limitations RE. Traditional RE based on a destructive process serial sectioning followed by imaging, which time-consuming, expensive,...
THz radiation is capable of penetrating most nonmetallic materials and allows spectroscopy to be used image the interior structures constituent wide variety objects including Integrated circuits (ICs). The fact that many in spectral region have unique fingerprints provides an authentication platform distinguish between authentic counterfeit electronic components. Counterfeit ICs are investigated using a high-speed terahertz spectrometer with laser pulse duration 90 fs repetition rate 250 MHz...
Due to globalization, the semiconductor industry is becoming more susceptible trust and security issues. Hardware Trojans, i.e., malicious modification integrated circuits (ICs), can violate root of when devices are fabricated in untrusted facilities. Literature shows as microscopy failure analysis tools excel resolution capability, physical inspection methods like reverse engineering photonic emission become attractive helping verify such On contrary, opening new capabilities for an...
System-in-package (SiP) is a type of electronic packaging convention that integrates multiple components, such as microprocessors, memory, sensors, and so on, in the form chiplets into single unified package. SiP integration, enabled by advanced technologies, particularly well-suited for mobile devices, wearables, IoT applications, where space power constraints are critical. The demand devices expected to grow more applications industries adopt connected technologies. increasing popularity...
Abstract Advancements in optical communications have increasingly focused on leveraging spatial-structured beams such as orbital angular momentum (OAM) for high-capacity data transmission. Conventional electronic convolutional neural networks exhibit constraints efficiently demultiplexing OAM signals. Here, we introduce a hybrid optical-electronic network that is capable of completing Fourier optics convolution and realizing intensity-recognition-based multiplexed under variable simulated...
Hardware Trojans are malicious modifications on integrated circuits (IC), which pose a grave threat to the security of modern military and commercial systems. Existing methods detecting hardware plagued by inability all Trojans, reliance golden chip that might not be available, high time cost, low accuracy. In this paper, we present Golden Gates, novel detection method designed achieve comparable level accuracy full reverse engineering, yet paying only fraction its cost in time. The proposed...
Interposers are used to connect chiplets when building a heterogeneous SoC. come with their own unique security threats. They also present opportunities for securing such systems. This article discusses some of them.
Abstract Reverse engineering of electronics systems is performed for various reasons ranging from honest ones such as failure analysis, fault isolation, trustworthiness verification, obsolescence management, etc. to dishonest cloning, counterfeiting, identification vulnerabilities, development attacks, Regardless the goal, it imperative that research community understands requirements, complexities, and limitations reverse engineering. Until recently, was considered destructive, time...
Counterfeiting is an increasing concern for businesses and governments as greater numbers of counterfeit integrated circuits (IC) infiltrate the global market. There ongoing effort in experimental national labs inside United States to detect prevent such counterfeits most efficient time period. However, there still a missing piece automatically properly keep record detected ICs. Here, we introduce web application database that allows users share previous examples through online obtain...
Abstract Optical probing from the backside of an integrated circuit (IC) is a powerful failure analysis technique but raises serious security concerns when in hands attackers. For instance, attacks using laser voltage (LVP) allow direct reading sensitive information being stored and/or processed IC. Although few sensor-based countermeasures against optical have been proposed, overheads (fabrication cost area) are considerable. In this paper, we introduce nanopyramid structures that mitigate...