A5029583250- Industrial Vision Systems and Defect Detection
- Advancements in Photolithography Techniques
- Milk Quality and Mastitis in Dairy Cows
- Semiconductor materials and devices
- Fluorine in Organic Chemistry
- VLSI and Analog Circuit Testing
- Chemical Reactions and Mechanisms
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Optical Coatings and Gratings
- Advanced Surface Polishing Techniques
- Garlic and Onion Studies
- Mineral Processing and Grinding
- Biopolymer Synthesis and Applications
- Inorganic and Organometallic Chemistry
- Electron and X-Ray Spectroscopy Techniques
- Image Processing Techniques and Applications
- Optical Polarization and Ellipsometry
- Optimal Power Flow Distribution
- Advanced machining processes and optimization
- Metallurgical Processes and Thermodynamics
- VLSI and FPGA Design Techniques
- 3D IC and TSV technologies
- Freezing and Crystallization Processes
- Plant Pathogens and Fungal Diseases
Fraunhofer Institute for Integrated Systems and Device Technology
2010-2024
Schott (Germany)
2008-2023
Fraunhofer Institute for Integrated Circuits
1992
Beiersdorf (Germany)
1948
Reef Ecologic
1909
Die iitherischen Oele v011 Mentha pulegium iind Hedeomn pulegoides, welche unter d e w Namen Polei-Oel in den Handel kommen, enthnlten als wesentlichen
Abstract In many real-world mixed-integer optimization problems from engineering, the side constraints can be subdivided into two categories: which describe a certain logic to model feasible allocation of resources (such as maximal number available assets, working time requirements, maintenance contractual obligations, etc.), and physical processes related quantities current, pressure, temperature, etc.). While first type often easily stated in terms program (MIP), second part may involve...
In semiconductor manufacturing, the implementation of advanced process control systems has become essential for cost effective manufacturing at high product quality. addition to established methods, new techniques such as virtual metrology, where post-process quality parameters are predicted from and wafer state information need be developed implemented critical steps. This requires a fab-wide approach due objectives VM, which supplement or replace stand-alone in-line metrology operations,...
Thermally grown SiO2 layers were treated by a plasma nitridation process realized in vertical furnace. The combination of pulsed-low frequency and microwave remote with N2/NH3/He feed gas mixture was used to nitride the thermally gate dielectrics MIS structures. Temperature dependency effective masses barrier heights for electrons pure as well nitrided high electric field means Fowler–Nordheim regime determined. It is frequently seen from literature that either electron mass or height...
Thermal Laser Separation (TLS) is an ablation free and therefore kerf laser based cutting technology. This novel dicing technology utilized to separate microelectronic devices on semiconductor wafers. In order broaden the use of TLS method towards smaller chips new materials one side advanced process monitoring other side, a contact-free measuring for has been developed. heating wafer with near-infrared (NIR) analyzing subsequent temperature gradients induced by heat diffusion contact-less...
The scaling down of critical dimensions for the manufacturing nanoelectronics requires continuous introduction new materials. results analysis thin high-k films made from Al2O3 as reference samples were used at multiple laboratories to show power and strength complementary metrology, e.g. using various techniques, such synchrotron radiation X-ray spectrometry, 'table top' grazing incidence spectrometry reflectometry, spectroscopic ellipsometry. layer thicknesses material parameters validated...
The authors combined electrical and structural characterizations with analytical spectroscopic measurements in order to fully analyze oxynitride nanofilms on Si that were produced a minibatch type plasma nitridation reactor. demonstrate for the investigated samples result of is different 2-nm-thick SiO2 films compared 5-nm-thick films. In first case, results an increase oxide film thickness non-nitrided film, consequent decrease leakage current electrically measured equivalent (EOT)....
Within the ENIAC project "IMPROVE", new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers Europe, solution providers, research institutions. A major objective of is make these APC methods applicable existing fab systems which widely differ automation infrastructure. novel framework architecture integration control paradigms was...
• The identification and control of volatile organic compounds (VOCs) released by polymers during lamination in the photovoltaic (PV) industry is considerable importance to establish optimize processes order ensure a long term reliability manufactured modules. Bubble formation one cause delamination, major problems linked PV module reliability. Gas chromatography-mass-spectrometry (GC-MS) used determine quantify VOCs emanating from EVA at 160 C therefore understand origin bubbles process.
Reliable and failure-operable motor inverter solutions are essential for a variety of applications. Advanced diagnostic condition monitoring methods can contribute in reducing component-induced system failures, support demand based or predictive maintenance therefore increase the uptime systems. Developing such additional functionalities requires power electronic systems combination with intelligent algorithms that be implemented modern drive Within this paper, concept "Cognitive Power...
This paper describes practical aspects of development and implementation novel process control entities such as Virtual Metrology (VM) Predictive Maintenance (PdM), which utilize multivariate statistical models machine learning techniques for prediction quality parameters equipment faults. The description is based on the experiences collected during model VM PdM. An overview main steps including challenges, potential solutions applicable algorithms given. described at example filament...