Qiang Li

ORCID: 0000-0002-4255-4832
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About
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Research Areas
  • Thermal Radiation and Cooling Technologies
  • Solar Thermal and Photovoltaic Systems
  • Heat Transfer and Optimization
  • 3D IC and TSV technologies
  • Urban Heat Island Mitigation
  • Thermal properties of materials
  • Electric Motor Design and Analysis
  • CO2 Reduction Techniques and Catalysts
  • solar cell performance optimization
  • Advanced battery technologies research
  • Photovoltaic System Optimization Techniques
  • Magnetic Bearings and Levitation Dynamics
  • Advanced Thermoelectric Materials and Devices
  • Electrocatalysts for Energy Conversion
  • Smart Grid and Power Systems
  • Integrated Energy Systems Optimization
  • Ionic liquids properties and applications
  • HVDC Systems and Fault Protection
  • Heat Transfer and Boiling Studies
  • Spacecraft and Cryogenic Technologies
  • Power Systems and Renewable Energy
  • Radiative Heat Transfer Studies
  • High-Voltage Power Transmission Systems
  • Smart Grid Energy Management
  • Silicon Carbide Semiconductor Technologies

Chery Automobile (China)
2025

Geely (China)
2024-2025

Nanjing University of Science and Technology
2015-2025

China Southern Power Grid (China)
2022-2024

Xi'an Jiaotong University
2022

Ministry of Natural Resources
2018

Jilin University
2018

10.1016/j.pmatsci.2024.101291 article EN Progress in Materials Science 2024-04-04

Passive all-day radiative cooling has been proposed as a promising pathway to cool objects by reflecting sunlight and dissipating heat the cold outer space through atmospheric windows without any energy consumption. However, most of existing coolers are susceptible contamination, which may decrease optical property gradually degrade outdoor performance. Herein, we prepared hierarchical superhydrophobic fluorinated-SiO2/PVDF-HFP nanofiber membrane facile scalable technology electrospinning...

10.1021/acsami.2c19422 article EN ACS Applied Materials & Interfaces 2022-12-21

Radiative cooling has been considered an innovative passive method to resolve the problem of overheating electronic devices. However, it is inefficient for huge heat generation components. Herein, we report a dual-encapsulated nanocomposite (DEN) by integrating radiative and phase-change materials (PCMs) thermal buffering in heat-generating cooling. The leak PCMs avoided simple structure with three-dimensional (3D) interconnected cellular-like network layer on surface, 75% superior...

10.1021/acsami.2c13991 article EN ACS Applied Materials & Interfaces 2022-12-09

Semiconductor/metal complex hybrids are promising photocatalysts for CO2 reduction. A comprehensive mechanism investigation on charge dynamics was carried out a hybrid g-C3N4/[Co(bpy)3]2+ (bpy = 2,2′-bipyridine) photocatalytic system by using combination of in situ UV–vis and resonance Raman spectroscopies, electrochemistry, spectroelectrochemistry. singly reduced [Co(bpy)2]+ species binding to directly identified as an important intermediate. The excessive accumulation this transformed...

10.1021/acscatal.3c02945 article EN ACS Catalysis 2023-08-14

Recent experiments have indicated that employing nanostructures can enhance interfacial heat transport, but the mechanism by which different structural morphologies and dimensions contribute to full-spectrum phonon transport remains unclear. In this paper, a multiscale method study thermal transfer at nanostructured interfaces is developed combining density functional calculation, Monte Carlo simulation, diffuse mismatch method. The changes in paths contributions conductance of frequency...

10.1063/5.0243745 article EN cc-by Journal of Applied Physics 2025-02-10

10.1016/j.ijheatmasstransfer.2025.126902 article EN International Journal of Heat and Mass Transfer 2025-03-06

<div class="section abstract"><div class="htmlview paragraph">As the first pure electric flagship sedan under Geely Galaxy brand, a challenging aerodynamic target was set at early stage of E8 for reducing power consumption and improving vehicle range. In response, team formulated detailed development plan an overall drag reduction strategy. After conducting numerous loops simulations wind tunnel tests, along with continuous cross-disciplinary communication collaboration, product...

10.4271/2025-01-5020 article EN SAE technical papers on CD-ROM/SAE technical paper series 2025-03-27

Magnetic equivalent circuit (MEC) modeling is a challenging work to machines with novel structures, although it an effective tool in the design process. The parameterized dynamic MEC method developed this paper for analysis of rotor-segmented axial-field switched reluctance machine (RS-AFSRM). "parameterization" feature leading general models each interval rotor position, and "dynamic" characteristic depends on change flux patterns air region displacement. By proposed model, RS-AFSRM...

10.1109/tmag.2019.2901002 article EN IEEE Transactions on Magnetics 2019-03-19

Abstract The aqueous electrochemical CO 2 reduction to valuable products is seen as one of the most promising candidates achieve carbon neutrality yet still suffers from poor selectivity and lower current density. Highly efficient significantly relies on well‐constructed electrode realize stable triple‐phase contact , electrolyte, active sites. Herein, a interface engineering approach featuring combination hierarchical porous morphology design surface modification presented. A constructed by...

10.1002/advs.202204472 article EN Advanced Science 2022-09-01

In this work, benchmarking against the theoretical limit and water splitting was used to indicate promise of photovoltaic-powered electrochemical CO2 reduction. A benchmark device built by successful integration high-performance cathode, anode, membrane-electrode-assembly reactor dual-junction photoabsorber. This is first report on photoabsorber-driven electrolysis. We experimentally demonstrated a record-high solar-to-chemical energy conversion efficiency 21.3% projected 25.3%. performance...

10.1021/acsenergylett.2c02906 article EN ACS Energy Letters 2023-01-17

This article is devoted to the synergistic design of thermal management and signal integrity for 3-D integrated chips. The structure parameters micro-fin interconnected components are optimized obtain a balanced performance chip heat dissipation integrity. flows transfer model under action electrothermal coupling developed. A full-wave electromagnetic simulation interconnection proposed with same structural parameters. effects various factors on chips investigated. multiobjective...

10.1109/tcpmt.2022.3194598 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2022-07-28
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