A5021628010- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Copper Interconnects and Reliability
- Nanowire Synthesis and Applications
- Silicon Carbide Semiconductor Technologies
- Lipid Membrane Structure and Behavior
- Additive Manufacturing and 3D Printing Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Surface Polishing Techniques
- Advanced Sensor and Energy Harvesting Materials
- Metal Forming Simulation Techniques
- Thin-Film Transistor Technologies
- Mechanical Behavior of Composites
- Metal and Thin Film Mechanics
- Numerical methods in engineering
- Nanofabrication and Lithography Techniques
- Adhesion, Friction, and Surface Interactions
- Advanced MEMS and NEMS Technologies
- Seismic Imaging and Inversion Techniques
- Electromagnetic Compatibility and Noise Suppression
- Antimicrobial Peptides and Activities
- Supramolecular Self-Assembly in Materials
- Aluminum Alloy Microstructure Properties
National Tsing Hua University
2009-2025
Scripps (United States)
2024
Scripps Institution of Oceanography
2024
Institute of Law
2024
Taiwan Semiconductor Manufacturing Company (Taiwan)
2007-2021
Rice University
2008-2020
GGG (France)
2014-2018
National Chung Hsing University
2010-2017
Chung Yuan Christian University
1999-2016
Genomics Research Center, Academia Sinica
2015
CoFeB films were deposited on glass substrate by the sputtering method. From x-ray-diffraction and electron-diffraction-ring patterns, major phase in as-deposited film is amorphous (or nanocrystalline). However, we could also identify a minor CoFe(110) crystalline film. We have tried to suppress this changing Ar partial pressure (PAr) during deposition found that optimal condition PAr=5×10−3Torr. Because electrical resistivity value (ρ) of general larger than 100μΩcm, it indicates dominant....
To meet the requirements of low cost, thin vehicles, and multiple functions, fan-out panel-level packaging (FO-PLP) is introduced to be one next-generation technologies. However, warpage issue FO-PLP remains a critical concern during temperature cycling manufacturing processes. The utilization finite-element analysis (FEA) estimate address major mechanism warp-induced failure therefore crucial. Given that an increase in structural complexity follows advancement technological development,...
A fuzzy neural network (FNN) position controller is proposed to control the ultrasonic motor (USM) servo drive. The FNN trained on-line using delta adaptation law. Moreover, a new driving circuit for travelling-wave type (USM), which push–pull DC–DC power converter and two-phase series-resonant inverter combination, presented. First, structure, learning algorithm proof of convergence are described. Next, operating principles USM described in detail. Then, implemented drive reduce influence...
An adaptive backstepping controller is proposed to control the mover position of a linear induction motor (LIM) drive track periodic reference inputs in this study. First, feedback linearisation theory used decouple thrust force and flux amplitude LIM. Then, an integral-proportional (IP) designed according estimated plant model match prescribed step-command tracking specifications for LIM drive. Moreover, feedforward added IP system sinusoidal triangular inputs. Although theoretically can...
To determine the relevance of current crowding to electromigration in SnAg3.0Cu0.5 solder bump, a three-dimensional dual bumps simulation model was designed demonstrate how can enhance local atomic flux along electron flow path. The finding void formation occurred at entrance points cathode sides and enhancement growth clustering intermetallic compound outgoing anode path were verified experimentally. tilting effect is obvious anode/chip side. experimental mean-time-to-failure observed,...
Herein, we aim to develop a facile method for the fabrication of mechanical metamaterials from templated polymerization thermosets including phenolic and epoxy resins using self-assembled block copolymer, polystyrene–polydimethylsiloxane with tripod network (gyroid), tetrapod (diamond) structures, as templates. Nanoindentation studies on nanonetwork fabricated reveal enhanced energy dissipation intrinsic brittle due deliberate structuring; calculated gyroid is 0.23 nJ whereas one diamond...
Abstract This work presents a novel bottom‐up approach using template from self‐assembled block copolymer followed by selective etching for templated electrochemical deposition to fabricate well‐ordered nanonetwork Invar (Fe 64 Ni 36 ) thin film, giving exceptional mechanical properties as metamaterials. By utilizing pulse‐current deposition, it is feasible achieve complete pore‐filling the template, diamond‐structured with strut size of ≈20 nm that one‐order magnitude less than smallest...
Abstract This work analyses the overall stress/strain characteristic of flexible encapsulations with organic light-emitting diode (OLED) devices. A robust methodology composed a mechanical model multi-thin film under bending loads and related stress simulations based on nonlinear finite element analysis (FEA) is proposed, validated to be more reliable compared experimental data. With various geometrical combinations cover plate, stacked thin films plastic substrate, position neutral axis...
The 2009 influenza pandemic provided an opportunity to observe dynamic changes of the hemagglutinin (HA) and neuraminidase (NA) pH1N1 strains that spread in two metropolitan areas -Taipei Kaohsiung. We observed cumulative increases amino acid substitutions both HA NA were higher post–peak than pre-peak period epidemic. About 14.94% 3.44% 174 isolates had one acids changes, respective, four antigenic sites. One unique adaptive mutation HA2 (E374K) was first detected three weeks before...