A5103038686- Acoustic Wave Resonator Technologies
- Metal and Thin Film Mechanics
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Anodic Oxide Films and Nanostructures
- Electronic Packaging and Soldering Technologies
- Microfluidic and Bio-sensing Technologies
- Advanced Electron Microscopy Techniques and Applications
- Ultrasonics and Acoustic Wave Propagation
- Electron and X-Ray Spectroscopy Techniques
- Mechanical and Optical Resonators
- Underwater Acoustics Research
Leibniz Institute for Solid State and Materials Research
2008-2016
In this paper we show an improvement of the power durablity surface acoustic wave finger electrodes using a metallization layerstack based on Cu in combination with thin Al layers. We investigate sheet resistance at different annealing temperatures samples varying layer thicknesses up to 10 nm. The durability very has been increased by ≈ 2 dBm compared pure metallization. TEM investigation these also shows their thermal stability (after annealing) 450°C.
The temperature at the surface of acoustic wave (SAW) devices is a critical parameter not only for their design but also understanding failure mechanisms like acoustomigration. We report about contactless measurement method using Raman spectroscopy determination on interdigital transducers (IDTs) SAW test structures. A power load up to 3.5 W/mm2 an operating frequency 130 MHz was used generate travelling Rayleigh waves lithium niobate 128° YX substrate. Here, local between finger electrodes...