Because of the coefficient thermal expansion and hygroscopic swelling mismatches on plastic packaging materials, stress reliability issues microelectronic structures are extremely important for industry. Through self-design test chips with piezoresistive microstress sensors, this paper presents experimental methodologies monitoring typical ball-grid-array packaging. To end, coefficients sensors first calibrated, is next performed simultaneously loadings under steady-state cyclic...

This paper presents the realization of a flexible thermoelectric (TE) generator as textile fabric that converts human body heat into electrical energy for portable, low-power microelectronic products. In this study, an organic non-toxic conductive coating was used to dip rayon wipes TE fabrics so took advantage currents which were parallel temperature gradient. To end, dyed cloth first sewn unit. The unit then array create difference between and environment power harvesting. prototype...

In our previous works, the piezoresistive sensors have been demonstrated to be accurate and efficient tools for stress measurements in microelectronic packaging. this study, we first designed test chips with sensors, temperature as well heats, wafers were next manufactured through commercialized IC processes. Piezoresistive on silicon strips, which cut directly from at a specific angle, then calibrated, highly consistent coefficients extracted various wafer sites so that both normal shear...

Moisture is one of the major contributing factors in fracture and reliability issues for microelectronic packaging. To characterize moisture-induced stress distribution inside packaging structure, an <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">in situ</i> , quantitative, nondestructive experimental methodology needed. This paper proposes use piezoresistive sensors to measure a plastic low profile, fine pitch, ball grid array (LFBGA) The...

Stress measurements in microelectronic packaging through piezoresistive sensors take the advantage of both in-situ and nondestructive. In this study, test chips with p-type n-type stress sensors, as well a heat source, were first designed, then manufactured by commercialized foundry so that uniformity was expected. Both temperature calibrations next performed special designed MQFP (Metal Quad Flat Package) four-point bending (4PB) structure, respectively. Measurements stresses which are...

The equation for transversely varying thickness modes in doubly rotated quartz resonators is applied the analysis of contoured with rectangular electrodes. influence both contouring and continuity conditions at edges electrodes are included analysis. steady-state forced vibrations trapped energy treated a lumped parameter representation admittance, which valid vicinity resonance, obtained. Calculated results presented number shallow beveled contours.

The through silicon via (TSV) technology brings a key to 3D integration on wafer level packaging (WLP) by stacking chips generate direct electrical interconnecting paths. Most of the related literatures employed daisy chain test patterns measure continuity and evaluate single resistance. However, resistance is actually contact between two metal layers at bottom. In this paper, we developed new with suitable measurement methodologies several typical performance, including resistance, TSV...

In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more accurate, efficient. After comparing with previous work results, validity of aforementioned new has been demonstrated through experimental data. Since many accessory facilities employed in traditional calibrations become unnecessary, methodology takes great advantage coefficient extractions, especially at...

This paper first presents the architecture of a self-designed, slot-coupled patch antenna unit in glass-embedded fan-out package. Due to embedded glass, design flexible and radiation properties structure was improved by single or double-sided made redistribution layers (RDLs) on glass surfaces. The FOAiP is an extended application technology advanced electronics It provides ideal approach for millimeter-wave (mmWave) chip with low transmission loss chip-to-antenna interconnect greater...

Through Silicon Via (TSV) is the key technology for 2.5D and 3D packaging, but reliability evaluations on new products are limited because of complexity environmental issues. To this end, experiments self-design TSV samples under combinations several different variables were proposed performed in study. The Weibull distribution model was next employed analyses parameters each experimental results extracted. After analyzing parameters, factors that accelerate unreliability compared with...

Abstract Through-silicon via (TSV) is one of the key technologies on three-dimensional integration packaging. In this article, an experimental methodology with circuit models was proposed for electrical characteristic tests typical TSV structures. To end, self-developed test patterns such as chains, snake interconnections and Kelvin structures different dimensions were designed manufactured. Suitable measurement methodologies next employed to characterise element behaviours patterns. Based...

The contact resistance of microbumps in a plastic ball grid array packaging with through-silicon-via (TSV) structure was characterized. Accordingly, self-designed TSV daisy-chain circuit proposed to facilitate the formulation measurement paths, and test samples were made by using commercialized process simulate real product behaviors. Using single model complete for testing structure, about 25 mQ measured as average per microbump, each microbump separately extracted between 4 60 In addition,...

With the assistances from iteration methodology for heat dissipation property analyses and effective material properties relatively complex PCB structures, this paper extracts thermal resistance transient thermo-mechanical behaviors during reflow two compactable high power diode packaging through ANSYS software. After simulations, further improvements on structure designs were discussed according to temperature stress results.

The equation for transversely varying thickness modes in doubly-rotated quartz resonators is applied the analysis of contoured with rectangular electrodes. influence both contouring and continuity conditions at edges electrodes are included analysis. steady-state forced vibrations trapped energy treated a lumped parameter representation admittance, which valid vicinity resonance, obtained. Calculated results presented number shallow contours.< <ETX...

Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with piezoresistive sensors, diode temperature as well heaters were first designed, fabricated, calibrated. We next packaged the into low profile, fine pitch ball grid array (LFBGA) packaging 196 balls measured stresses After measuring induced under stable environmental rises, it was found that compressive...

In order to assess the reliability behavior of a typical TSV structure, this study describes tests qualify samples with three types test-keys, which includes Kelvin via-chain, and meander metal lines. With enough number for statistic analyses, resistances were first found increased after preconditioning process. The temperature cycling (TCT) humidity (THTC) next performed according JEDEC standards, variations on recorded during tests. Weibull parameters testing finally extracted from data...

This paper developed a new methodology which is sandwich-like platform to measure Seebeck coefficient for single layer thin-film thermoelectric devices are flexible and wearable without environmental limitation. With our apparatus, stably controlled temperature gradient environment created on test samples so that the commonly used simple probing can be employed measurements. finally verified accuracy availability of experimental design through measurements typical organic conductive material (PEDOT).

In this paper, we developed a multifunctional test chip for property extractions on packaging design. Components in include diodes as the temperature sensor; polysilicon units heater; piezoresistors stress and pads well related metal connector designs electrical parameter extractions. To save sensor numbers connecting wires, sensors surface were put according to structure symmetry. Since different microelectronic has individual size, components laid based assembly of small unit cells so that...

Through silicon via (TSV) is the key technology used in 2.5-D and 3-D packaging. Evaluating reliability of products using this new has been challenging because complex environmental factors. The aim paper was to design implement a systematic experiment test self-designed TSV samples under combinations several different variables. Weibull distribution model extract parameters from experimental data for statistical evaluation reliability. After analyzing parameters, stresses that accelerate...

It is well known that the CTE mismatch and hygroscopic swelling in a plastic packaging lead reliability issues so suitable extraction methodology on stress failure parameters are needed. To this end, we first designed made piezoresistive sensors for measurements performed sensor calibrations. Test chips were next packaged into typical measured. Finally, test was to extract long-term effects parameters. concluded from works about 50 MPa it significant packaging. also Weibull model PBGA...

Three-dimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for TSV designs. However, criteria used tests have not been consistent literature, so that criterion itself becomes argument. To this end, paper first performed several different on testing chains, then statistically analyzed experimental data failure resistance increasing, finally...

Thermal warpage creates during fan-out panel level package (FOPLP) manufacturing process and it may causes challenges on subsequent procedures. To this end, finite element analysis (FEA) with birth death techniques were performed in study to simulate warpages a typical RDL-first (redistribution layer first) FOPLP process, effective material property equations used simplify the complex RDL structure an (FO) packaging. identify optimal factorial combinations design parameters, Taguchi methods...

Flexible thermoelectric (TE) products that convert temperature difference into electrical energy can be used as textile materials to harvest human body heat power for portable, low-power microelectronic products. To this end, study investigated a newly developed electrospinning process producing flexible TE films. After electrospinning, properties of the test samples were extracted through self-developed measurement apparatus simple, accurate, and direct measurements. We then compared...