A5017333060- Thermal properties of materials
- Graphene research and applications
- Thermal Radiation and Cooling Technologies
- Advanced Thermoelectric Materials and Devices
- Advanced Sensor and Energy Harvesting Materials
- Dielectric materials and actuators
- Heat Transfer and Optimization
- Aerogels and thermal insulation
- Surface Modification and Superhydrophobicity
- Supercapacitor Materials and Fabrication
- Carbon Nanotubes in Composites
- Advanced Battery Materials and Technologies
- Hydrogels: synthesis, properties, applications
- Tribology and Wear Analysis
- Polymer Nanocomposite Synthesis and Irradiation
- Advanced ceramic materials synthesis
- Polymer Nanocomposites and Properties
- biodegradable polymer synthesis and properties
- Solar-Powered Water Purification Methods
- Advanced machining processes and optimization
- Calcium Carbonate Crystallization and Inhibition
- Polymer Foaming and Composites
- Electromagnetic wave absorption materials
- Polymer composites and self-healing
- Boron and Carbon Nanomaterials Research
Shenzhen Institutes of Advanced Technology
2015-2024
Chinese Academy of Sciences
2015-2024
Virginia Tech
2022-2024
First Affiliated Hospital of Soochow University
2024
Soochow University
2024
Chinese University of Hong Kong
2019-2022
University of Akron
2020-2021
Fuzhou University
2021
Chinese University of Hong Kong, Shenzhen
2020
University of Chinese Academy of Sciences
2014-2019
Owing to the growing heat removal issue of modern electronic devices, polymer composites with high thermal conductivity have drawn much attention in past few years. However, a traditional method enhance polymers by addition inorganic fillers usually creates composite not only limited but also other detrimental effects due large amount required. Here, novel are reported first constructing 3D boron nitride nanosheets (3D‐BNNS) network using ice‐templated approach and then infiltrating them...
With the current development of modern electronics toward miniaturization, high-degree integration and multifunctionalization, considerable heat is accumulated, which results in thermal failure or even explosion electronics. The conductivity materials has thus attracted much attention Although polymer composites with enhanced are expected to address this issue, achieving higher (above 10 W m-1 K-1) at filler loadings below 50.0 wt % remains challenging. Here, we report a nanocomposite...
In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composites through combination ice-templating self-assembly and infiltration methods. The polymer possess much higher thermal conductivity up to 4.42 W m-1 K-1 at relatively low loading 34 vol % than that random distribution (1.81 for epoxy/random 3D-BN composites, 1.16 BN composites) exhibit high glass transition temperature (178.9-229.2 °C) dimensional stability (22.7 ppm/K). We...
Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during past decade. However, conventional method improve through-plane of these usually yields an undesired value (below 3.0 Wm-1 K-1 ). Here, construction a 3D phonon skeleton is reported composed stacked boron nitride (BN) platelets reinforced reduced graphene oxide (rGO) for epoxy by combination ice-templated and...
Owing to the miniaturization of power electronics and development portable flexible devices, demands for highly thermally conductive, mechanically flexible, electrically insulating composites have substantially increased. However, conventional method improve thermal conductivity usually yields both an undesired value (usually below 10 W m–1 K–1) poor flexibility. Thus, a combination all desired properties together remains technical challenge. Bioinspired engineering offers great promise in...
Abstract Polymer composites with high thermal conductivity have recently attracted much attention, along the rapid development of electronic devices toward higher speed and performance. However, a common method to enhance polymer through an addition thermally conductive fillers usually cannot provide expected value, especially for requiring electrical insulation. Here, we show that polymeric silver nanoparticle-deposited boron nitride nanosheets as could effectively polymer, thanks bridging...
Efficient heat removal via thermal management materials has become one of the most critical challenges in development modern microelectronic devices. However, previously reported polymer composites exhibit limited enhancement conductivity, even when highly loaded with thermally conductive fillers, because lack efficient transfer pathways. Herein, we report vertically aligned and interconnected SiC nanowire (SiCNW) networks as fillers for composites, achieving significantly enhanced...
Inspired by the microstructures of naturally layered and highly oriented materials, such as natural nacre, we report a thermally conductive polymer composite that consists epoxy resin Al2O3 platelets deposited with silver nanoparticles (AgNPs). Owing to their unique two-dimensional structure, are stacked together via hot-pressing technique, resulting in brick-and-mortar which is similar one nacre. Moreover, AgNPs on surfaces act bridges link adjacent due reduced melting point AgNPs. As...
Polymer composites with high thermal conductivity have attracted much attention, along the rapid development of electronic devices toward higher speed and better performance. However, interfacial resistance between fillers matrix or has been one primary bottlenecks for effective conduction in polymer composites. Herein, we report on engineering structure silicon carbide nanowire/cellulose microcrystal paper by generating silver nanostructures. We show that nanoparticle-deposited nanowires as...
The rapid development of modern electronics and three-dimensional integration sets stringent requirements for efficient heat removal thermal-management materials to ensure the long lifetime electronics. However, conventional polymer composites that have been used widely as suffer from undesired thermal conductivity lower than 10 W m(-1) K(-1). In this work, we report a novel thermally conductive composite paper based on thought bioinspired engineering. advantage papers over lies in they...
Boron nitride nanotubes (BNNTs), structural analogues of carbon nanotubes, have attracted significant attention due to their superb thermal conductivity, wide bandgap, excellent hydrogen storage capacity, and chemical stability. Despite considerable progress in the preparation surface functionalization BNNTs, it remains a challenge assemble one-dimensional BNNTs into three-dimensional (3D) architectures (such as aerogels) for practical applications. Here, we report highly compressive BNNT...
Conventional polymer composites normally suffer from undesired thermal conductivity enhancement which has hampered the development of modern electronics as they face a stricter heat dissipating requirement. It is still challenging to achieve satisfactory with reasonable mechanical properties. Herein, we present three-dimensional (3D), lightweight, and mechanically strong boron nitride (BN)-silicon carbide (SiC) skeleton aligned pathways via combination ice-templated assembly high-temperature...
Boron nitride/graphene oxide hybrids prepared by an electrostatic self-assembly strategy were used as fillers for epoxy composites with high thermal conductivity.
The continuous evolution toward flexible electronics with mechanical robust property and restoring structure simultaneously places high demand on a set of polymeric material substrate. Herein, we describe composite composed polyurethane based Diels-Alder chemistry (PU-DA) covalently linked functionalized graphene nanosheets (FGNS), which shows infrared (IR) laser self-healing properties at ambient conditions is therefore suitable for substrate applications. strength can be tuned by varying...
With the rapid development of modern electronics toward miniaturization, high‐degree integration, and multifunctionalization, increased heat is generated during operation devices, which seriously limits performance, lifetime, reliability electronic devices. Polymer‐based composites with high thermal conductivity have attracted much attention in solving dissipation issue. However, conventional polymer‐based can hardly achieve a over 10 W m −1 K , due to interfacial resistance. Herein,...
Flexible dielectric papers based on biodegradable cellulose nanofibers and carbon nanotubes for energy storage are fabricated.
We disclose a simple and eco-friendly method to prepare carbon nanosheets (CNSs) by freeze-casting of lignin aqueous dispersion followed direct carbonization. These lignin-derived CNSs show high performances as electrodes in supercapacitors.
As modern electronics are developed towards miniaturisation, high-degree integration and intelligentisation, a large amount of heat will be generated during the operation devices. How to efficiently remove needless is becoming more crucial for lifetime performance electronic Many efforts have been made improve thermal conductivity polymer composites, which an important component electronics. Herein, authors report on preparation boron nitride micosphere/epoxy composites. The cross-plane...
The interfacial thermal resistance among boron nitride nanosheets are reduced by sintering silver nanoparticles deposited on surfaces, beneficial for the forming networks.