A5077950092- Advanced MEMS and NEMS Technologies
- Gas Sensing Nanomaterials and Sensors
- Advanced Sensor and Energy Harvesting Materials
- Advanced Sensor Technologies Research
- Electronic Packaging and Soldering Technologies
- Sensor Technology and Measurement Systems
- Advanced Measurement and Metrology Techniques
- 3D IC and TSV technologies
- Nanofabrication and Lithography Techniques
Xi'an Jiaotong University
2024
Silicon piezoresistive pressure sensors suffer from temperature effects significantly. The thermal compensation system based on surface fitting and wild horse algorithm is proposed to overcome the nonlinearity. polynomial coefficients in are optimized using algorithm. A platinum resistance thermometer (PRT) integrated silicon layer of sensor employed capture local variations. extracted changes fed via digital circuits. results calibration experiments show PRT has a maximum absolute error...
Abstract Hydraulic technology with smaller sizes and higher reliability trends, including fault prediction intelligent control, requires high-performance temperature pressure-integrated sensors. Current designs rely on planar wafer- or chip-level integration, which is limited by pressure range, chip size, low reliability. We propose a small-size temperature/high-pressure integrated sensor via the flip-chip technique. The units are arranged vertically, sensing signals of two into one plane...
Abstract The thin film temperature sensor chip is fabricated with the Ti/Pt layer on a silicon substrate by micro electromechanical systems technology. Using electron beam evaporation, 10 and 100 nm thick films layers are fabricated. Then, annealing experiments for carried out in air vacuum at 400 °C–800 °C. relationship between resistance of tested range −30 °C–150 °C studied based different conditions, its electrical characteristic parameters evaluated including coefficient (TCR),...