A5083848459- Copper Interconnects and Reliability
- Electronic Packaging and Soldering Technologies
- Metal and Thin Film Mechanics
- Semiconductor materials and devices
- Anodic Oxide Films and Nanostructures
- Gold and Silver Nanoparticles Synthesis and Applications
- Advanced Electron Microscopy Techniques and Applications
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and interfaces
- Aluminum Alloy Microstructure Properties
- ZnO doping and properties
- Plasmonic and Surface Plasmon Research
- Optical Coatings and Gratings
- Magnetic properties of thin films
- Diamond and Carbon-based Materials Research
- 3D IC and TSV technologies
- Electron and X-Ray Spectroscopy Techniques
- Force Microscopy Techniques and Applications
- Molecular Junctions and Nanostructures
- nanoparticles nucleation surface interactions
- Nanofabrication and Lithography Techniques
- Aluminum Alloys Composites Properties
- Metamaterials and Metasurfaces Applications
- Nanowire Synthesis and Applications
- Advanced Sensor and Energy Harvesting Materials
Northern Arizona University
2021-2024
Virginia Tech
2022
Autonomous University of San Luis Potosí
2018-2021
Interface (United States)
2021
St. Mary's University, Texas
2021
Knowles (United States)
2021
Flagstaff Medical Center
2021
The University of Texas at San Antonio
2014-2019
DePaul University
2014
University of Guam
2011
The behavior of electromigration-induced voids in narrow, unpassivated aluminum interconnects is examined, using scanning electron microscopy. Some electromigration tests were interrupted several times order to observe void nucleation, growth, and finally the failure conductor line. It found that which opened line have a specific asymmetric shape with respect flow direction. Besides nucleation changes can consume major part lifetime A first attempt model these processes on basis diffusion...
The COVID-19 pandemic demonstrated the critical need for accurate and rapid testing virus detection. This has generated a high number of new methods aimed at replacing RT-PCR, which is golden standard testing. Most techniques are based on biochemistry require chemicals that often expensive supply might become scarce in large crisis. In present paper we suggest use physics leverage novel nanomaterials. We demonstrate using Surface Enhanced Raman Spectroscopy (SERS) virion particles very...
We report a dual oxide layer as the active memory element of scalable nonvolatile cross-point technology. The resistance change is formed by conductive metal adjacent to an tunnel barrier. Varying as-deposited barrier thickness allows for control nominal current density and targeted meet cell requirements ultra high architecture. Excellent scaling program erase currents with electrode area continuous transition between state indicate that uniform rather than filamentary switching mechanism...
Evolution of surface structure during the growth sputter-deposited polycrystalline Al films is studied by means atomic force microscopy and dynamic scaling power spectral density image variography analyses. We incorporate effects grain based on quantitative measurements size, morphology, texture orientation through transmission electron x-ray diffraction pole figure measurements. Temporal regimes early smoothing followed roughening are explained grain-boundary grooves deposition. Three...
Quantitative roughness and microstructural analysis of as-deposited Al films, 0.1–1.0 μm thick, were performed by atomic force microscopy (AFM), one-dimensional power spectral density (1DPSD), transmission electron microscopy, x-ray pole figure methods. The variation grain size (d) with thickness (h) in the columnar grained film was d∝h0.9. initial crystallographic texture nearly random, a strong (111) fiber evolving ≈0.2 deposited thickness. AFM imaging revealed surface structure hillocks,...
Using off-axis electron holography under Lorentz microscopy conditions to experimentally determine the magnetization distribution in individual cobalt (Co) nanowires, and scanning precession-electron diffraction obtain their crystalline orientation phase map, allowed us directly visualize with high accuracy effect of crystallographic texture on nanowires. The influence grain boundaries disorientations magnetic structure is correlated basis micromagnetic analysis order establish detailed...
We report the morphology of electromigration induced transgranular slit-like voids in Al and Al-2% Cu thin-film interconnects with near bamboo microstructures. The grain structure surrounding fatal was determined from images produced by scanning electron focused ion beam microscopy. Fatal were seen to traverse grains to, but apart from, boundaries or triple points, often appear emanate small wedge-shaped at interconnect edge. volume slit are consistent an observed decrease void reduced...
Detailed transmission and scanning electron microscopic images of electromigration-induced open circuit failures are presented for fine line aluminum alloy thin film interconnects. A characteristic slit circuit, similar to stress migration circuits in narrow interconnects, is shown various compositions, processing, deposition conditions. It suggested that failure morphology more generally observed low (≊1) ratios conductor width grain size. The often occur near copper rich precipitates....
A correlation between local crystallographic texture and stress-induced void formation in tantalum-encapsulated, copper interconnects was revealed by electron backscattering diffraction studies a scanning microscope. Lines exhibiting an overall stronger 〈111〉 showed better resistance to formation. Furthermore, grains adjacent voids exhibited weaker than unvoided regions of the same line. The locally at voided locations suggests presence higher diffusivity, twist boundaries. This work, which...
The role of crystallographic texture in electromigration resistance interconnect lines is well documented. presence a strong (111) fiber results more reliable structure. It also generally accepted that grain-boundary diffusion the primary mechanism by which failures occur. has been difficult to this point, however, obtain statistically information structure these materials as transmission electron microscopy investigations are limited tedious specimen preparation and small,...
Tantalum encapsulated copper lines, 0.5–2.0 μm wide, were passivated and heat treated to determine the effect of stress state, microstructure, grain growth on stress-induced voiding. Void frequency location studied as a function linewidth treatment. Higher stress, narrow lines voided less than lower wider lines. Voiding was also strongly dependent upon thermal treatment before after passivation. These results are explained by defining preferred sites for void formation considering release...
A nanoparticle's shape and size determine its optical properties. Nanorods are nanoparticles that have double absorption bands associated to surface plasmon oscillations along their two main axes. In this work, we analize the response of gold nanorods with numerical simulations spectral measurements evaluate local field enhancement-which is key for surface-enhanced Raman spectroscopic (SERS) applications. Our experimental results in good agreement finite element method (FEM) nanoparticles....
In this work, we report the fabrication of self-assembled zinc oxide nanorods grown on pentagonal faces silver nanowires by using microwaves irradiation. The nanostructures resemble a hierarchal nanoantenna and were used to study far near field electrical metal-semiconductor behavior from radiation pattern resulting phase map reconstruction obtained off-axis electron holography. As comparison, use electric numerical approximations methods for finite number ZnO Ag show that intensities maps...
Electrically coupled quantum dots (QDs) can support unique optoelectronic properties arising from the superposition of single-particle excited states. Experimental methods for integrating colloidal QDs within same nano-object, however, have remained elusive to rational design. Here, we demonstrate a chemical strategy that allows assembling into composites, where proximal interactions give rise behavior. The assembly method employing "adhesive" surfactants was used fabricate both homogeneous...