A5049826951- Aluminum Alloys Composites Properties
- Advanced MEMS and NEMS Technologies
- Electrodeposition and Electroless Coatings
- Advanced Sensor and Energy Harvesting Materials
- Advanced ceramic materials synthesis
- Heat Transfer and Optimization
- Advanced Surface Polishing Techniques
- Heat Transfer and Boiling Studies
- Advanced materials and composites
- Mechanical and Optical Resonators
- Heat Transfer Mechanisms
- Semiconductor materials and interfaces
- Additive Manufacturing and 3D Printing Technologies
- Anodic Oxide Films and Nanostructures
- Nanofabrication and Lithography Techniques
- Optical Coatings and Gratings
- Electronic Packaging and Soldering Technologies
- Thermal properties of materials
- Analytical Chemistry and Sensors
- Epoxy Resin Curing Processes
- Muscle activation and electromyography studies
- Microstructure and mechanical properties
- Advanced Fiber Optic Sensors
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Transdermal Drug Delivery
Shanghai Institute of Technology
2020-2025
Shanghai Jiao Tong University
2017-2020
The hydrothermal performance of the microchannel heat sinks with different pin fins (PF-MCHS) is studied experimentally and numerically. Five fins, namely rectangular fin (RPF), backward triangular (BTPF), forward (FTPF), diamond (DPF) ellipsoidal (EPR) are integrated in for enhancing transfer. results show that PF-MCHSs possess 51.8-94.8% higher average Nusselt number than conventional (CMC) without which indicates these all can cause significant enhancement microchannels. Among finned...
As a transdermal drug delivery technology, microneedle array (MNA) has the characteristics of painless, minimally invasive, and precise dosage. This work discusses compares new MNA mold prepared by our group using MEMS technology. First, we introduced planar pattern-to-cross-section technology (PCT) method LIGA (Photolithography, Galvanogormung, Abformung) to obtain three-dimensional structure similar an X-ray mask pattern. On this basis, combined with polydimethylsiloxane (PDMS) transfer...
Abstract This paper presents a novel MEMS-based inertial microswitch design with multi-directional compact constraint structures for improving the shock-resistibility. Its shock-resistibility in reverse-sensitive direction to ultra-high g acceleration (~hunderds of thousands) is simulated and analyzed. The dynamic response process indicates that designed proof mass weight G , whole system’s stiffness k gap x 2 between reverse blocks have significant effect on MEMS micro-fabricated by surface...
Recently, a strategy of synthesizing SiC whisker-reinforced nickel (Ni/SiCw) composites with excellent mechanical properties by electrodeposition has been proposed for exploring its potential applications in micromechanical devices. In this paper, series external conditions that affected the content whiskers composite films were studied, such as cathode current density, stirring rate and electrolyte temperature. The experimental results indicated optimum morphology was obtained at speed 300...
In addition to being used for pattern transfer, the negative photoresist SU-8 is widely as a structural material in microelectromechanical systems (MEMS). Due its good photopatternability, has lower manufacturing costs than many other materials, but mechanical properties are relatively weak some extent, which limits performance. The of epoxy-like can be enhanced by adding micro- or nano-fillers such carbon nanotube, clay, and SiC nanowire, have superior elastic modulus. this study, nanowires...
With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered be one best candidates for future device radiators. However, at present, most these produced by high-temperature high-pressure processes, which expensive prone interfacial reactions. To explore plating solution system suitable...
Metal matrix composite materials with SiC whiskers are considered as the reinforcement for future electronic devices. However, today, these mostly produced at high temperature and pressure (HTHP) environments, procedures not only costly but may also alter microstructure. In order to explore an economically more viable approach of fabrication multilayer movable complicated microstructures, whiskers-reinforced nickel composites (Ni/SiCw) coatings were prepared by electrolytic co-deposition...
The microspring is a typical type of device in MEMS devices, with wide range application scenarios and demands, among which popular one the microelectroformed nickel-based planar prepared by UV-LIGA technology based on SU-8 adhesive. It worth noting that yield strength electrodeposited nickel microstructure low, toughness structure not high, unbeneficial for enduring stable operation spring. paper mainly presents methods preparing high-aspect-ratio Ni/SiCw microstructures devices technology,...
This paper presents an anodic oxidation treatment method for improving the adhesive strength between SU-8 photoresist and titanium substrate. The adhesion strengths were measured treated substrates by different techniques, which increased with enhancement of surface roughness thorny structures on It was found that approximately 86% through in 3.0 mol l−1 NaOH solution compared to Si wafer Additionally, influence UV dosage hard bake temperature examined substrates. effect, a range from 0.8...
High void content and delaminations are observed during the fabrication of thick carbon/phenolic composites due to high percentage volatile release which occurs polymerization. In order eliminate these imperfections enhance product quality for composites, smart sensors used monitor property changes processing control component minimize this effect. This paper describes a technique collect sensor data curing process general material system. Data obtained from generate an expert knowledge base...
This article presents a single-crystal piezoelectric energy harvester (PEH) with trapezoidal hollow hole that can obtain high density at low frequency. Harvesters structure were fabricated through series of manufacturing processes such as thermocompression bonding, screen printing and laser cutting. Finite element analysis (FEA) experimental results showed using modulus brass instead stainless steel the PEH substrate enhances voltage output device, design greatly increases overall stress...
Flow and heat transfer characteristics of a microchannel sink with different pin fins (PF-MCHS) are investigated experimentally numerically. Five including rectangular fin (RPF), forward triangular (FTPF), backward (BTPF), diamond (DPF) ellipsoidal (EPR) integrated in the for enhancing performance MCHS. The results show that they possess 32.1-94.8% higher average Nusselt number than conventional (CMC) without fins, which indicates can improve enhancement microchannels. Among all finned...
A novel micro heat sink structure (pin fins) integrated with high thermal conductive Cu-diamond composites via micromachining process is reported. The conductivity of are 450.21 W/m K reinforced 325/400 diamond and 614.87 140/170 diamond, respectively, stemming to the perfect interfaces between copper. As such, this work presents a promising approach synthesized material its application in microchannel pin fins.
To achieve better structural accuracy and aspect ratio, nano-gratings with a vertical angle close to 90° depth-to-width ratio of about 8 were prepared by synchrotron radiation. The optimal exposure dose development time determined be 0.006 (A·h) 6 min, respectively, observing the surface loss roughness gratings slit widths 150 nm 250 under different conditions. obtain desired rectangular grating structure, experimental conditions optimized help controlled variables method. With...
This paper studies an anodic oxidation method (AOM) for improving the adhesion strength between SU-8 photoresist and titanium substrate. The was increased by approximately 86% through treatment compared to Si wafer Moreover, further strengthened hard baking at 110°C its value up 71.64 MPa, which almost approaches breaking of polymer. high aspect ratio (24) micropillar arrays with 600 μm height were fabricated without any distortion, collapse delamination. treated substrate can also serve as...