A5004906212- Thermal properties of materials
- Thermography and Photoacoustic Techniques
- Ion-surface interactions and analysis
- Advanced Sensor Technologies Research
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Microstructure and Mechanical Properties of Steels
- Semiconductor materials and devices
- nanoparticles nucleation surface interactions
- Advanced Electron Microscopy Techniques and Applications
- GaN-based semiconductor devices and materials
- Calibration and Measurement Techniques
- Ultrasonics and Acoustic Wave Propagation
- Metal Alloys Wear and Properties
- Heat Transfer and Numerical Methods
- Aluminum Alloy Microstructure Properties
- Metallurgy and Material Forming
- Silicon and Solar Cell Technologies
- Adhesion, Friction, and Surface Interactions
- Refrigeration and Air Conditioning Technologies
- Numerical methods in engineering
- Medical Imaging Techniques and Applications
- Scientific Research and Discoveries
- Infrared Thermography in Medicine
- Photoacoustic and Ultrasonic Imaging
Sandia National Laboratories
2019-2025
Sandia National Laboratories California
2023
Apple (United States)
2022
University of California, Berkeley
2015-2019
University of Cambridge
2015
Purdue University West Lafayette
2015
University of Portsmouth
2015
National Institute of Standards and Technology
2015
Northeastern University
2015
North Carolina State University
2015
Bonding diamond to the back side of gallium nitride (GaN) electronics has been shown improve thermal management in lateral devices; however, engineering challenges remain with bonding process and characterizing bond quality for vertical device architectures. Here, integration these two materials is achieved by room-temperature compression centimeter-scale GaN a die via an intermetallic layer Ti/Au. Recent attempts at GaN/diamond have utilized modified surface activation (SAB) method, which...
3D integration of multiple microelectronic devices improves size, weight, and power while increasing the number interconnections between components. One method involves use metal bump bonds to connect components on a common interposer platform. Significant variations in coefficient thermal expansion such systems lead stresses that can cause thermomechanical electrical failures. More advanced characterization failure analysis techniques are necessary assess bond quality Frequency domain...
Abstract Heterogeneous integration of microelectronic components provides a pathway to improve circuit/component performance; however, this comes with assembly challenges, in particular due complex interfaces via subsurface bump bonds. The ability these bonds transmit electrical signals and conduct heat the carrier substrate limits component performance. In work, hyperspectral frequency‐domain thermoreflectance (FDTR) imaging is demonstrated as robust technique for evaluating quality indium...
K-means clustering analysis is applied to frequency-domain thermoreflectance (FDTR) hyperspectral image data rapidly screen the spatial distribution of thermophysical properties at material interfaces. Performing FDTR while raster scanning a sample consisting 8.6 μm doped-silicon (Si) bonded doped-Si substrate identifies variation in subsurface bond quality. Routine thermal select pixels quantifies this quality and allows assignment bonded, partially unbonded regions. same routine across...
Abstract There is an urgent need for sensors deployed during focal therapies to inform treatment planning and in vivo monitoring thin tissues. Specifically, the measurement of thermal properties, cooling surface contact, tissue thickness, blood flow phase change with mm sub accuracy are needed. As a proof principle, we demonstrate that micro-thermal sensor based on supported “ 3ω ” technique can achieve this vitro under idealized conditions 0.5 2 thick tissues relevant cryoablation pulmonary...
A method is developed to calculate the length into a sample which Frequency Domain Thermoreflectance (FDTR) measurement sensitive. Sensing depth and sensing radius are defined as limiting cases for spherically spreading FDTR measurement. finite element model measurements in COMSOL multiphysics used silicon dioxide samples variety of frequencies laser spot sizes. The compared experimental measurements. Design recommendations thickness made experiments where semi-infinite desirable. For using...
A technique has been developed to track a moving phase front using the electrothermal 3ω method and demonstrated by tracking location of boundary between air dielectric oil. fine wire sensor (diameter 10 µm, length 30 mm) is suspended in oil excited at four frequencies simultaneously gain more thermal information than single-frequency approach. Measurements are compared camera images verify their accuracy. For slow velocities which approximate quasistatic operation, oil-air determined from...
Abstract Advancements in microelectronics necessitate novel failure analysis techniques sensitive to the specific physics. Thermo-mechanical is a well-known issue heterogeneously integrated microelectronics, which often requires destructive identify. Here, we demonstrate thermo-mechanical heat response (T-MeHR) as non-destructive method combines pump-probe thermoreflectance with optical interferometry. In particular, are able map subsurface defects silicon-silicon direct bonded system and...
Journal Article Focused Ion Beam Nano-thermometry Get access Julia I Deitz, Deitz Sandia National Laboratories, Albuquerque, NM, United States Corresponding author: jdeitz@sandia.gov Search for other works by this author on: Oxford Academic Google Scholar Timothy J Ruggles, Ruggles Samantha G Rosenberg, Rosenberg Mila N Lam, Lam Luis Jauregui, Jauregui John Williard, Williard Daniel L Perry, Perry Joseph Boro, Boro Wyatt Hodges Microscopy and Microanalysis, Volume 29, Issue Supplement_1, 1...