A5026250753- Analytical Chemistry and Sensors
- Acoustic Wave Resonator Technologies
- Advanced biosensing and bioanalysis techniques
- Advanced Memory and Neural Computing
- Single-cell and spatial transcriptomics
- Semiconductor materials and devices
- Gas Sensing Nanomaterials and Sensors
- Electrochemical Analysis and Applications
- Health, Environment, Cognitive Aging
Imperial College London
2016-2018
Institute of Biomedical Science
2016
This paper gives an overview of how CMOS design methods can be applied to ion-sensitive field effect transistor (ISFETs) for pH-based DNA methylation and miRNA detection. Design specifications are fundamentally defined by the choice analysis. As such, focus was on developing front-end analogue circuits carry out Methylation-specific PCR (MSP) Point-of-Care applications, sequencing detailed The use MSP prompted ISFET weak inversion current mirror topology differential sensing reduction drift...
This paper presents an ISFET sensor pair configured as a traditional MOSFET current mirror. The circuit provides differential pH sensing suitable for DNA detection that requires two or more samples with drift and temperature compensation thermal cycling. mirror fabricated in unmodified CMOS process gives exponential response to the bias trapped charge gain. Operating subthreshold region, sensitivity of 27.4mV/pH is achieved common cancellation 0.8nA/min reduced 0.25nA/° C.
This paper presents an ISFET-based front-end to detect DNA homopolymerisms in ion-semiconductor sequencing. is realised using a novel switched current integrator which provides discrete output levels proportional the number of nucleotides incorporated by integrating signals from polymerase reactions real time. The response maintained for noise comparable input signal at 0.01pH peak peak. proposed circuit has gain 2.4μA/pH, σ ± 50nA 5Hz sampling frequency and 1μA bias current.
In this paper, we report a method to improve sensitivity for CMOS ISFET arrays using Reactive Ion Etching (RIE) as post-processing technique. The process etches away the passivation layers of commercial process, an oxygen (O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) and sulfur hexafluoride (SF xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> plasma. resulting attenuation pH are characterised five dies etched 0 15 minutes,...