The combination of atomic force microscopy and Kelvin probe technology is a powerful tool to obtain high-resolution maps the surface potential distribution on conducting nonconducting samples. However, resolution contrast transfer this method have not been fully understood, so far. To better quantitative understanding, we introduce model which correlates measured with actual distribution, compare numerical simulations three-dimensional tip–specimen experimental data from test structures....

We demonstrate the patterned assembly of integrated semiconductor devices onto planar, flexible, and curved substrates on basis capillary interactions involving liquid solder. The presented patterned, solder-coated areas that acted both as receptors for components device during its electrical connections operation. were suspended in water agitated gently. Minimization free energy solder-water interface provided driving force assembly. One hundred thirteen GaAlAs light-emitting diodes with a...

Thin-film electrets have been patterned with trapped charge submicrometer resolution using a flexible, electrically conductive electrode. A poly(dimethylsiloxane) stamp, in bas-relief and supporting an 80-nanometer-thick gold film, is brought into contact film of poly(methylmethacrylate) supported on n-doped silicon. voltage pulse between the silicon transfers at areas polymer electret. Areas as large 1 square centimeter were charges better than 150 nanometers less 20 seconds. This process...

An electrical junction formed by mechanical contact between two self-assembled monolayers (SAMs)a SAM from an dialkyl disulfide with a covalently linked tetracyanoquinodimethane group that is supported silver (or gold) and alkanethiolate mercuryrectifies current. The precursor to the on was bis(20-(2-((2,5-cyclohexadiene-1,4-diylidene)dimalonitrile))decyl)) for mercury HS(CH2)n-1CH3 (n = 14, 16, 18). properties of junctions were characterized current−voltage measurements. ratio conductivity...

We discuss practical aspects of Kelvin probe force microscopy (KFM) which are important to obtain stable images the electric surface potential distribution at high spatial resolution (<100 nm) and sensitivity (<1 mV) on conducting nonconducting samples. compare metal-coated semiconducting tips with respect their suitability for KFM. Components metal coating can become detached during scanning, introducing sudden offset jumps in maps (typically up 350 mV between adjacent scan...

Abstract Conventional rigid electronic systems use a number of metallization layers to route all necessary connections and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions prepare stretchable are typically confined single layer. Crossovers vertical interconnect accesses remain challenging; consequently, no reliable (SPCB) method has established. This article reports an industry compatible SPCB manufacturing that...

This paper demonstrates the application of projection photolithography, using a standard commercial microscope, for generation masters soft lithography. The procedure is rapid and convenient produces features smaller in size (as small as 0.6 μm) than those available from other methods prototyping, albeit over limited area (∼4 × 104 μm2 per exposure). A transparency photomask (prepared high-resolution printing) inserted into light path microscope projected through objective onto...

Nanoparticles have been self-assembled using a novel technique described as nanoxerography (see cover). A method has developed by the authors to pattern charge with 100 nm resolution. These patterns act "receptors" for nanoparticles Figure), enabling directed self-assembly of from powder, gas phase (aerosol), and liquid (suspension).

This paper introduces a method for self-assembling and electrically connecting small (20–60 micrometer) semiconductor chiplets at predetermined locations on flexible substrates with high speed (62500 chips/45 s), accuracy (0.9 micrometer, 0.14°), yield (> 98%). The process takes place the triple interface between silicone oil, water, penetrating solder-patterned substrate. assembly is driven by stepwise reduction of interfacial free energy where chips are first collected preoriented an...

We demonstrate the fabrication of packaged microsystems that contain active semiconductor devices and passive components by using a directed self-assembly technique. The is accomplished combining geometrical shape recognition with site-specific binding involving liquid solder. Microfabricated matching complementary shapes, circuits, solder-coated areas were suspended in ethylene glycol agitated turbulent flow to initiate self-assembly. Microsystems obtained sequentially adding different...

This article reports a new integration approach to produce arrays of ZnO microcrystals for optoelectronic and photovoltaic applications. Demonstrated applications are n-ZnO/p-GaN heterojunction LEDs cells. The process uses an oxygen plasma treatment in combination with photoresist pattern on magnesium doped GaN substrates define narrow sub-100 nm width nucleation region. Nucleation is followed by lateral epitaxial overgrowth producing single crystal disks desired size over 2 in. wafers....

High entropy alloy films of AlCoCrFeNi B2-ordered structure are formed during an ultrafast heating process by reactive Ni/Al multilayers. The self-propagating high-temperature reaction occurring in multilayers after ignition represents heat source which is used for the transformation a thin Al/CoFe/CrNi multilayer into single-phase high film. materials design combined thus determines phase formation. Conventional rapid thermal annealing transforms film with multiple equilibrium phases....

This paper introduces a biomimetic strategy for the fabrication of asymmetrical, three-dimensional electronic devices modeled on folding chain polypeptide structural motifs into globular protein. Millimeter-size polyhedra—patterned with logic devices, wires, and solder dots—were connected in linear string by using flexible wire. On self-assembly, folded spontaneously two domains: one functioned as ring oscillator, other shift register. example demonstrates that principles design...

We have developed a directed self-assembly process for the fabrication of three-dimensional (3D) microsystems that contain non-identical parts and statistical model relates yield to parameters. The uses geometric-shape recognition identify different components, surface tension between liquid solder metal-coated areas form mechanical electrical connections. concept is used realize self-packaging subunits. To enable realization more than two subunits, sequential introduced, similar formation...

This paper reports on a programmable reconfigurable self-assembly (PRS) process to enable heterogeneous integration of components nonplanar substrates. The proposed makes use solder-based receptors that can be activated electrically. Metal contacts segmented semiconductor devices bind liquid-solder-based-receptors substrate during the fluidic self-assembly. Programmability is implemented using switched "ON" and "OFF" integrated heaters. We have evaluated feasibility PRS concept through...

Various nanostructured sensor designs currently aim to achieve or claim single molecular detection by a reduction of the active size. However, size has negative effect reducing capture probability considering diffusion-based analyte transport commonly used. Here we introduce and apply localized programmable electrodynamic precipitation concept as an alternative diffusion. The process provides higher collection rates airborne species at lower concentration. As example, compare identical...

A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization the (>99% yield) based on identification, calculation, and relevant forces. As an application, production solid-state lighting panel discussed, involving novel approach to apply conductive layer through lamination.

The human body is a dynamic three-dimensional soft entity. Metal lines in commercially available electronic devices are mechanically flexible yet insufficiently deformable, enabling rigid circuits with excellent characteristics but limited compliance to mechanical stress. Future electronics need be independent of components adapt anatomical movements. Recent interest elastic printed circuit boards (E-PCB) has been enhanced by their potential applications skin electronics, implant...

Abstract This communication demonstrates fluidic self‐assembly and self‐alignment of flip‐chips applying magnetic field force for chip agitation single angular orientation. The receptor solder bumps are Pb‐free electroplated core core‐shell metal layers with tailored transformation imprinted melting points. While the capturing step takes place on low‐melting shell Bi 33.7 In 66.3 (72 °C) Cu‐pad, high‐melting tin as well non‐capturing Cu‐pad remains solid. provided a nickel bar top agitated...

The combination of atomic force microscopy (AFM) and Kelvin probe technology is a powerful tool to obtain high-resolution maps the electric surface potential distribution on conducting non-conducting samples. We show that composite metal films semiconductors clear chemical contrast can be used differentiate between different materials with lateral resolution few 10 nm. Because AFM tips are not point-like structures, we establish simple model correlate measured quantities true distribution,...

This letter reports on the electrostatic driven self-assembly of nanoparticles onto charged surface areas (receptors) from gas phase for nanoparticle based device fabrication. The were generated by a parallel technique that uses flexible, conductive electrode to pattern electrons and holes in thin film electret. Samples, 1 cm2 size, patterned with charge 10 s 100 nm scale resolution. Charge receptors, nm×100 contained ∼100 elementary charges. A transparent particle assembly module was...

This article reports on a new charging process and Coulomb-force-directed assembly of nanoparticles onto charged surface areas with sub-100-nm resolution. The is accomplished using flexible nanostructured thin silicon electrode. Electrical nanocontacts have been created as small 50 nm by placing the electrode an electret surface. used to inject charge into sized areas. Nanoparticles were assembled patterns, lateral resolution 60 has observed for first time. A comparison nanoparticle patterns...

The self-assembly and packaging of integrated semiconductor device segments have been accomplished by combining geometrical shape recognition with site specific wetting binding involving liquid solder. Components complementary shapes were fabricated to recognize encapsulate functional devices. components suspended in water agitated using a pulsating flow. Two hundred AlGaN∕GaN light-emitting diodes chip size 380×330 micrometers assembled packaged yield 95% 2min. procedure forms electrical...