A5068056086- 3D IC and TSV technologies
- Advanced Materials and Mechanics
- Modular Robots and Swarm Intelligence
- Electrical and Thermal Properties of Materials
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
- Microfluidic and Bio-sensing Technologies
- Micro and Nano Robotics
- Quantum Information and Cryptography
- Biosensors and Analytical Detection
- Advanced Sensor and Energy Harvesting Materials
- Electrowetting and Microfluidic Technologies
- Quantum Mechanics and Applications
- Air Quality Monitoring and Forecasting
- Electronic Packaging and Soldering Technologies
- Analytical Chemistry and Sensors
- Photonic Crystals and Applications
- Quantum optics and atomic interactions
Technische Universität Ilmenau
2018-2025
Abstract This communication demonstrates fluidic self‐assembly and self‐alignment of flip‐chips applying magnetic field force for chip agitation single angular orientation. The receptor solder bumps are Pb‐free electroplated core core‐shell metal layers with tailored transformation imprinted melting points. While the capturing step takes place on low‐melting shell Bi 33.7 In 66.3 (72 °C) Cu‐pad, high‐melting tin as well non‐capturing Cu‐pad remains solid. provided a nickel bar top agitated...
We demonstrate the realization of core–shell transformation-imprinted solder bumps to enable low-temperature chip assembly, while providing a route high-temperature interconnects through transformation. The reported bump uses lower melting point BiIn-based shell and higher Sn core in initial stage. fluidic self-assembly self-alignment at relatively low temperatures (60–80 °C). use high surface free energy liquid during capture freely suspended Si dies inside heated (80 °C) water bath,...
Abstract This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The is lead free ternary system, which provides route to transform the point interconnects for applications in directed self-assembly. outermost metal layers form low Bi 33.7 In 66.3 shell (72 °C). enables and self-alignment freely water suspended Si-dies at relatively temperature (75 °C) leading well-ordered chip...
We present an ultra-compact, hybrid faint pulse source (FPS) at 850 nm, making use of a linear eight VCSELs array spectral (<1 pm wavelength difference, and >90% overlap FWHM) temporal ps) indistinguishability, as well polarization quality in the four H/V/D/A BB84 channels >20 dB. A common VCSEL on single substrate is used, pitch 250 μm with integrated polarizers, having indistinguishability if temperature levelled < 0.5 K. Each represents either or full amplitude signal for protocol. The...
Glass as substrate or interposer material is gaining more and interest due to its thin film compatibility thus high-density integration capability. Multilayer stacks for processor packaging applications can be achieved by laminating Ajinomoto build-up (ABF) on glass substrates. Some glasses exhibit very frequency stable dielectric properties low losses which makes substrates also favorable microwave applications. Moreover, in contrast silicon material, materials are cheaper, they processed...
Materials with high RF performance are in increasing demand due to the needs of modern telecommunications. Glass and low-temperature co-fired ceramics (LTCCs) both interesting candidates for design complex signal transmission systems. can be processed large panels, has suitable structure dimensions silicon processing, but its multilayer capability is limited. LTCC a mature technology assemblies, conductor line resolution restricted by need use screen printing technology. The approach...
This publication introduces a new interposer made from thin glass substrate and multilayer LTCC compound. Combination of these two material classes into an enables the application thin-film thick-film technology in one substrate. In this study <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathbf{100}-\mathbf{200}\ \boldsymbol{\mu} \mathbf{m})$</tex> Borosilicate AF45® is applied. The includes through vias, filled with Au-paste to provide...