A5058402818- Antenna Design and Analysis
- Antenna Design and Optimization
- Advanced Antenna and Metasurface Technologies
- Radio Frequency Integrated Circuit Design
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Millimeter-Wave Propagation and Modeling
- Microwave Engineering and Waveguides
Kukdong Communication (South Korea)
2020
Abstract In this paper, we develop a low‐cost manufacturing technology for RF substrate and high‐performance process integrated passive devices by electrochemically forming thick oxide on Si wafer processing Cu metal BCB. Several such as LPF, BPF, balun are fabricated using they show good performance in spite of their small chip size. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 37: 49–52, 2003; Published online InterScience ( www.interscience.wiley.com ). DOI 10.1002/mop.10821
To achieve cost and size reduction, we developed low manufacturing technology for RF substrate high performance passive process IPDs (Integrated Passive Devices). The fabricated is conventional 6" Si wafer with SiO/sub 2/ thickness of 25 /spl mu/m on the surface. This showed very good insertion loss 0.03 dB/mm at 4 GHz, including conductive metal loss, in case 50/spl Omega/ coplanar transmission line (W = 50 mu/m, G 20 mu/m). Using BCB (Benzo Cyclo Butene) interlayer 10 Cu plating process,...
We herein present a study on the active phased array antenna for receiving satellite broadcasting that can electrically align its polarization to of target transmitters in moving condition or Skew angle arrangement receiver. Hence, we have developed an structure composed self-developed Vivaldi and multifunction core (MFC) chip, RF front end module, control units. In particular, new designed Ku-band 10.7–14.5 GHz receive one desired mode such as horizontal vertical by means MFC chip other...
5G wireless communication, there is two frequency bands: sub-6 (3.5GHz) and mmWave (26GHz, 28GHz 39GHz). Although mainly used in the demand on of consumer growing according to increasing amount data. However, systems operating at range have manage with much higher signal losses then range. Moreover, physical size interconnections (chip chip, chip antenna) becomes comparable wavelength. Therefore, new packaging technology required corresponding Antenna integrated RF using FOWLP has been...
This paper is a study of 6~18 GHz wideband high power amplifier which composed 10 single and coaxial type spatial combiner. The property this combiner on similar principle to antipodal antenna radiation mechanism. Therefore, the key structure proposed finline PCB board curve shape numerically synthesized by using Klopfensein's optimum impedance taper. measured CW output combined nearly 50 W. In conclusion we prove good combining performance between over frequency ranges. Also, developed...
In this study, we demonstrate the results of a 64-array active phased antenna for radar wind profiler. The main part, array antenna, had form bent dipole with improved isolation from adjacent antenna. Based on system parameter analysis, 64 transmit/receive modules(TRMs) were designed. particular, TRMs have function phase/attenuation control, which plays key role in Measurement 20° beam steering angle electronic showed proper gain, good beamwidth characteristics, and excellent radiation...