A5005107422- Advancements in Photolithography Techniques
- Analytical Chemistry and Sensors
- Integrated Circuits and Semiconductor Failure Analysis
- Gas Sensing Nanomaterials and Sensors
- Carbon Nanotubes in Composites
- CCD and CMOS Imaging Sensors
- Mechanical Behavior of Composites
- 3D IC and TSV technologies
- Advanced Chemical Sensor Technologies
- Surface Roughness and Optical Measurements
- Industrial Vision Systems and Defect Detection
- Natural Fiber Reinforced Composites
- Advanced Battery Technologies Research
- Advanced Biosensing Techniques and Applications
- Scientific Research and Discoveries
- Supercapacitor Materials and Fabrication
- Experimental and Theoretical Physics Studies
- Collagen: Extraction and Characterization
- Analog and Mixed-Signal Circuit Design
- Corneal surgery and disorders
- Ocular Surface and Contact Lens
- Electronic Packaging and Soldering Technologies
- Infrared Target Detection Methodologies
- Bone Tissue Engineering Materials
- Fiber-reinforced polymer composites
Johns Hopkins University Applied Physics Laboratory
2012-2024
Johns Hopkins University
2015
Infineon Technologies (United States)
2004
National Institute of Standards
2001
National Institute of Standards and Technology
2000-2001
Using a combination of electronic structure calculations, molecular dynamics simulations, and finite-element analysis, we examine the physical mechanisms governing performance Kevlar®/carbon composite fibers over variety length scales. To begin, use calculations to Kevlar polymers, quantitatively compare intramolecular interactions non-bonded intermolecular interactions. We then quantify potential energy landscape between fit this data function for in simulations. From calculate stiffness...
Some form of edge bead removal (EBR) is one the standard requirements for a lithographic process. Without any intervention, resist may accumulate at wafer up to several times nominal thickness resist. In addition this bead, likely wrap around contaminating backside as well. It's needless say that such condition would present significant contamination risk not only track and exposure tool but process equipment outside lithography Two necessarily exclusive strategies have been used in past...
Significant financial benefits are realized by reducing the wafer edge exclusion to gain additional productive chips as well enhance yield of former edge-most region wafer. Challenges discussed and cost-effective solutions provided for major unit process integration issues such plasma-etch induced blocked/distorted pattern, image displacement, interlayer misalignment, lithography coating patterning, pattern-density-dependent CMP Etch non-uniformity, scribe readability, shared-driver shorts.
As line widths approach 90nm node in volume production, post exposure bake (PEB) uniformity becomes a much larger component of the across wafer critical dimension (CDU). In need for PEB plate matching has led to novel solutions such as specific dose offsets. This type correction does not help CDU. Due unequal activation energies processes, any thermal history difference can result corresponding CD variation. The rise time resist target temperature been shown affect CD, with most being first...
Abstract Fiber batteries are essential for the realization of high‐performance wearable and textile electronics with desirable features conventional textiles, including breathability, stretchability, washability. However, development fiber is limited by scalability performance since most reported fabrication techniques not compatible standard battery manufacturing. This work presents a novel method scalable stacked design analogous to that pouch cells using layer lamination laser machining....
Conductometric gas microsensors offer the benefits of ppm-level sensitivity, real-time data, simple interfacing to electronics hardware, and low power consumption. The type device we have been exploring consists a sensor film deposited on "microhotplate"- 100 micron platform with built-in heating (to activate reactions sensing surface) thermometry. We using combinatorial studies 36-element arrays characterize relationship between composition, operating temperature, response, as measured by...
Unmanned aerial vehicles (UAVs) and smart munitions require low-cost IR sensors that fit within very small volumes, yet offer acceptable performance landing/launch survivability. The LWIR band provides unique contrast for specific applications in both UAVs munitions, with presenting an additional challenge of high g-loads during launch. These are not typically a design target low-cost, un-cooled commercial off the shelf (COTS) sensors. This work addresses challenges adapting COTS imager...
Operating in dynamic lighting conditions and greatly varying backgrounds is challenging. Current paints state-ofthe- art passive adaptive coatings (e.g. photochromics) are not suitable for multi- environment situations. A semi-active, low power, skin needed that can adapt its reflective properties based on the background to minimize contrast through development incorporation of pigment materials. Electrofluidic skins a display technology electronic ink paper applications. The similar E Ink...
Scatterometry is currently being used in lithography production as an inline metrology tool to monitor wafer processing and detect excursions. One well-documented excursion the process variation caused by differences resist batches. This paper describes use of Tokyo Electron Limited's integrated Optical Digital Profilometry (iODP<sup>TM</sup>) scatterometry system variations batch changes. was able a significant shift sidewall angle (SWA) on incoming that undetected primary at time, scanning...
The economics of semiconductor manufacturing have forced process engineers to develop techniques increase wafer yield. Improvements in controls and uniformities all areas the fab reduced film thickness variations at very edge surface. This improved uniformity has provided opportunity consider decreasing exclusions, now outermost extents must be considered yield model expectations. These changes increased requirements on lithography improve printability that previously were not even coated....
Conductometric gas microsensors offer the benefits of ppm-level sensitivity, real-time data, simple interfacing to electronics hardware, and low power consumption. The type device we have been exploring consists a sensor film deposited on microhotplate- 100 micron platform with built-in heating (to activate reactions sensing surface) thermometry. We using combinatorial studies 36-element arrays characterize relationship between composition, operating temperature, response, as measured by...