Yuhua Chen

ORCID: 0000-0003-3218-1304
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About
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Research Areas
  • Advanced Optical Network Technologies
  • Optical Network Technologies
  • Interconnection Networks and Systems
  • Advanced Welding Techniques Analysis
  • Welding Techniques and Residual Stresses
  • Quantum Computing Algorithms and Architecture
  • Additive Manufacturing Materials and Processes
  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Quantum Information and Cryptography
  • Additive Manufacturing and 3D Printing Technologies
  • High Entropy Alloys Studies
  • High-Temperature Coating Behaviors
  • Coal Properties and Utilization
  • Aluminum Alloys Composites Properties
  • Quantum Mechanics and Applications
  • Wireless Sensor Networks and IoT
  • Metallic Glasses and Amorphous Alloys
  • Atmospheric and Environmental Gas Dynamics
  • Advanced materials and composites
  • Advanced Sensor and Energy Harvesting Materials
  • Hydrocarbon exploration and reservoir analysis
  • Neural Networks and Applications
  • Aluminum Alloy Microstructure Properties
  • Geoscience and Mining Technology

University of Houston
2013-2025

META Health
2025

Yunnan Normal University
2024

National Science and Technology Center for Disaster Reduction
2024

Chongqing Medical University
2024

Nanchang Hangkong University
2011-2023

China University of Mining and Technology
2008-2023

Beihang University
2022-2023

Beijing Institute of Big Data Research
2023

Chang Gung University
2022

Abstract While it is well known that flow aids such as fumed silica can be added to improve flowability and fluidizability of cohesive powders, the improvements observed depend on how are blended together with powders. In this work, dry particle coating used deposit a very small amount nano‐sized particles (as low 0.01 wt %) high degree precision onto surface cohesive, Geldart Group C powders make them fluidize like A model taking into account effect size guest host area coverage (SAC)...

10.1002/aic.11368 article EN AIChE Journal 2007-12-04

In order to suppress the formation of Fe-Ti IMCs in NiTi SMA/304 SS laser-welded joint and improve properties joint. this study, dissimilar alloys joints with without CoCrFeNiMn high entropy alloy interlayer were obtained by micro laser welding process. The effect on microstructure was investigated systematically. Results showed that addition HEA significantly reduced brittle intermetallic compounds (IMCs) such as FeTi phase. promotes (Fe,Ni) solid solution phase, therefor, is composed small...

10.1016/j.jmrt.2022.03.022 article EN cc-by Journal of Materials Research and Technology 2022-03-09

10.1016/s1003-6326(11)61174-6 article EN Transactions of Nonferrous Metals Society of China 2012-02-01

A novel ultrasonic vibration assisted (UVA) wire arc additive manufacturing (WAAM) was used to fabricate Cu-8Al-2Ni-2Fe-2Mn alloy in this study. The effect of different interpass temperatures with and without on the microstructural evolution mechanical properties fabricated part were investigated by optical microscope (OM), scanning electron (SEM), transmission (TEM), nanoindentation, tensile testing. results showed that reduction temperature UVA treatment cannot prevent columnar dendrites...

10.3390/met10020215 article EN cc-by Metals 2020-02-03

We introduce a modular reduction method that is optimized for hardware and outperforms conventional approaches. By leveraging calculated cycles combinatorial logic, we achieve remarkable 30% in power usage, 27% Configurable Logic Blocks (CLBs), 42% fewer look-up tables (LUTs) than the implementation. Our Hardware-Optimized Modular Reduction (HOM-R) system can condense 256-bit input to four-bit base within single 250 MHz clock cycle. Further, our stands out from prevalent techniques, such as...

10.3390/electronics14030550 article EN Electronics 2025-01-29

Optical burst switching (OBS) is an emerging technology that allows variable size data bursts to be transported directly over dense wavelength division multiplexing links. In order make OBS a viable solution, the burst-scheduling algorithms need able utilize available wavelengths efficiently, while being operate fast enough keep up with incoming rate. For example, for 16-port router 64 per link, each operating at 10 Gb/s, we process one request every 78 ns in support average length of 100...

10.1109/jlt.2007.899785 article EN Journal of Lightwave Technology 2007-08-01

A facile methodology is presented to construct a multifunctional nanocomposite that integrates photothermal therapy and specific drug release into single nanostructure. Firstly, magnetic Fe3O4@polydopamine core-shell nanoparticles (Fe3O4@PDA) were synthesized via reversed-phase microemulsion approach. By varying the amount of DA, Fe3O4@PDA with particle size 28-38 nm can be obtained. To further ensure monodispersity, biocompatibility uptake, PEG lactobionic acid (LA) grafted onto...

10.1039/c7dt04080f article EN Dalton Transactions 2018-01-01

10.1016/j.apm.2010.07.004 article EN publisher-specific-oa Applied Mathematical Modelling 2010-07-16

Field-Programmable Gate Arrays (FPGAs) are relatively high-end devices that not easily shared between multiple users. In this work, we achieved a remotely accessible FPGA framework using Internet of Things (IoT) approaches. We sought to develop method for students receive the same level educational quality in remote environment they would typical, in-person course structure university-level digital design course. Keeping cost mind, able combine functionality an entry-level and Raspberry Pi...

10.3390/electronics10182229 article EN Electronics 2021-09-11

Ultrasonic welding (UW) of carbon fiber reinforced polyamide 66 (CF/PA 66) composite is a very promising process for assembly automobile component. Simulation the temperature distribution and weld growth in UW remains difficulty issue. In this study, high frequency sensor equipped welder to collect real-time horn vibration during UW. Then applied on tip integrated into finite element model Abaqus. The simulation results are validated with experimental tests evolution CF/PA 66. Results showed...

10.1016/j.jmrt.2023.11.062 article EN cc-by Journal of Materials Research and Technology 2023-11-01

As the demands for high-density, high-speed, high-performance, and multi-function in portable electronic products, packaging technologies require significant improvement to bring out ICs' performance shrink total module or package size. One representative technology is embed active devices into an organic substrate by sequential build-up processes, example, chip-in-polymer IZM, bumpless layer Intel, chip-in-substrate (CiSP) EOL/ITRI. Through embedding semiconductor chip substrate, with very...

10.1109/ectc.2006.1645666 article EN 2006-07-10
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