Seung-yeon Lee

ORCID: 0000-0003-3812-0246
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About
Contact & Profiles
Research Areas
  • Magnetic properties of thin films
  • Catalytic Processes in Materials Science
  • Advanced Data Storage Technologies
  • Advancements in Semiconductor Devices and Circuit Design
  • Catalysis and Oxidation Reactions
  • Electrocatalysts for Energy Conversion
  • Ferroelectric and Negative Capacitance Devices
  • Physics of Superconductivity and Magnetism
  • Magnetic Properties and Applications
  • Electromagnetic Simulation and Numerical Methods
  • Electronic Packaging and Soldering Technologies
  • Injection Molding Process and Properties
  • 3D IC and TSV technologies
  • Gold and Silver Nanoparticles Synthesis and Applications
  • Magneto-Optical Properties and Applications
  • Calibration and Measurement Techniques
  • Electric Vehicles and Infrastructure
  • Phase-change materials and chalcogenides
  • Electric Motor Design and Analysis
  • Semiconductor materials and devices
  • earthquake and tectonic studies
  • Advanced Chemical Physics Studies
  • Hybrid Renewable Energy Systems
  • Carbon and Quantum Dots Applications
  • Advanced Battery Technologies Research

University of Suwon
2021-2024

University of Delaware
2021-2023

Center for Innovation
2021-2023

Texas A&M University
2019

Mitchell Institute
2019

Ewha Womans University
2005-2008

Atomically dispersed late transition-metal catalysts on supports have demonstrated unexpectedly high activity and selectivity compared to metal clusters, attributed the unique electronic properties determined by metal–support interface presence of promoters that modify local environment single-atom site. Through cooperativity synergism, these structures provide a fertile ground for catalyst discovery. Understanding materials at atomic scale how tune their will be key designing novel...

10.1021/acscatal.1c00705 article EN ACS Catalysis 2021-07-15

The investigation of interconnection technologies is crucial for advancing semiconductor packaging technology. This study delved into the various methods achieving electrical interconnections, focusing on sintering process and composition epoxy. Although silver (Ag) has traditionally been utilized in process, its high cost often precludes widespread commercial applications. Copper (Cu) a promising alternative that offers advantages, such as cost-effectiveness thermal conductivities. However,...

10.3390/polym16030398 article EN Polymers 2024-01-31

Magnetoresistive random access memory (MRAM) using a magnetic tunnel junction (MTJ) cell has the potential to revolutionize both high-density and high-speed applications with devices exhibiting non-volatility good write endurance. This work presents macromodel for an MTJ that is applicable HSPICE circuit simulator. The realized as five-terminal subcircuit reproduces characteristics of including hysteresis asteroid curves thermal variation, R – V characteristics.

10.1143/jjap.44.2696 article EN Japanese Journal of Applied Physics 2005-04-01

A magnetic tunnel junction (MTJ) element can compute Boolean functions and also store the output of its last operation. Therefore, MTJ shows potential for a universal logic to implement sequential-logic as well combinatorial ones. The established magneto-logic has been designed fabricated based on triple-layer MTJ. We present novel structure that consists single-layer current driver, which requires less processing steps with enhanced functional flexibility uniformity.

10.1109/ted.2007.900683 article EN IEEE Transactions on Electron Devices 2007-08-01

Microneedles (MNs) are a new system of effective drug delivery that create micron-sized pathways to the epidermis or upper dermis regions skin. In this study, we developed coated-type microneedles for direct hispidin Hispidin is well-known plant-derived antioxidant component showing antitumor, anti-inflammatory, antiallergic, antiangiogenic, antioxidant, hypoglycemic, hypolipidemic, and immunomodulatory activities. Polymeric blends polylactic acid (PLA) polycaprolactone (PCL) were casted as...

10.3390/app11062774 article EN cc-by Applied Sciences 2021-03-19

Devices in the developing semiconductor market require high density, integration, and detailed processing. Conventional wire bonding is inappropriate for fine-sized devices, connected wires can be damaged by heat generation external physical impact. Soldering also used advanced packaging technologies. However, disturbances overhead joints occur during bonding. Thus, sintering has been extensively utilized to overcome these drawbacks. Sintering pastes are pressurized bonded, resulting stable...

10.1021/acsomega.3c04245 article EN cc-by-nc-nd ACS Omega 2023-10-12

The main challenges in developing zeolites as cosmetic drug delivery systems are their cytotoxicities and the formation of drug-loading pore structures. In this study, Au-decorated zeolite nanocomposites were synthesized an epidermal system. Thus, 50 nm-sized Au nanoparticles successfully deposited on 13X (super cage (α) sodalite (β) structures) using Turkevich method. Various drugs, such niacinamide, sulforaphane, adenosine, loaded under vitro vivo observations. exhibited effective...

10.3390/jfb14020066 article EN cc-by Journal of Functional Biomaterials 2023-01-26

Magnetologic using magnetic tunnel junction (MTJ) elements is one of the most promising logic technologies owing to its ease integration and non-volatility. A magnetologic structure consisting a single-layer MTJ current driver has been proposed by same authors, which can provide enhanced functional flexibility uniformity while requiring fewer fabrication steps. In this study, various merits are fully exploited for design reconfigurable device. 3-bit counter presented, be programmed operate...

10.1143/jjap.47.3264 article EN Japanese Journal of Applied Physics 2008-04-01
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