A5100408215- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Aluminum Alloy Microstructure Properties
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Microstructure and mechanical properties
- High-Temperature Coating Behaviors
- Intermetallics and Advanced Alloy Properties
- Advanced materials and composites
- Semiconductor materials and interfaces
- Advanced Antenna and Metasurface Technologies
- Metal Forming Simulation Techniques
- Metal and Thin Film Mechanics
- Antenna Design and Analysis
- Electromagnetic wave absorption materials
- Photoacoustic and Ultrasonic Imaging
- Metamaterials and Metasurfaces Applications
- Shape Memory Alloy Transformations
- Aeroelasticity and Vibration Control
- Additive Manufacturing and 3D Printing Technologies
- Composite Structure Analysis and Optimization
- Advanced Fluorescence Microscopy Techniques
- Structural Behavior of Reinforced Concrete
- Integrated Circuits and Semiconductor Failure Analysis
- Machine Learning in Materials Science
China Academy of Space Technology
2015-2025
Guilin University of Electronic Technology
2019-2024
Beijing Institute of Technology
2024
Hunan Normal University
2023-2024
Beijing University of Chemical Technology
2024
Changsha Normal University
2024
Shanghai Institute of Measurement and Testing Technology
2023
China General Nuclear Power Corporation (China)
2023
University of Florida
2023
Hebei University of Science and Technology
2022-2023
One of the technical bottlenecks traditional laser-induced breakdown spectroscopy (LIBS) is difficulty in quantitative detection caused by matrix effect. To troubleshoot this problem, paper investigated a combination time-resolved LIBS and convolutional neural networks (CNNs) to improve K determination soil. The contained information both wavelength time dimension. spectra dimension showed characteristic emission lines elements, those presented plasma decay trend. one-dimensional data...
An extended crack band model is presented to simulate the damaging behavior in fiber-reinforced composite laminates. The makes characteristic length of finite element and bandwidth independent each other, effectively relieving mesh dependency. It avoids problem big elements causing a snap-back at local constitutive level. dissipated energy per unit volume no longer affected by length, which solves excessive longitudinal fracture toughness. present was applied an open-hole tension test,...
Conspectus The development of more efficient and accurate ways to represent reactive potential energy surfaces is a requirement for extending the simulation large systems complex systems, longer-time dynamical processes, complete statistical mechanical sampling. One way treat by direct dynamics fragment methods. Another fitting system-specific analytic functions with methods adapted systems. Here we consider both approaches. First three that allow given monomer appear in than one fragment....
This paper is concerned with the H∞ filtering problem for a class of continuous-time linear switched systems asynchronous behaviours, where 'asynchronous' means that switching filters to be designed has lag system modes. By using Lyapunov-like functions and average dwell time technique, sufficient condition obtained guarantee asymptotic stability weighted performance index error system. Moreover, results are formulated in form matrix inequalities numerical feasible. As result, filter design...
This research focuses on developing high-fidelity experimental and numerical models to analyze microscale underfill dynamics void formation in high-density flip-chip packaging. Three underfilling scenarios are investigated, namely, point type, I-shaped line L-type type. The point-type validates the model against results, while line-type explore grid independence, formation, critical parameters such as filling position, contact angle, liquid viscosity. Results indicate that angle viscosity...
The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 100 μm) increasing current density (from 6.0 × 10 3 to 1.1 4 A/cm 2 ) were investigated systematically. results reveal that the life decreases density, while decreasing height joints. location shifts from matrix interface between intermetallic compound (IMC) layer for those 500 μm in which interfacial is triggered by crowding...
To explore AC-DBD's ability in controlling dynamic stall, a practical SC-1095 airfoil of helicopter was selected, and systematic wind tunnel experiments were carried out through direct aerodynamic measurements. The effectiveness stall control under steady unsteady actuation is verified. influence parameters such as constant voltage, pulsed frequency duty ratio on effect studied the flow condition k = 0.15 above airfoil, corresponding mechanism discussed. Steady can effectively reduce...
The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 A/cm2) at various test temperatures (25 °C, 55 85 115 145 175 °C) were investigated systematically. Shear strength increases initially, then decreases a temperature no more than °C; the enhancement effect stressing on finally diminishes temperatures. These changes are mainly due counteraction athermal Joule...
The phase formation-transition process and microstructure evolution of Fe–3%Si steel oxide layers were systematically studied during the high-temperature oxidation with oxidizing atmosphere when annealed at 1000–1240 °C for 200 min. micromorphology, mechanism crystal structure stability characterized discussed combining XRD, FESEM XPS technology. oxidized scale shows more complex multiple including single layer, double three increasing annealing temperature, which attributes to diffusion...
Purpose The purpose of this paper is to investigate the effect stand‐off height (SOH) on microstructure and mechanical behaviour solder joints in high density interconnection. Design/methodology/approach Cu/Sn/Cu with 100, 50, 20 10 μ m SOH are prepared using a reflow process. microstructures compositions observed analyzed by scanning electron microscopy. Tensile testing carried out properties joints. Findings has significant thickness intermetallic compound (IMC) decreases reducing SOH;...
Abstract:
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga alloy shows high application potential as packaging material for high-power devices. In this work, the evolution of microstructure, shear strength fracture mechanism Au–30Ga/Ni joint during soldering aging was studied. It found that increase time, Ga seriously consumed to form Ga–Ni interfacial intermetallic compounds (IMCs), resulting in formation Ga-poor region near interface layer....