A5103208885- Electronic Packaging and Soldering Technologies
- Advanced Welding Techniques Analysis
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- Aluminum Alloy Microstructure Properties
- Intermetallics and Advanced Alloy Properties
- Adhesion, Friction, and Surface Interactions
- Tribology and Lubrication Engineering
- Metallurgical Processes and Thermodynamics
- Metallic Glasses and Amorphous Alloys
- Semiconductor materials and interfaces
- Metallurgical and Alloy Processes
- Gear and Bearing Dynamics Analysis
- Hydrogen embrittlement and corrosion behaviors in metals
- Metal Alloys Wear and Properties
- Advanced materials and composites
- Electrodeposition and Electroless Coatings
- Electromagnetic Compatibility and Noise Suppression
- Material Properties and Failure Mechanisms
- High Entropy Alloys Studies
- Advanced Surface Polishing Techniques
- Metal Forming Simulation Techniques
- High-Temperature Coating Behaviors
- Welding Techniques and Residual Stresses
- Fatigue and fracture mechanics
Zhengzhou Institute of Machinery
2012-2024
State Key Laboratory of Advanced Brazing Filler Metals and Technology
2012-2024
Tsinghua University
2024
Harbin Institute of Technology
2020
Northwestern Polytechnical University
2020
Xi'an University of Architecture and Technology
2020
In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6SiC/Cu solder under isothermal aging (50, 100, 150, 200 250 h) thermal cycling (300, 600, 900, 1200 1500 cycles) were studied. The results manifested that IMC layer got thicker in as time or cycles increased, but thickness Sn incorporated with silicon carbide nanowires (SiC NWs) was smaller than same condition. According to adsorption theory, SiC NWs would adsorb on grains then reduce surface tension IMC,...
With the miniaturization of solder joints and deterioration serving environment, much effort had been taken to improve properties Sn-based lead-free solders. And fabrication composite alloys by addition nanoparticles is one effective ways enhance properties. In this paper, recent research progress on reviewed summarizing relevant results in representative ones Sn-Ag-Cu (SAC), Sn-Bi, other multielement alloys. Specifically speaking, effect added evolution wettability, microstructure...
This study analyzes the influence of different ultrasonic amplitudes on microstructure composition, microhardness, tensile strength, and corrosion resistance Al alloy/steel laser welding-brazing joints assisted by vibration. The application vibration did not change composition but refined them. were all composed θ-Fe(Al, Si)3 τ5-Al7.2Fe1.8Si formed at interface reaction zone, as well an α-Al solid solution Al-Si eutectic phase generated in weld seam zone. Meanwhile, thickness IMCs decreased...
Abstract In this article, environmental friendly BAg25Cu40Zn34Sn (BAg-25) and BAg30Cu37Zn32Sn (BAg-30) flux-core solder metal capable of facilitating automatic production brazing manufacturing processes were prepared. The butt lap induction tests carried out on the substrate with BAg-25 BAg-30. Wettability, microstructure mechanical properties solders base studied by field emission scanning electron microscope (SEM-EDS), backscattering diffraction (EBSD), tensile testing machine...
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga alloy shows high application potential as packaging material for high-power devices. In this work, the evolution of microstructure, shear strength fracture mechanism Au–30Ga/Ni joint during soldering aging was studied. It found that increase time, Ga seriously consumed to form Ga–Ni interfacial intermetallic compounds (IMCs), resulting in formation Ga-poor region near interface layer....
In order to address the issues of excessive brittle intermetallic compounds (IMC) formation in TC4 brazed joints, two types novel Ti-Zr-Cu-Ni-Sn amorphous braze fillers were designed. The microstructure and shear strength TC4/Ti-Zr-Ni-Cu-Sn/TC4 joints studied by scanning electron microscopy (SEM), transmission (TEM), X-ray diffractometer (XRD) electronic universal materials testing machine. results show that optimized Ti
Frictional vibration often occurs during sliding, commonly referred to as the stick-slip phenomenon. It is more likely occur in range of Stribeck curve, where friction and velocity have negative gradient characteristics. In this study, ultrasonic applied metal/metal sliding pair which reduce both static kinetic forces. The inhibition mechanism on phenomenon investigated for a moving at low velocities (0.05–1.0 mm/s) under condition dry oil lubrication. Under friction, reduces slider's force...
Purpose The purpose of this paper is to improve the properties Sn−9Zn solder, so as meet requirements industrial applications. Design/methodology/approach effects Praseodymium on property and Sn whisker growth under aging treatment in lead‐free solder were investigated. Findings results indicate that with addition rare earth Pr, wettability mechanical improved. best comprehensive soldered joint obtained when content Pr 0.08 wt.%. After at 150°C for 360 h, Sn−9Zn−0.08Pr decreased but are...
Zn-2 wt%Al alloy with micro-addition of Ag (0–1.5 wt%) was fabricated into as-cast and wire-shaped. The effect addition on microstructures investigated through SEM/EDS, XRD DSC technology. Then the damp-heat corrosion experiment carried out wire-shaped alloy. And influence characteristics further studied XRD, hardness test weighting method. results showed that coarsened both primary η-Zn dendrites eutectic lamellar β-ZnAl in Furthermore, during plastic deformation process to obtain alloy,...
The effect of sulphur on the microstructure and properties Ag45–Cu30–Zn25 brazing filler metal was investigated. Under given experimental conditions, sulphuration products mainly consisted CuS, ZnS, Ag2S, Cu2S Ag3CuS2. These sulphides not only distributed surface but also diffused into interior cut apart matrix thereby significantly damaging tensile strength from 658 to 283 MPa. corresponding fracture characterisation turned ductile brittle fracture. existed as solid particles, which hinder...
Purpose This paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle provide theoretical support in field electronic packaging. Design/methodology/approach In this study, nickel nanoparticles (Ni NPs) were doped into as a reinforcing agent prepare composite solder. The wettability solder, melting characteristics alloy, microstructure joints, mechanical and intermetallics growth at interface investigated. Findings Test results show that had little substantial...