A5008625228- Environmental Impact and Sustainability
- Energy, Environment, Economic Growth
- Fiscal Policy and Economic Growth
- Synthesis and Biological Evaluation
- Economic and Environmental Valuation
- Synthesis and Characterization of Heterocyclic Compounds
- Semiconductor Quantum Structures and Devices
- Climate Change Policy and Economics
- Semiconductor materials and devices
- Superconducting and THz Device Technology
- Sustainable Industrial Ecology
- Copper Interconnects and Reliability
- Sustainable Supply Chain Management
- Physics of Superconductivity and Magnetism
- Synthesis and biological activity
- Metal and Thin Film Mechanics
Jimei University
2024-2025
Henan University
2024
Abstract Based on the perspective of fiscal decentralization, study focuses 30 provinces in China and employs various econometric models including threshold model, spatial mediation regulation model. The research findings indicate that decentralization has a double‐threshold effect government intervention, market mechanisms, regional carbon emission reduction. Both intervention mechanisms have inhibiting effects emission, with significant coefficients GOVI MARM at 1% level. cooperation...
ABSTRACT The green park serves as a significant spatial carrier for China's strategy to become manufacturing powerhouse and promote industrial transformation upgrading. It is crucial platform implementing driving the development of manufacturing, promoting harmonious coexistence between man nature in current era. main focus this study total 249 parks announced by Ministry Industry Information Technology, it employs multi‐time point PSM‐DID method investigate 280 prefecture‐level cities....
Using an in-situ, self-aligned deposition scheme, arrays of variable length SNS junctions in the range 0.05μm to 1 μm have been fabricated. Arrays microbridges lead-copper and niobium-copper fabricated using this technique used study dependence, at constant temperature, critical current I <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> bridge resistance R xmlns:xlink="http://www.w3.org/1999/xlink">d</inf> . For bridges with lengths L...
Different processes, including "cool" physical vapor deposition (PVD), of Ta barrier and Cu seed were compared in interconnect development. In the cool process, substrate temperature was <50°C, to a about >100°C standard process. With via resistance (0.19 μm size) reduced by 25%, although 40% thicker measured at bottom. This not agreement with common understanding that film is, higher resistance. Blank studies suggested mixed texture α- β-Ta formed bottom new Ta/Cu X-ray diffraction spectra...