A5066773912- Advanced Sensor and Energy Harvesting Materials
- Nanomaterials and Printing Technologies
- 3D IC and TSV technologies
- Additive Manufacturing and 3D Printing Technologies
- Electronic Packaging and Soldering Technologies
- Conducting polymers and applications
- Muscle activation and electromyography studies
- COVID-19 Pandemic Impacts
- RFID technology advancements
- Advanced Materials and Mechanics
- Antenna Design and Optimization
- Transportation Planning and Optimization
- Ferroelectric and Negative Capacitance Devices
- Photonic and Optical Devices
- ZnO doping and properties
- Ferroelectric and Piezoelectric Materials
- Consumer Retail Behavior Studies
- Semiconductor Lasers and Optical Devices
- Modular Robots and Swarm Intelligence
- Advanced MEMS and NEMS Technologies
- Food Supply Chain Traceability
- Catalytic Processes in Materials Science
- Supply Chain Resilience and Risk Management
- Silicon Carbide Semiconductor Technologies
- Electric Vehicles and Infrastructure
Binghamton University
2022-2025
Additive manufacturing of conductive interconnects has become essential in the electronic industry due to requirements having smaller components with high performance and producing functional electronics that meet applications demand. Thus, fabricating lines patches is key reduce challenges mechanical thermal reliability associated advanced technologies. In this work, high-resolution were fabricated by aerosol jet printing (AJP) across different substrates using a novel particle-free silver...
Printed electronics techniques are increasingly utilized for device fabrication, particularly in flexible electronics. This study investigates the performance trade-offs associated with additive printed methods and materials, focusing on antenna gain. A dual-band dipole antenna, operating at 2.4 GHz 4.6 GHz, was designed using ANSYS High-Frequency Structure Simulator (HFSS), silver as conductive material 5mil (125 μm) Kapton substrate. Three sets of antennas, each different materials...
Additive manufacturing or direct write printing is an attractive way to fabricate electronics due potentially lower cost, volume production, fast turnout, and less generated waste. RF microstrip line are vital components in signal transfer communication many healthcare, biomedical, IoT applications. In this research, novel lines were designed fabricated using the aerosol jet printer (AJP) dispensing system (DS) on flexible substrates with two different inks that aimed study impact of...
High temperature electronics face obvious challenges in terms of high endurance, a wide range thermal cycling, and fabrication processes. A recent paper demonstrated the stability 3D printed ceramic substrates with gold up to 850°C. The present work addresses approaches interconnection silicon die such substrates. After screening materials used metallize based on adhesion capability handling temperatures, three methods were successfully developed: surface mounting, embedding, flip-chip...
Stretchable wearable electronics often require integrating mechanically different materials to fabricate functional devices that are stretchable, conformal, and sufficiently reliable. Common methods integrate highly stretchable conductors with other Flexible Hybrid Electronics (FHE) components include solder isotropic/anisotropic conductive adhesives or films. Due the nature of conductors/substrate, each those has its limitations in devices. A magnetically aligned Anisotropic Conductive...
Traditional device packaging becomes a limiting factor in realizing the full performance potential of SiC. Thus, improved and advanced technologies are required to bridge gap between SiC devices' their applications. An additively printed electronics approach can enable power module interconnections. Printed being increasingly explored realm manufacturing, such as flexible hybrid electronics, they have found way into various aspects. However, for high-power high-performance is largely...
Stretchable electronic devices are hybrid in nature, comprised of soft and rigid components. Robust reliable electrical interconnections that accommodate semiconductors, communications, sensor components on an otherwise flexible circuit necessary to ensure the proper functionality device. Magnetically aligned anisotropic conductive epoxy (ACE) takes advantage magnetically induced self-assembly Z-axis wires a durable matrix is optimized suit applications. ACE interconnect technology was...
One advantage of flexible hybrid electronics (FHE) compared to traditional rigid electronic circuits is their ability maintain electrical functionality despite repeated mechanical bending and twisting deformations. This characteristic allows conventional devices be re-engineered into FHE format for use in new applications. Conductor flexibility these enabled, part, by the printable metal-polymer composite inks that remain after curing. In this regard, are especially well suited sensing...
Individuals requiring frequent urinary catheterization are especially prone to developing Catheter-Associated Urinary Tract Infections (CAUTI's). This is true for individuals with Spinal Cord Injury or Disease (SCI/D) due their need and inability experience tract irritation pain that often the indicators of infections. Medically relevant data assessment health may include parameters such as bladder temperature, internal pressure, urine pH, catheter insertion shear forces, detection leukocyte...
This work reports the fabrication and testing of a conformal soft dry electrode for Electrocardiogram (ECG) monitoring to address limitations associated with traditional gel electrodes. Gel electrodes are gold standard bio-signal capturing, but they come challenges like skin preparation, drying out, irritation. The developed material is anisotropic conductive rubber. process involves screen printing Ag paste on substrate create lead set, stencil-printing design at top end, finally embedding...
Accurate demand forecasting plays a critical role in most furniture businesses’ operational, tactical, and strategic decisions, as the business is considered seasonal becomes more complex crises. In this work, neural network model using Long Short-Term Memory (LSTM) method was developed to forecast for specific product groups. LSTM leading deep learning time series prediction, particularly seasonal, multi-item, non-linear situations. The used predict based on old data before...
Electronic skins (e-skins) are widely used in wearables, robotics, and medical field. In this paper we introduce a fabrication characterization of bio-inspired robot electronic skin, with multiparameter sensing capabilities that include detection changes temperature, locomotion sensi-worm robot. Soft robotics has gained much attention recent years due to its stretchability conformability reaching confined areas uneven surfaces. robots enabled by advances flexible hybrid electronics (FHE)...
Conductors are a basic component in any flexible hybrid electronic device. Their electromechanical reliability has been studied, yet very few studies report their thermoelectric behavior. We the current carrying capacity of an inkjet-printed nano-silver interconnects on mesoporous PET substrate. For this study, printed approximately 100 μm wide, with two different thicknesses: single layer (~650 nm thick) and double (~1 thick). Samples were sintered parameters oven laser sintering. The...
Wearable vital sign monitoring (VSM) devices are becoming an integral part of healthcare delivery systems to ensure continuous patient and improve care efficiency. Flexible hybrid electronics (FHE) technology offers great potential develop low-cost, reliable, user-friendly VSM with clinical accuracy. multilayer leads components that affect the overall system reliability a device. Inferior cannot overcome effects triboelectric noise mechanical stresses on signal quality may fail under...
In this study, commercially available stretchable hybrid conductors including silver flakes in an elastomeric matrix were screen printed on thermoplastic polyurethane (TPU) followed by encapsulation via the dielectric. Test vehicles include straight and serpentine lines with various thicknesses wavelengths, respectively. Metrology was also performed to assess line thickness, width, variability. The modular force stage (MFS) used characterize initiation propagation of microcracks. results...
Meshing of conventional PCB grounds refers to a process in which certain ground planes appear as copper lattices; regular openings are placed at intervals. The need for meshing rigid PCBs has become minor with the development micro-etching approaches. However, flexible hybrid electronics, meshed could offer some benefits, such being unsusceptible bending and conserving material time. In this paper, we study how affect RF performance straight microstrip lines. Simulations show more than 50%...
Wearable medical devices have revolutionized continuous health monitoring, offering real-time data collection and enhanced patient care. Among the crucial components, electrode leads significantly influence bio-signal fidelity. However, their sustainability affordability, especially as single-use items, pose notable challenges due to environmental concerns cost implications. Screen-printed multilayer Single-Use Electrode Leads (SUEL) fabricated from environmentally friendly cellulose-based...
As electronic devices and their internal components have become more advanced, conventional computer memory technologies – which are a key component of all electronics struggled to fully keep up with this advancement. Meeting the demands in modern requires zero-sum game approach optimizing several, often competing performance benchmark criteria. Resistive random-access (RRAM) is an emerging nonvolatile (NVM) technology great appeal due its ease fabrication, low programming voltage, fast...
The demand for advanced, high-performance radio frequency (RF) systems continues to rise in a wide range of applications, and embedded packaging is becoming critical enabler high-density electronics. Traditional RF technologies are manufactured using various wafer fabrication lines, have input/output (IO) pad metallization types, and/or designed probe station testing. As result, it often challenging integrate these devices into more complex module on single substrate high-fidelity,...