Printed electronics techniques are increasingly utilized for device fabrication, particularly in flexible electronics. This study investigates the performance trade-offs associated with additive printed methods and materials, focusing on antenna gain. A dual-band dipole antenna, operating at 2.4 GHz 4.6 GHz, was designed using ANSYS High-Frequency Structure Simulator (HFSS), silver as conductive material 5mil (125 μm) Kapton substrate. Three sets of antennas, each different materials...

Additive manufacturing or direct write printing is an attractive way to fabricate electronics due potentially lower cost, volume production, fast turnout, and less generated waste. RF microstrip line are vital components in signal transfer communication many healthcare, biomedical, IoT applications. In this research, novel lines were designed fabricated using the aerosol jet printer (AJP) dispensing system (DS) on flexible substrates with two different inks that aimed study impact of...

Cross-hatching of PCB grounds refers to a process in which certain ground planes appear as copper lattices; regular openings are placed at intervals. Nowadays, the efficacy hatching on rigid PCBs is minimal. However, it becoming essential for flexible hybrid electronics. Utilizing hatched applications could offer some benefits. Hatched can perform dual roles, act surfaces, and structural support. more durable bending stretching applications. Also, desirable terms material conservation. In...

There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low drift, cycling resistance. Conventional hybrid circuit technology demonstrates high‐temperature packages, but high costs lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost benefits, as well 3D structures embedded features....

Smart clothing with electronic functionality is gaining greater recognition as the next-generation electronics. The integration of electronics into textiles, aided by developments materials and fabrication technologies, has paved way to realization smart that exhibits diverse functionalities. Lamination printed printing conductive inks on polymeric interface layers, embedding components via molding techniques have been studied, but less attention paid viability direct textiles. In present...

Direct-Write printing enables the selective deposition and patterning of dielectric conductive materials in a multi-layer fashion to create high-resolution 3D circuit elements. An embedded PIN diode limiter was demonstrated as an example millimeter wave radio frequency element with aerosol jet printed interconnections place wire bonding. A hybrid fabrication approach chosen using conventional low constant substrates copper foil circuitry active die substrate. Printed elements were placed...

Functionality of wearable electronics depends directly on the manufacturing process and reliability device at different conditions. Nonwoven high-density polyethylene (HDPE) fibers shows promising properties such as moisture resistance, which makes it an excellent candidate for washable smart garments. In this research, effect screenprinting parameters electrical resistance printed silver trace nonwoven HDPE is studied. Reliability during isothermal fatigue cycling test conditions ambient...

Printed electronics is taking advantage of the industry shift in manufacturing processes from conventional subtractive to additive (AM). Although aerosol jet printing process has shown promise its application AM, it currently challenging print some defined functional components due many non-controllable factors. In this paper, we demonstrated an entirely manufactured circuit which included substrate and printed electrical components. The was fabricated using 3D stereolithography (SLA) while...

There is growing interest in the use of additive manufacturing for fabrication RF devices due to fast prototyping capabilities and less material as opposed traditional techniques. In addition previously mentioned advantages, aerosol jet printing method particular allows conformal components. This work models effect bend radius on return loss radiation pattern a dual-band (28 GHz 39 GHz) mm wave patch antenna array design that will be printed. The modeled 5-mil thick flexible substrate (PET)...

High-temperature electronic circuits are becoming increasingly important in a variety of commercial applications, particularly extreme high-temperature environments. These instrumental applications including on-engine sensors, which must withstand elevated temperatures, such as 150°C for general and up to more than 500°C aircraft engines. Many these sensors rely on inductors, fundamental components creating filters, oscillators, transformers, bias chokes. Additive manufacturing or direct...

Damage and defects that occur in printed circuit board assembly (PCBA) often lead to the disposal of expensive components. In cases where laminate circuitry have been removed, traditional repairs manufacturing process not able return devices into service. This study examines use aerosol jet printing (AJP) engineering fluid dispensing (EFD) as methods service damaged PCBAs.Surface mount component failures on PCBAs may a result bad solder joint or problems with component. order salvage such...

Meshing of conventional PCB grounds refers to a process in which certain ground planes appear as copper lattices; regular openings are placed at intervals. The need for meshing rigid PCBs has become minor with the development micro-etching approaches. However, flexible hybrid electronics, meshed could offer some benefits, such being unsusceptible bending and conserving material time. In this paper, we study how affect RF performance straight microstrip lines. Simulations show more than 50%...

As electronic devices and their internal components have become more advanced, conventional computer memory technologies – which are a key component of all electronics struggled to fully keep up with this advancement. Meeting the demands in modern requires zero-sum game approach optimizing several, often competing performance benchmark criteria. Resistive random-access (RRAM) is an emerging nonvolatile (NVM) technology great appeal due its ease fabrication, low programming voltage, fast...

In the relentless pursuit of expanding boundaries what is achievable under extreme temperature conditions, precise measurement RF signals becomes crucial. The ability to capture and analyze data in environments with high temperatures not only improves operational efficiency reliability but also opens up new avenues for scientific investigation. This research introduces a innovative advancement field high-temperature electronics: SiO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML"...

The life of a flexible hybrid electronics (FHE) product under realistic use conditions may often be limited by fatigue the interconnects between components. This is especially true for printed traces on flex. Even if only intended short time, so that accelerated testing not required, common test protocols tend to miss critical interactions sequential strain amplitudes, rates and dwells, and/or different loading modes. Indications are this lead `worst-case' less than anticipated an order...

Flexible antennas are integral to the development of next generation electronics through reduction in SWaP resulting improved capabilities. Here, we show in-situ performance flexible microwave under environmental stress conditions based on MIL-STD-810 testing standards for first time. dual-band (2.4 GHz and 4.6 GHz) fabricated by etching patterned Cu clad RO3003 assessed their stresses while operating at high temperature (65 °C), low (-40 thermal shock between temperatures,...