A5052071119- Thermal properties of materials
- Electromagnetic wave absorption materials
- Dielectric materials and actuators
- Synthesis and properties of polymers
- Advanced Sensor and Energy Harvesting Materials
- MXene and MAX Phase Materials
- Tribology and Wear Analysis
- Advanced Antenna and Metasurface Technologies
- Thermal Radiation and Cooling Technologies
- Graphene research and applications
- Composite Material Mechanics
- Advanced Materials and Mechanics
- Heat Transfer and Optimization
- Carbon Nanotubes in Composites
- Aerogels and thermal insulation
- Advanced Thermoelectric Materials and Devices
- Epoxy Resin Curing Processes
- Flame retardant materials and properties
- Acoustic Wave Phenomena Research
- Additive Manufacturing and 3D Printing Technologies
- Liquid Crystal Research Advancements
- Aerosol Filtration and Electrostatic Precipitation
- Advanced ceramic materials synthesis
- Thermoelastic and Magnetoelastic Phenomena
- Fiber-reinforced polymer composites
Northwestern Polytechnical University
2018-2025
Health First
2023
Henan University of Science and Technology
2021
Institute of Macromolecular Chemistry
2019
China University of Geosciences
2017
Abstract In order to ensure the operational reliability and information security of sophisticated electronic components protect human health, efficient electromagnetic interference (EMI) shielding materials are required attenuate wave energy. this work, cellulose solution is obtained by dissolving cotton through hydrogen bond driving self-assembly using sodium hydroxide (NaOH)/urea solution, aerogels (CA) prepared gelation freeze-drying. Then, carbon aerogel@reduced graphene oxide (CCA@rGO)...
Flexible multifunctional polymer-based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on design a porous/multilayered structure using polyimide (PI) as matrix polymethyl methacrylate (PMMA) microspheres template, flexible (Fe3 O4 /PI)-Ti3 C2 Tx -(Fe3 /PI) with controllable pore sizes distribution Ti3 hollow are successfully prepared by...
With the rapid development and popularization of smart, portable, wearable flexible electronic devices, urgent demands have been raised for electromagnetic interference (EMI) shielding films to solve related pollution problems. polyvinyl alcohol (PVA) as polymer matrix, sandwich-structured EMI nanocomposite are prepared via electrospinning-laying-hot pressing technology, where Fe3 O4 /PVA composite electrospun nanofibers in top bottom layers Ti3 C2 Tx middle layer. Owing electrospinning...
Significantly improved thermal conductivities and a more accurate conductivity model were achieved.
Graphene presents an extremely ultra-high thermal conductivity, well above other known thermally conductive fillers. However, graphene tends to aggregate easily due its strong intermolecular π-π interaction, resulting in poor dispersion the polymer matrix. In this study, silver nanoparticles anchored reduced oxide (Ag/rGO) were first prepared using one-pot synchronous reduction of Ag+ and GO solution via glucose. The (Ag/rGO)/polyimide ((Ag/rGO)/PI) nanocomposites then obtained...
Aramid nanofiber (ANF) paper has shown potential applications in flexible electronics. However, its inherent low thermal conductivity coefficient (λ) values might threaten the safety of devices under a high-power working condition. In this work, polydopamine-functionalized boron nitride nanosheet (BNNS@PDA)/ANF thermally conductive composite papers with nacre-mimetic layered structures were prepared via highly efficient vacuum-assisted filtration followed by hot pressing. For given BNNS...
Flexible electromagnetic interference (EMI) shielding materials with excellent thermal conductivities and Joule heating performances are of urgent demand in the communication industry, artificial intelligence, wearable electronics. In this work, highly conductive silver nanowires (AgNWs) were prepared using polyol method. Cellulose sheets then by dissolving natural cotton a green efficient NaOH/urea aqueous solution. Finally, multifunctional flexible EMI AgNWs/cellulose films fabricated...
Abstract Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities polymers their composites. However, conductivity coefficient ( λ ) values prepared thermally conductive polymer composites are still difficult to achieve expectations, which become bottleneck in fields Aimed at that, based on accumulation previous research works by related researchers our group, this paper proposes three possible directions breaking...
The development of lightweight and integration for electronics requires flexible films with high thermal conductivity electromagnetic interference (EMI) shielding to overcome heat accumulation radiation pollution. Herein, the hierarchical design assembly strategy was adopted fabricate hierarchically multifunctional polyimide composite films, graphene oxide/expanded graphite (GO/EG) as top thermally conductive EMI layer, Fe
Thermal conduction for electronic equipment has grown in importance light of the burgeoning 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics extensive mechanical properties. In this work, "solvothermal & situ growth" method carried out prepare "Fungal tree"-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) fillers. The AgNWs@BNNS/ANF are obtained by...
The low thermal conductivity coefficient (λ) of polyimide (PI) films are limiting their application in high-power electronic equipment, and the disordered alignment fillers discourage efficient improvement λ for PI-based composite films. Herein, polyethylene glycol trimethylnonyl ether is used to perform liquid crystalline modification on graphene fluoride (LC-GeF) achieve ordered alignment. Intrinsically thermally conductive PI (LC-PI) matrix utilized fabricate LC-GeF/LC-PI In-plane (λ∥)...