Yi-Fan Chen

ORCID: 0000-0001-5994-7029
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Ferroelectric and Negative Capacitance Devices
  • Semiconductor materials and devices
  • Advanced Memory and Neural Computing
  • Ferroelectric and Piezoelectric Materials
  • MXene and MAX Phase Materials
  • Photonic and Optical Devices
  • Cardiac Structural Anomalies and Repair

National Tsing Hua University
2021-2025

The structure of metal electrode/HfZrO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> (HZO)/AlON/n <sup xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -Si was employed as the platform to study how effective work function (EWF) electrode affects characteristics FTJ devices. By introducing TiAl into conventional TiN electrode, EWF is reduced which leads a higher tunnel electroresistance (TER) ratio 30 due improved LRS current arising...

10.1109/led.2021.3133577 article EN IEEE Electron Device Letters 2021-12-07

Ferroelectric (FE) HfZrOx (HZO) integrated with ZrO2 interlayer and bottom layer was explored as the new stack (TiN/HZO/ZrO2/HZO/ZrO2/TiN) for FE capacitors processed at 400 °C. The show high remnant polarization (2Pr) of 37 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{C}$ </tex-math></inline-formula> /cm2 wake-up free behavior up to 108 long-pulse cycles. High orthorhombic phase (o-phase)...

10.1109/led.2023.3235715 article EN IEEE Electron Device Letters 2023-01-10

A stack formed by consecutive deposition of 2 nm TaN/10 HfZrOx (HZO)/2 TaN in an ALD tool was proposed to be sandwiched between thick PVD TiN as the promising structure for ferroelectric capacitors (FeCAPs). Compared counterpart, exhibits a smaller coefficient thermal expansion and reduced lattice misfit electrode HZO, enhancing remanent polarization (Pr). Additionally, demonstrates larger barrier height with respect contributing improved reliability. The advantages ALD-TaN FeCAPs over...

10.1109/ted.2024.3374245 article EN IEEE Transactions on Electron Devices 2024-03-13

Inserting an ultrathin TiN interlayer into a ferroelectric HfZrOx (HZO) film of 10 nm by in situ ALD was proposed to implement capacitors (FeCAPs) this work. The FeCAPs with the structure TiN/HZO/TiN/HZO/TiN show high remanent polarization (2Pr) 32.6 μC/cm2 at low operating voltage 2 V and pulse width 5 μs. Compared those without interlayer, work shows Pr enhancement 2.2× under partial-switching conditions (2 V/5 μs) 50% reduction achieve comparable full-switching. This also demonstrates...

10.1063/5.0196828 article EN mit Applied Physics Letters 2024-04-15

10.7567/ssdm.2023.ps-2-02 article EN Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials 2023-09-07
Coming Soon ...