A5006965149- Electronic Packaging and Soldering Technologies
- Advanced Welding Techniques Analysis
- 3D IC and TSV technologies
- Advanced Sensor and Energy Harvesting Materials
- Aluminum Alloys Composites Properties
- Nanomaterials and Printing Technologies
- Aluminum Alloy Microstructure Properties
- Intermetallics and Advanced Alloy Properties
- Advanced ceramic materials synthesis
- Microstructure and mechanical properties
- Gas Sensing Nanomaterials and Sensors
- Tactile and Sensory Interactions
- Advanced materials and composites
- Additive Manufacturing Materials and Processes
- Thermal properties of materials
- Copper Interconnects and Reliability
- Innovative Microfluidic and Catalytic Techniques Innovation
- Analytical Chemistry and Sensors
- Injection Molding Process and Properties
- Additive Manufacturing and 3D Printing Technologies
- Mesoporous Materials and Catalysis
- Electromagnetic wave absorption materials
- Electrochemical sensors and biosensors
- High Temperature Alloys and Creep
- Solidification and crystal growth phenomena
Harbin Institute of Technology
2016-2025
State Key Laboratory of Advanced Welding and Joining
2019-2024
Shenzhen Institute of Information Technology
2018-2023
Ministry of Industry and Information Technology
2020
Southeast University
2020
University Town of Shenzhen
2008-2018
Shenzhen University
2008-2018
Nanjing University of Science and Technology
2007-2012
The development of classical and quantum information-processing technology calls for on-chip integrated sources structured light. Although vortex microlasers have been previously demonstrated, they remain static possess relatively high lasing thresholds, making them unsuitable high-speed optical communication computing. We introduce perovskite-based demonstrate their application to ultrafast all-optical switching at room temperature. By exploiting both mode symmetry far-field properties, we...
Highly conductive Cu-Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct bonded copper substrate for high-power semiconductor devices are achieved by the low-temperature sintering Cu nanoparticles a formic acid treatment. The joints formed via long-range process exhibited good electrical conductivity high strength. When sintered at 260 °C, nanoparticle layer low resistivity 5.65 μΩ·cm displayed shear strength 43.4 MPa. 320 decreased to 3.16 increased 51.7 microstructure...
Abstract Robust anti‐counterfeiting techniques aim for easy identification while remaining difficult to forge, especially high‐value items such as currency and passports. However, many existing rely on deterministic processes, resulting in loopholes duplication counterfeiting. Therefore, achieving high‐level encryption authentication through conventional has remained a significant challenge. To address this, this work proposes solution that combined fluorescence structural colors, creating...
A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) conditioning/readout wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing carrier substrate before attaching the body. Here, we report universal scheme enable room-temperature sintering of metal...
Metal-based materials possess superior electromagnetic interference (EMI) shielding performance because of their extraordinary electrical conductivity. Nevertheless, the high density and structural rigidity metals seriously limit applicability in portable wearable electronic equipment. A common method for reducing metal-based is to prepare metal nanowire aerogels by freeze-drying, but weak connection among nanowires results poor mechanical properties. Herein, a facile approach developed...
Abstract Sensitivity and transparency are critical properties for flexible wearable electronic devices, how to engineer both these simultaneously is dramatically essential. Here, the first time, we report assembly of ordered array structures silver nanowires (AgNWs) via a simple water-bath pulling method align AgNWs embedded on polydimethylsiloxane (PDMS). Compared with sensors prepared by direct drop-casting or transfer-printing methods, our developed sensor represents considerable...
Electromagnetic interference protection in optoelectronic devices is challenging because of the dual requirements optical transmittance and high shielding effectiveness (SE). Herein, we propose a novel silver nanowire (AgNW)/polyethylene terephthalate (PET) multi-layer mesh pattern structure for transparent electromagnetic obtained via laser marking transfer printing. A three-layer composite film with an 67.8% exhibits SE 44 dB at 10 GHz, which superior to most reported films composed AgNWs...
A wearable thermoelectric generator using human body temperature is a promising power supply for electronics. Here we discuss the design and fabrication of one kind constructed by n-type Mg3.2Bi1.498Sb0.5Te0.002 legs, p-type Bi0.4Sb1.6Te3 polyurethane matrices, flexible Cu/polyimide electrodes. The proposed device has low thermal bypass an efficient contact interface, resulting in peak density ∼20.6 μW/cm2 when placed on arm at ambient 289 K (air velocity, 1.1 m/s) high 13.8 mW/cm2...
Tattoo electronics, flexible patches that mount directly onto the skin with ease and flexibility of a temporary tattoo, have foreseen remarkable application potentials in personalized healthcare monitoring human-machine interfaces. Documented tattoo electronics mostly an on-skin form factor to date. Using dermal tattoos for vivo diagnostics presents unexplored paradigm. Here, we extend scenario "tattoo electrodes" from fashion actual under-skin configuration, enabled by highly soft,...