A5077131243- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Nanofabrication and Lithography Techniques
- Advanced MEMS and NEMS Technologies
- Synthesis and properties of polymers
National Yang Ming Chiao Tung University
2019-2020
Tokyo Institute of Technology
2019-2020
This article investigates the adhesion properties between polyimide layers and Ti/Cu layer after electroplating process. The strength was evaluated by four-point bending system, influence factors were confirmed using different times currents. fracture interface measurement characterized, spectrum analyzed. results showed that modified polyimide-like material has better performance than conventional polyimide. Moreover, mechanism of degradation proposed. As a result, can be applied in...
In this study, a sandwich structure (silicon/polymer/silicon) was prepared to demonstrate the adhesion strength between polymer and silicon layers using four-point bending system. For first time, stealth dicing (SD) method applied layer generate an initial crack, SD compared with traditional of forming trench by blade dicing. From experimental results, improved test yield showed lower level sudden force drop. As result, is highly reliable way measure
The adhesion between metal and polymer layer was studied using four-point bending tests. It shown that as the annealing temperature increased, oxidation binding which decreased reduced G <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</sub> value. A new test sample prepared stealth dicing method with a 100% success rate proposed for first time. With samples dicing, region where crack extension occurred smaller after stress test. Less generated...
2018 International Conference on Solid State Devices and Materials,Effect of Electroplating Adhesion between Copper/Titanium Polyimide in Redistribution Layers Hybrid Bonding Scheme for Advanced Packaging Applications