A5050932273- Mechanical Behavior of Composites
- Electronic Packaging and Soldering Technologies
- Fatigue and fracture mechanics
- Semiconductor materials and devices
- Material Properties and Processing
- 3D IC and TSV technologies
- Electronic and Structural Properties of Oxides
- Ultrasonics and Acoustic Wave Propagation
- Numerical methods in engineering
- Probabilistic and Robust Engineering Design
- Epoxy Resin Curing Processes
- Advanced ceramic materials synthesis
- ZnO doping and properties
- Structural Analysis of Composite Materials
- Structural Response to Dynamic Loads
- Material Properties and Applications
- Metal and Thin Film Mechanics
- Integrated Circuits and Semiconductor Failure Analysis
- Elasticity and Material Modeling
- Advanced Sensor and Energy Harvesting Materials
Georgia Institute of Technology
2013-2020
Alumina (Al2O3) films deposited through atomic layer deposition (ALD) are known to be effective permeation barriers due their uniformity and pinhole-free morphology. However, they suffer from process-induced defects that inhibit stability in aqueous hygroscopic environments. We explore the water of ALD alumina barrier capped with nickel oxide (NiOx) titanium (TiOx) thin e-beam or deposition. The performance was evaluated by measuring ability protect zinc (ZnO) film sensors immersed deionized...
Most microelectronic packages consist of multilayered structures made dissimilar materials. Therefore, interfacial delamination is a common failure mechanism due to the mismatch in coefficient thermal expansion (CTE) between Epoxy mold compound (EMC) atop copper leadframe commonly used packages. Environmental factors such as high temperature storage and/or moisture conditioning will have significant effect on fracture toughness structures. The aging adhesion an EMC investigated this paper....
As the microelectronics industry continues to advance boundaries of size and performance, focus on impact systems packaging has risen forefront design material considerations. interfaces are often constructed multiple heterogeneous layers, interfacial delamination is an important failure mechanism consider in microelectronic packaging. This due to, among other factors, stresses arising from high mismatches coefficient thermal expansion (CTE). Most work date focused crack propagation under...
Abstract In this paper, we present the results of mechanical testing that reveals onset crack strain and fatigue growth TiO 2 Al O 3 films deposited by atomic layer deposition. Data show both have a strong thickness dependence strain, with reducing increasing film thickness. Additionally, lower for damage than . However, are more resilient in harsh environments where grows faster.
The fatigue properties of ultrathin protective coatings on silicon thin films were investigated. cohesive and delamination 22 nm-thick atomic-layered-deposited (ALD) titania characterized compared to that 25 alumina. Both deposited at 200 °C. rates are comparable 30 °C, 50% relative humidity (RH) while they one order magnitude larger for alumina 80 90% RH. improved performance is believed be related the stability ALD coating with water alumina, which may in part fact crystalline, amorphous....
The focus of this paper is to study the reliability a wearable electrocardiogram sensor leadset under tight bending conditions using numerical simulations and experiments. In these simulations, appropriate material models are selected fitted for each layer, including hyperelastic model TPU, an elastic-plastic PET, linear elastic silver ink, carbon dielectric layers. results from compared validated analytical as well experimental data. Recommendations made acceptable operating leadset.
Abstract Experimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and used to determine whether crack will propagate or not under given loading conditions for application. A different approach assess employ a failure locus consisting the energies corresponding modes, represented by implicit formulation. Such can be linear, elliptical, among other shapes. As it nearly impossible obtain isolated GIc GIIc values...
Bimaterial interfaces, like the one consisting of epoxy mold compound (EMC) cured over copper leadframe, are commonly present in microelectronic packages. Failure such bimaterial interfaces can be simulated through use cohesive zone modeling (CZM). To date, nearly all CZM has been performed for monotonic loading conditions. However, most interfacial failures packages occur during operating conditions where repetitive or fatigue present. The work seen literature utilizes methods which while...
Emerging fan-out packages require advances in mold compounds, polymer interfaces to metals and silicon, innovative processing reach the required high reliability. In this paper, we discuss fracture energy for compound interface copper use that information studying interfacial delamination propagation of compound. We have examined from silicon die as well redistribution layer a package, compared results against lead-frame package plastic ball grid array similar dimensions.
Fracture mechanics is an essential field of study towards the improvement and development electronic packages. In combination with modern simulation method such as finite element analysis (FEA), fracture widely used appreciated in industry. Many different approaches have been developed to calculate parameters for interfaces or bulk material under given loads order compare them against previously measured failure criteria. While many publications are available that described detail test...
The objective of this work is to develop a combined mode I and III characterization method use test study Copper (Cu) / Epoxy mold compound (EMC) interfacial delamination from near-mode nearmode global loading. Using the developed method, series experiments are done with varying loading conditions successful Cu/EMC interface observed in many cases. Three-dimensional finite-element analysis carried out get compliance vs crack length relationship for different used determine indirectly....