- Thermal properties of materials
- Advanced Thermoelectric Materials and Devices
- Wound Healing and Treatments
- Cancer Treatment and Pharmacology
- Colorectal Cancer Treatments and Studies
- Thermal Radiation and Cooling Technologies
- Semiconductor materials and devices
- Peripheral Artery Disease Management
- Angiogenesis and VEGF in Cancer
- Electronic and Structural Properties of Oxides
- Heat Transfer and Optimization
- Cancer, Hypoxia, and Metabolism
- Beetle Biology and Toxicology Studies
- Molecular Junctions and Nanostructures
- Laser Material Processing Techniques
- Ocular and Laser Science Research
- Advancements in Semiconductor Devices and Circuit Design
- Engineering Applied Research
- Brake Systems and Friction Analysis
- Organic Electronics and Photovoltaics
- Diabetic Foot Ulcer Assessment and Management
- ZnO doping and properties
- PI3K/AKT/mTOR signaling in cancer
- Hepatocellular Carcinoma Treatment and Prognosis
- Gastric Cancer Management and Outcomes
Georgia Institute of Technology
2011-2016
Purdue University West Lafayette
2014
Vanderbilt University
2004-2008
The University of Texas at Arlington
2003
We report a rapid method of depositing phosphonic acid molecular groups onto conductive metal oxide surfaces. Solutions pentafluorobenzyl (PFBPA) were deposited on indium tin oxide, zinc nickel and by spray coating substrates heated to temperatures between 25 150 °C using 60 s exposure time. Comparisons coverage changes in work function made the more conventional dip-coating utilizing 1 h The data show that shifts surface similar or greater than those obtained method. When deposition...
Direct deposition of barrier films by atomic layer (ALD) onto printed electronics presents a promising method for packaging devices. Films made ALD have been shown to possess desired ultrabarrier properties, but face challenges when directly grown surfaces with varying composition and topography. Challenges include differing nucleation growth rates across the surface, stress concentrations from topography coefficient thermal expansion mismatch, elastic constant particle contamination that...
The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands high-powered semiconductor devices. In particular, a variety nanostructured materials, such as carbon nanotubes (CNTs), interesting due their ability provide low resistance heat transport from device-to-spreader and compliance between with dissimilar coefficients expansion (CTEs), but few application-ready configurations have been produced tested. Recently, we undertaken...
Alumina (Al2O3) films deposited through atomic layer deposition (ALD) are known to be effective permeation barriers due their uniformity and pinhole-free morphology. However, they suffer from process-induced defects that inhibit stability in aqueous hygroscopic environments. We explore the water of ALD alumina barrier capped with nickel oxide (NiOx) titanium (TiOx) thin e-beam or deposition. The performance was evaluated by measuring ability protect zinc (ZnO) film sensors immersed deionized...
The influence of planar organic linkers on thermal boundary conductance across hybrid interfaces has focused the organic/inorganic interaction energy rather than vibrational mechanisms in molecule. As a result, research into interfacial transport at monolayer junctions treated molecular systems as thermally ballistic. We show that phosphonic acid (PA) molecules is ballistic, and metal/PA/sapphire driven by same phononic processes those metal/sapphire without PAs, with one exception. find...
Several new reduced-scale structures have been proposed to improve thermoelectric properties of materials. In particular, superlattice thin films and wires should decrease the thermal conductivity, due increased phonon boundary scattering, while increasing local electron density states for improved thermopower. The net effect be ZT, performance metric structures. Modeling these is challenging because quantum effects often combined with noncontinuum electronic systems are tightly coupled....
Atomic layer deposition (ALD) is increasingly becoming commonplace to deposit high density, conformal films, as novel techniques allow improved rates on various substrates. Diffusion and miscibility of ALD precursors with polymers are known affect film nucleation. To assess the influence polymeric underlayer growth mechanical behavior we deposited aluminum oxide (Al 2 O 3 ) titanium dioxide (TiO films three different reactivity compared them polyethylene terephthalate (PET). We present...
The cross-plane thermoelectric performance of strained Si∕Ge∕Si superlattices is studied from a quantum point view using the nonequilibrium Green’s function method. Strain causes germanium well layers to turn into barriers that promote electron tunneling through barriers. Electron produces oscillations in Seebeck coefficient due shift subband energies near Fermi level. Strain-induced energy splitting can increase power factor by up four orders magnitude germanium-rich substrates. Also, at...
Using a nonequilibrium Green's function approach, quantum simulations are performed to assess the device characteristics for cross-plane transport in Si/Ge/Si-superlattice thin films. The effect of confinement on Seebeck coefficient and electrical its impact power factor superlattices studied. In this case, decreasing well width leads an increased subband spacing causing superlattice decrease. Electron also causes drastic reduction overall available density states. Results show that effects...
Organic/inorganic multilayer barrier films play an important role in the semihermetic packaging of organic electronic devices. With rise use flexible electronics, there exists potential for mechanical failure due to loss adhesion/cohesion when exposed harsh environmental operating conditions. Although performance has been predominant metric evaluating these encapsulation films, interfacial adhesion between organic/inorganic and factors that influence their strength reliability received...
Abstract In this paper, we present the results of mechanical testing that reveals onset crack strain and fatigue growth TiO 2 Al O 3 films deposited by atomic layer deposition. Data show both have a strong thickness dependence strain, with reducing increasing film thickness. Additionally, lower for damage than . However, are more resilient in harsh environments where grows faster.
The Boltzmann transport equation is often used for non-continuum when the mean free path of phonons order device sizes. One particular application involves heat generation in electronic devices. In a highly scaled MOSFET, example, majority produced localized region immediately below gate on drain side. size this smaller than phonons, which suggests Knudsen number large and models are appropriate. Using one-dimensional BTE diffusion equation, comparison between continuum made. focus...
The next generation of Thermal Interface Materials (TIMs) are currently being developed to meet the increasing demands high-powered semiconductor devices. In particular, a variety nanostructured materials, such as carbon nanotubes (CNTs), interesting due their ability provide low resistance heat transport from device spreader and compliance between materials with dissimilar coefficients thermal expansion (CTEs). As result, nano-Thermal (nTIMs) have been conceived studied in recent years, but...
With device dimensions shrinking to nanoscales, quantum effects such as confinement and tunneling become significant in electron transport. In addition, scattering electron-phonon scattering, electron-impurity also affect carrier transport small-scale devices. Commonly used models involve corrections the drift-diffusion equations while based on solution Schrodinger wave equation can be computationally intensive. While most of these are not robust enough incorporate rigorous effects, NEGF...
With device dimensions shrinking to nanoscales, quantum effects such as confinement and tunneling become significant in electron transport. In addition, thermal transport devices is directly coupled charge even highly scaled devices. While electron-phonon scattering usually helps restore thermodynamic equilibrium, may not ensure enough equilibrium. The simultaneous consideration of effects, which described particle behavior, are wave nature, extremely difficult computationally intensive....
Laser assisted machining in the MEMS context is gaining recognition due to its versatility application and cost effectiveness compared processes such as LIGA, chemical vapor deposition, electrical discharge etc. High thermal conductivity causes instant heat transfer surroundings leading significant affected zones. Damage further aggravated by high ablation thresholds for metals when excimer lasers are used. Ultrashort pulse have been found minimize damage more than any other known laser....
In this paper we present the analysis of focus and intensity mechanisms for a spot bonding process using femtosecond pulsed laser with Gaussian beam profile. The bonds two thin optically transparent materials by focusing at their interface to form joint minimum damage surrounding material. parameters that effect are focal length lens used, waist, angle incidence on material surface, characteristics such as thickness refraction index. We performed numerical number lengths considering...
<p>Supplemental Figure 1. Changes in average vascular score (AVS) from baseline.</p>
<p>Supplemental Table 3. BEP study patients and the number of whose granulation tissue biopsies were available for biomarker study.</p>