A5013422414- Adsorption and Cooling Systems
- Solar Thermal and Photovoltaic Systems
- Semiconductor materials and devices
- Refrigeration and Air Conditioning Technologies
- Building Energy and Comfort Optimization
- Heat Transfer and Optimization
- Electron and X-Ray Spectroscopy Techniques
- Smart Grid Energy Management
- Energy and Environmental Systems
- Electronic Packaging and Soldering Technologies
- Tissue Engineering and Regenerative Medicine
- Heat Transfer and Boiling Studies
- 3D IC and TSV technologies
- Engineering Applied Research
- Microfluidic and Bio-sensing Technologies
- Thermodynamic and Exergetic Analyses of Power and Cooling Systems
- Thermal Radiation and Cooling Technologies
- Aerosol Filtration and Electrostatic Precipitation
- Semiconductor Quantum Structures and Devices
- Photonic and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Energy Efficiency and Management
- Advanced Thermoelectric Materials and Devices
- Flow Measurement and Analysis
- Cyclone Separators and Fluid Dynamics
Komatsu (Japan)
2022
Johnson Controls (Japan)
2018-2022
Hitachi (Japan)
2002-2016
Hitachi (United Kingdom)
2015
Kobe University
2004
Ebara (Japan)
1979-2003
Association of Super-Advanced Electronics
2002
Osaka University
1996
The advanced 3D stacking technologies are discussed in this paper. They the microbumping 20 /spl mu/m pitch, basic processes of bonding for high precision and reliable interconnections, novel to encapsulate layered microthin gaps less than 10 mu/m, non-destructive inspection. These confirmed realize stacked LSI structure, it will be expanded system packaging near future.
Absorption chillers at cogeneration plants generate chilled water using steam supplied by heat recovery generators.The can be of either single-effect or double effect configuration and the coefficient performance (COP) depends on selection made.The COP varies from 0.7 to 1.2 depending types chillers.Single normally have in range 0.68 0.79.Double are higher reach 1.2.However due factors such as inappropriate operations maintenance practices, could drop over a period time.In this work...
We have developed the cooling unit for high-density packaging ICT racks by using boiling heat transfer with concept of transporting a generated from CPU into outdoor atmosphere directly without exposure to air in computer room. The aim this paper is evaluate and power saving performance low height type thermosyhon installed 1U server exchanger cooled water chiller unit. First, we clarified some factors (tilt angle, flow passage length cross sectional area thermosyhon) influencing...
New plastic wafer boxes with cleaning capability for gaseous contamination harmful to LSI fabrication processes have been developed. The gases are effectively reduced by attaching a UV/photoelectron unit the conventional polycarbonate box. performance of has verified reliability test thin gate oxides fabricated on Si wafers stored in boxes. It is also shown that newly developed material superior terms organic molecule contaminants.
A new dynamic simulation program for predicting the precise transient behavior of absorption chiller cycles has been developed. This combines an object-oriented formulation and a parallel processing architecture treating with arbitrary structure. algorithm highly stable, fast accurate computational characteristics was devised calculating flow rate in solution circulation line. In this calculation, takes into account pump liquid level control by float valve. The simulated results on cycle...
We have previously reported that UV/photoelectron method, in which particles are charged by photoelectrons emitted from the UV irradiated metal surface and collected on electrodes electric field, is effective to collect gas phase. This paper represents method not only but also reduce gaseous contamination such as hydrocarbon or organic compounds water molecules. By using carbon atom concentration Si reduced 1/4 compared with stored clean room for storage period of about 40 h. The oxygen 1/7...
A high-height thermo siphon cooling apparatus for high-density packaging ICT racks has been developed. An evaporator is provided at the side face of server, a heat exchanger with water set on ceiling rack. The connected to each other by grooved tube which vapor and condensed pass through. transfer plate 3mm thick vertically arranged in evaporator. grooves equal pitch groove radius 0.1mm are this boiling surface. could be supplied surface capillarity. coefficient K evaporation more than...
We are developing a practical use case of thermoelectric devices which convert heat into electricity by utilizing unused thermal energy. chose cogeneration system as one the targets and examined generation using warm drainage. First, we designed suitable flow path found structure that could increase temperature difference between hot cold sides material 30% in comparison with simple structure. Next, experimentally measured output voltage Vo=9.4V, electric power, Pmax=0.76W at source ΔT=53.5°C path.
With scaling down of the size semiconductor devices, influence not only particles but also gaseous contamination becomes serious in manufacturing processes. UV/photoelectron method, by which are charged photoelectrons from UV irradiated metal surface and collected on electrodes an electric field, is effective for such as, NH/sub 3/, NO/sub X/, SO/sub 2/ organic compounds. By attaching photocatalyst (TiO/sub 2/) with source (photocatalyst method), more effectively reduced. We investigate gate...
In semiconductor manufacturing processes, surface contamination is a very important issue because it decreases the product yield of LSI. this study, new method to remove fine airborne particles and gaseous contaminants in wafer stocker using UV/photoelectron has been investigated. Two kinds stockers are used for investigating efficiency controlling (1) particulate under atmospheric conditions (2) low pressure conditions.
This paper describes robust 130 nm-node Cu dual damascene interconnection technology with low-k barrier SiCN, eliminating SiN. The total capacitance of the FSG/SiCN structure is designed to same extent as that SiLK/SiN structure. We newly developed processes dedicated SiCN and realized FSG/SiCN, resulting in good electrical characteristics reliability.
A prototype of an isothermal container for transporting materials used regenerative medicine has been fabricated. This acrylic is constructed using vacuum insulation panels (VIPs) and uses phase change material as a thermal storage medium. It cylindrical holds several containment vessels. The medium n-Eicosane, which kind carbon hydrate with melting temperature 36.4℃. contents to be transported are sandwiched between packages the material. Testing showed that this can maintain at 36±0.5℃...