A5043469706- Industrial Vision Systems and Defect Detection
- Manufacturing Process and Optimization
- Electronic Packaging and Soldering Technologies
- Optimal Experimental Design Methods
- Product Development and Customization
- Advanced machining processes and optimization
- Advanced Multi-Objective Optimization Algorithms
- Injection Molding Process and Properties
- Advanced Statistical Process Monitoring
- Iterative Learning Control Systems
- QR Code Applications and Technologies
- Transition Metal Oxide Nanomaterials
- Acute Myeloid Leukemia Research
- Analytical Chemistry and Sensors
- Advancements in Photolithography Techniques
- Color perception and design
- Additive Manufacturing and 3D Printing Technologies
- Image Processing and 3D Reconstruction
- Multi-Criteria Decision Making
- Surface Roughness and Optical Measurements
- Refrigeration and Air Conditioning Technologies
- Consumer Market Behavior and Pricing
- Sensory Analysis and Statistical Methods
- Consumer Behavior in Brand Consumption and Identification
- Fuzzy Logic and Control Systems
National Taiwan University
2024
Shu-Te University
2007-2017
National Cheng Kung University
2001-2007
This study presents a case using hybrid failure mode and effect analysis (FMEA) fuzzy inference system (FIS) extract critical soldering sources assess their risks in surface mount assembly (SMA). The desired level of quality SMA plays an important role achi eving defect-free printed circuit board to fabricate many types modern electronic products. FMEA is effective method for identifying potential failures the product process design stage. However, traditional has several disadvantages. To...
ABSTRACT In this study, a comparative study of optimizing the reflow thermal profiling parameters using hybrid artificial intelligence and desirability function approaches without/with combining multiple performance characteristics into single is presented. Reflow soldering key determinant for improvement first-pass yields electronics assembly. A profile time-temperature contour with utilized to monitor heating effects on printed circuit board (PCB) surface mount components (SMCs) in oven....
Copper (Cu) wire has become an alternative material for bonding in many microelectronic applications due to the high appreciation price of gold. However, Cu process is relatively new integrated circuit (IC) assembly and must be appropriately controlled save on manufacturing costs without encountering reliability problems or losing quality. This study proposes adaptive diagnosis system control quality assessment using grey relational analysis (GRA) a neurofuzzy technique. A fractional...
A high-speed surface mount assembly can reduce both production cost and time; however, it could allow an enormous number of boards to be built before a problem is detected. Therefore, early detection assessment critical for cost-effective manufacturing. This paper proposes neurofuzzy system defect prediction control. Hybrid data from in-process quality control database fractional factorial experimental design are collected learning modeling. Customized programming codes generated rule...
Purpose A neural‐network‐based predictive model is proposed to the second‐side thermal profile reflow process in surface mount assembly with a view facilitating oven set‐up procedure and improving production yield. Design/methodology/approach This study performs 3 8−4 fractional factorial experimental twice collect thermal‐profile data from board. The first experiment has components on second side only, while also additional primary side. back‐propagation neural network (BPN) then used...
This paper presents an application of a grey-Taguchi method to optimize reflow thermal profiling operation with multiple characteristics. Reflow soldering is dominant means used melt solder paste and form robust joints between surface mount devices (SMDs) pads printed circuit board (PCB) in assembly (SMA). The profile setting significant variable that affects production yield SMA. An inappropriate can cause many defects (e.g., voiding, balling, bridging, tombstoning, etc.) jeopardize product...
Flexible production is essential for manufacturers in the face of changing demands printed circuited board assembly (PCBA) industry. Machine flexibility an important factor used to enhance a PCBA system. Configuring surface mount (SMA) lines one most significant operational decisions cope with variable and product variants. Aggregating chip-placer group conducive evaluate SMA line flexibility, so that decision-makers can develop better strategy. In this research, measuring framework was...