In this paper, a deep bandgap behavior analysis of the vertical cascaded electromagnetic-bandgap (EBG) structure is made. It shown that EBG can be decomposed into two structures horizontally, one with bigger patches and other smaller patches. The design guidelines are drawn. Furthermore, cascade concept extended to 3-D for wideband simultaneous switching noise (SSN) suppression. number rows coupling reduction investigated. Building SSN isolation walls along printed circuit board...

In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived signal integrity and power integrity, respectively. A general flow presented, where the basic concepts of GA introduced some important considerations package design demonstrated. customized two accelerating strategies developed to improve efficiency procedure. Using optimization, P/G assignment...

In this paper, a fast power/ground (P/G) pin assignment method for large-scale high-pin-count ball grid array (BGA) packages using static template is proposed. The generated genetic algorithm. An algorithm developed to remove the boundary problem of so that its copies can be directly merged into BGA package. selection size demonstrated. A visual demonstration presented better evaluate quality signal and P/G pins by human eyes. Using method, 50 × package with blocks core, I/Os differential...

In this paper, a new power distribution network (PDN) design method from delivery viewpoint is proposed. Two parameters, the delay and DeltaV time constant, are introduced to characterize effects of lead inductors decoupling capacitors on timely respectively for high-speed PDN. The PDN accurately estimated by inductance discontinuities, charge speed, supply capacity characterized constant. Based two complete systematic power-delivery developed. proposed verified SPICE, full-wave simulations,...

In this paper, an efficient power noise suppression method using power-and-ground (PG) via pair array in multilayered printed circuit boards (PCBs) is proposed. The performance doubled by both and ground vias compared with the array. stopband bandwidth of PG derived. evolvement from mushroom electromagnetic bandgap (EBG) structure to demonstrated. proposed has overcome many shortcomings EBG structures. It shown that excellent suppression, signal integrity (SI), compatibility (EMC)...

In this paper, IR drop reduction of high-performance printed circuit boards (PCBs) is discussed. The multilayer PCB analyzed by using model decomposition and adaptive mesh. It shown that both the via contact voltage regulator module (VRM) copper planes produce significant drop. A star topology proposed for reduction, which can significantly reduce resistance introduced VRM planes. Star about 50%. Furthermore, efficiency through design on multi-plane structures analyzed. Through rules radial...

The rapidly growing demand for high-bandwidth data rate has pushed the wireline communications speed up to 112 Gb/s. In such high-speed and high-channel-count applications, a major challenge differential pin map design is tradeoff between cost crosstalk pairs in area of BGA pins PCB via connection. this letter, pattern with high signal-to-ground ratio (S:G) 1:1.25 low proposed. Compared conventional square array S:G = 1:1, integrated noise (ICN) reduced by 75% insertion loss (ICR) increased...

A SPICE-compatible cavity resonant transmission line (CTL) model for a single-ended microstrip is first presented by reducing 2-D resonator to 1-D resonator. This has low efficiency since it consists of infinite higher-order components included inductors, capacitors, resistors, and ideal transformers. modified CTL developed using fast algorithm improve the simulation efficiency, which results in an accurate SPICE finite elements. Because improved uses (a little more complicated) elements...

In this paper, an accurate and fast method is presented for the modeling, analysis, design of power noise suppression using embedded planar capacitors in high-speed multilayered printed circuit boards (PCBs). Two main contributions paper are: 1) ideal AC short model proposed to simplify stopband analysis a physics-based formula derived estimation 2) equivalent modeling introduced level complicated structures. The results are verified by simulation measurement. Our changes multiple plane...

In this paper, a power/ground (P/G) pin assignment method using simulated annealing (SA) for large-scale high-pin-count ball-grid-array (BGA) packages is proposed. Two objective functions describing the power integrity (PI) and signal (SI) of pinout are introduced. The SA algorithm customized to meet needs problem. Accelerating strategies introduced, some special considerations optimization discussed. can generate P/G with any power-ground-signal ratios (P <sub...

In this paper, we studied the problem of IR drop high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify process and improve efficiency. It found that both vias contact voltage regulator module (VRM) copper planes produce significant drop. A novel method for reduction proposed, which can significantly reduce resistance introduced by VRM planes. This about 50%. Furthermore, also discuss multi-plane structures. With reasonable design rules, PCBs with...

In this paper, a new concept of distributed port is proposed, and systematic method for the modeling, analysis, design high-speed power delivery network (PDN) developed. The uses multiple lumped ports dispersed uniformly in power-delivery networks to capture characteristics large irregular structures. This provides feasible scheme accurate analysis whole or any part network. modeling methods modeled results are discussed depth. applications PDN design, package/connector performance...

In this paper, we will propose a method for floorplanning in three dimensional integrated circuits (3D-IC), considering the impact of Through-Silicon-Via (TSV). 3D-IC, multiple device layers are vertically stacked and interconnected by excessive amount TSVs which occupy lot silicon area increase wire length. simulated annealing (SA) multi-objective optimization algorithm is developed 3D-IC including factors floorplanning, plan functional block TSV simultaneously. By using SA method, can get...

In this paper, an efficient signal-integrity analysis and optimization method for complicated multiple-input multiple-output (MIMO) networks is proposed, in which data mining applied to discover the concealed information black-box S-parameter models. Instead of performing a number circuit simulations, employs mathematical search algorithm directly into model, can save significant analyzed time improve efficiency. An optimized flow presented large scale set, where processing are performed...

As trace dimension reduces to 2 mil or smaller in next-generation high-density DRAMs, length matching design using serpentine lines could result timing error larger than 50%. Significant coupling parallel segments of greatly affect the propagated speed digital signals. In this paper, accurate delay extraction for is proposed. Formulas are presented, and guidelines minimized crosstalk developed. Two main contributions paper are: 1) first accurately extracted by mathematical formulas 2) an...

In this paper, a new multisegment multiple transmission lines (MMTLs) SPICE model is developed to and analyze high-speed high-density connectors based on time domain reflectometry (TDR) measurements. It has advantages over the distributed inductance-capacitance (LC) in aspects of stability efficiency. The easy understand optimize. Its accuracy control. precision function MMTL extracted through simulations measurements which modeling automation based. Feedback theory adopted realize process....

The shunt parasitic capacitance of a multilayer ceramic capacitor (MLCC) mounting structure seriously degrades the performance MLCC in high-speed applications. In this paper, we propose new compensation design method with which reference planes underneath surface mount technology pads and are cleared to eliminate excessive effect. An analytical model is derived compute optimal clear parameters using conformal mapping, result closely matches that Ansoft 2-D Extractor. It convenient for...

In this paper, a collaborative optimization for floorplaning and pin assignment of 3D ICs using genetic simulated annealing(GA-SA) algorithm is presented. Layout problem usually solved by multi-objective function developed from stochastic algorithm. The weight value has great impact on the final layout results. A hybrid combined Genetic Simulated Annealing(GA-SA) to find values in co-optimization. By method, area, interconnection length, maximum temperature floorplanning, partial return-path...

A dual-band mushroom electromagnetic bandgap (EBG) structure with inductive via coupling is proposed in this paper, which first introduced to generate another new stopband. The principle of how two stopbands demonstrated by equivalent circuit models or more LC series resonators through mutual inductance. Then, a EBG four-cell proposed. Full-wave simulated and measured results show that the introduces continuous stopbands, extend power noise suppression Finally, an eight-cell developed...

As the wired communication data rate increases up to 112 Gb/s and even higher, differential crosstalk from neighboring pairs becomes much more serious could significantly deteriorate signal integrity. In this paper, a perturbed pin map design method is proposed reduce for 4-level pulse amplitude modulation (PAM4) applications. Three physical parameters, distance of two pins in pair, angle adjacent positions surrounding ground vias, are maximum reduction. Without changing signal-to-ground...