In this work, a low-temperature wafer-level bonding process at 150 °C was carried out on Si wafers containing 10 µm-sized microbumps based the Cu-Sn-In ternary system. Thermodynamic study shows that addition of enables low-melting temperature metals to reach liquid phase below melting point (157 °C) and promotes rapid solidification intermetallic layer, which are beneficial for achieving bonding. Microstructural observation high quality with low amount defect. SEM TEM characterization...

Solid–liquid interdiffusion (SLID) bonding finds a wide variety of potential applications toward die-attach, hermetic encapsulation microelectromechanical systems (MEMS) devices and 3-D heterogeneous integration. Unlike soft soldering technique, the solidification intermetallic compound (IMC) formation in SLID occurs during process isothermally, making it difficult to predict mitigate sources process-dependent thermomechanical stresses. Literature reports two dominant factors for built-in...

In this paper, we report a robust and low-cost spin coating approach for fabrication of large area flexible piezoelectric nanocomposite generator device harvesting biomechanical motions. order to develop the nanocomposite, ZnO BaTiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> were used as filler materials realization nanogenerator. Serial stretching bending tests over these devices illustrated generation maximum open-circuit voltage...

Continuous scaling of package architectures requires small volume and high-density microbumps in 3D stacking, which often result solders fully transforming to intermetallic compounds (IMCs). Cu–Sn solid–liquid interdiffusion (SLID) bonding is an attractive technology where the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula> bumps are composed IMCs. In this work, test...

Preconcentrator integration with sensors for enhanced detection of target analytes, such as volatiles, explosives, and toxic compounds, has been gaining attention. Although metal oxides (MOX) have widely used gas sensors, they not employed analyte preconcentration. In this paper, we explored ZnO a plausible trinitrotoluene (TNT) preconcentator material. A detailed study these nanorods respect to adsorption-desorption characteristics TNT using specialized chromatographic techniques,...

Magnetic nanomaterials' (especially metals) air stability and compatibility with standard micro-fabrication technologies are often a concern for development of MEMS-based magnetic devices.

In this work, we have grown GaN nanowires using Plasma assisted Molecular beam epitaxy (PA-MBE) on Si (111) substrate. High resolution X-ray diffraction (HRXRD) characterization and scanning electron microscopy (SEM) studies were carried out to investigate the crystal structure, morphology uniformity of nanowires. These confirm wurtzite structure uniform growth. The diameter was observed be in range 100 – 200 nm with length between 1 2 µm. Piezoresponse force (PFM) used Dual AC Resonance...

The measurement of in-plane motion in microelectromechanical systems (MEMS) is a challenge for existing techniques due to the small size moving devices and low amplitude motion. This paper studied possibility using images obtained scanning electron microscope (SEM) together with detection algorithms characterize MEMS. SEM imaging has previously been used detect MEMS device. However, differences how optical capture motion, possible interference caused by electrical actuation, create doubts...

Abstract Flame retardation of polypropylene was accomplished by blending with antimony compounds (Sb 2 O 3 and SbPO 4 ) in conjunction polyvinyl chloride (PVC) or ferric oxide. The compatibility dispersion the polymer matrix enhanced using silane coupling agents, viz., vinyltriethoxysilane (A‐151) γ‐aminopropyltriethoxysilane (A‐1100). Rheological properties filled were studied temperature range 180 to 220°C at shear rates 29.5 119.5 sec −1 . An increase melt viscosity found as compared...

Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient thermal expansion (CTE) at elevated temperatures. This work applied Cu-Sn-In-based SLID method to bond silicon and optically transparent materials 200 °C. Experimental results show a successful with minor unavoidable misalignment from CTE mismatch major alignment process. Microstructural...

Based on the finite element (FE) simulations done in this work, lowering bonding temperature significantly decreases induced residual stresses. Therefore, low Cu-Sn-In SLID process was utilized to bond Si and sapphire under various conditions. The microstructural evolution (thermo-) mechanical properties of joints were studied. results showed that bonds composed a single Cu <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</inf> (Sn, In)...

Micro/nano thermogravimetry (TG) employing MEMS has significant potential to improve the minimum sample mass and resolution as compared commercial TG instruments. Although there have been a few previous reports on TG, none of them critically analysed obtained curve in detail. In this work, we designed fabricated microelectromechanical thermogravimetric device (MMTG) with integrated microheaters temperature sensors. The sensitivity was estimated be 0.89 pg/Hz which outperforms standard...

In this paper, we have demonstrated a hydrothermal approach to grow ZnO nanowires (NW) on top of microcantilever dimension 250μm × 90μm 0.7μm and investigated the effect these over mechanical properties using Laser Doppler Vibrometry (LDV) Nanoindentation studies. Experimental results show that growth increases its spring constant. Furthermore, based experimental changes in resonant frequency, also calculated stress developed due considering both surface geometric independently. We found...

Cu-Sn SLID is an increasingly popular bonding technique with applications in such as hermetic sealing of microbolometers. A moderate pressure necessary to compensate for the surface roughness electroplated layers and break Sn oxide layer, thereby reducing risk voiding. However, pressures increase squeeze-out during process, which has potential destroy MEMS or ROIC devices. To prevent this issue, alternative bondline geometry consisting 3x50µm wide bond rails 25µm gaps was manufactured...