Tongyu Zhang

ORCID: 0000-0003-2603-0200
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Silicon Carbide Semiconductor Technologies
  • Electromagnetic Compatibility and Noise Suppression
  • Induction Heating and Inverter Technology
  • Chemical Looping and Thermochemical Processes
  • HVDC Systems and Fault Protection
  • Advanced DC-DC Converters
  • Medical Research and Treatments
  • GNSS positioning and interference
  • Power Systems and Renewable Energy
  • Regional Development and Environment
  • Educational Reforms and Innovations
  • Catalytic Processes in Materials Science
  • Microgrid Control and Optimization
  • Ultrasonics and Acoustic Wave Propagation
  • Catalysis and Oxidation Reactions
  • Video Coding and Compression Technologies
  • Image and Video Quality Assessment
  • Energy Harvesting in Wireless Networks
  • Solar-Powered Water Purification Methods
  • Target Tracking and Data Fusion in Sensor Networks
  • Underwater Acoustics Research
  • Optical measurement and interference techniques
  • Advanced Combustion Engine Technologies
  • Ga2O3 and related materials
  • Direction-of-Arrival Estimation Techniques

Tongji University
2025

Xi'an Jiaotong University
2006-2024

State Key Laboratory of Electrical Insulation and Power Equipment
2022-2024

Beijing Union University
2023-2024

South China University of Technology
2024

Feng Chia University
2021

North China Electric Power University
2021

Dalian University of Technology
2019

The Synergetic Innovation Center for Advanced Materials
2019

Nanjing Tech University
2019

Cu clip-bonding is a promising packaging method for lower resistance, inductance, and higher reliability than wire-bonding. Previous studies only simply replace bond wires with clips on an individual die. However, current sharing thermal coupling issues among multichip modules are still big challenges in the clip-bonded silicon carbide (SiC) <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small> power module. In this article, novel source...

10.1109/tpel.2022.3141373 article EN IEEE Transactions on Power Electronics 2022-01-07

Silicon carbide (SiC) power modules are attractive in many applications due to the superiority of their semiconductor characteristics. However, subjected repetitive thermo-mechanical stress caused by mismatch coefficient thermal expansion between different layers materials. Moreover, relatively smaller die size SiC chips makes heat flux increase significantly, which brings new challenges management and reliability modules. To tackle these challenges, this article proposes a enhanced...

10.1109/tpel.2021.3125329 article EN IEEE Transactions on Power Electronics 2021-11-08

This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power module packaging with optimized electrical and thermal performances. The structure of the is to stack two switches up down cooling system decoupling circuit inside module. structural characteristics realize co-optimization switching performance, management, electromagnetic interference (EMI) issue SiC module, which effectively solve contradiction in optimization performance. In addition, by optimizing...

10.1109/jestpe.2022.3210440 article EN IEEE Journal of Emerging and Selected Topics in Power Electronics 2022-09-27

Due to the outstanding material properties, silicon carbide (SiC) power device is most promising alternative devices and can work at higher junction temperature. However, existing packaging technologies obstruct use of SiC high temperature impede continued exploration in high-temperature applications. This article proposes a novel hermetic metal method called compact-interleaved package. The module handles mentioned problems from three key considerations: parasitic parameters, direct...

10.1109/tpel.2022.3198835 article EN IEEE Transactions on Power Electronics 2022-08-15

The positioning accuracy of GNSS receiver mainly depends the two factors. One is precision ranging, and other geometric distribution navigation satellites. In this paper, User Range Error (URE) analyzed at first. Secondly, an evaluation method URE global with precise products, including satellite ephemeris clock bias, ionosphere grid, proposed. Finally, recent products provided by analysis center international Monitoring Assessment System (iGMAS) are used for assessment Global accuracy....

10.1109/cgncc.2014.7007297 article EN 2014-08-01

With the development of high-temperature packaging technology, silicon carbide (SiC) MOSFETs can operate under conditions with junction temperatures exceeding 175℃, providing a solution for pulsed power applications facing instantaneous high currents and significant temperature fluctuations. However, electro-thermal coupling behaviors safe operating area (SOA) SiC in wide range are unclear, there is lack guiding principles module heat dissipation design applications. In this paper, an model...

10.1109/tpel.2024.3409540 article EN IEEE Transactions on Power Electronics 2024-06-04

In H.264/AVC, a novel criterion named the rate distortion optimization (RDO) is employed to select optimal coding modes for each macroblock (MB) within intra prediction pictures, which can achieve high compression ratio while leading great increase in complexity and computational load unfortunately. this paper, fast mode decision algorithm based on integer transform adaptive threshold proposed. Before prediction, operations original image are executed find directions of local textures....

10.1109/icassp.2006.1660494 article EN 2006-08-02

Characterizing package parasitic inductance is significant for design, dynamic characteristic evaluation, thermal management, and insulation breakdown protection. As inductances become smaller the switching speed of power semiconductor becomes higher, traditional widely-used double pulse tests based on “ <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$L = V/({di/dt})$</tex-math></inline-formula> ” {\rm{...

10.1109/tpel.2023.3247890 article EN IEEE Transactions on Power Electronics 2023-02-22

Studying the rational allocation of urban space and public transportation resources to meet daily activity needs commuters is a major topic solve traffic problems for long time. In response above problems, this paper designs dynamic path planning algorithm residents' aiming at shortest commuting First, between residential nodes office via bus lines calculated through algorithm; then optimal ride scheme in programming algorithm. The simulates residents main area Beijing. simulation results...

10.1117/12.2684076 article EN 2023-06-14

SiC devices have excellent characteristics compared with silicon devices. But its superiority is not fully utilized in some occasions, where the operating ambient temperature high, cooling system constricted, high power density and decreased size needed. In this paper, thermal coupling effect which vital to further improving module mentioned occasions investigated by physical analytical derivation finite element method (FEM) analysis at first. Several designing guidelines for are presented...

10.1109/wipdaasia49671.2020.9360285 article EN 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) 2020-09-23

Monoclinic phase Bi6Mo2O15 sub-microwires were fabricated by one-step molten salt method. These found to be much more active than Bi2MoO6 in photocatalytic degradation of rhodamine B (RhB) under sunlight irradiation. The velocity is 98% four times which might attributed its surface oxygen atoms surrounding Bi elements. In particular, the individual ultra-long (∼60 µm) sub-microwire was employed as an ultraviolet photodetector, shows ultrahigh quantum efficiency 2.95 × 107% a wavelength 254...

10.1016/j.rinp.2019.02.053 article EN cc-by Results in Physics 2019-02-25

Wall thickness is one of the most important quality index for those large aerospace thin-walled parts. In industrial site, ultrasonic has been widely employed wall inspection, but measurement process generally hand-held and point-by-point. Thus, it time-consuming amount labor One problem may arise, how to increase efficiency. this research, a using scanning parts proposed. The isoplanar-based modelled extract coordinates measuring points. To meet requirements normal incidence stable control...

10.1109/metroaerospace.2019.8869663 article EN 2022 IEEE 9th International Workshop on Metrology for AeroSpace (MetroAeroSpace) 2019-06-01

For the case of single snapshot, integrated SNR gain could not be obtained without multiple snapshots, which degrades mutual coupling correction performance under lower case. In this paper, a Convex Chain MUSIC (CC-MUSIC) algorithm is proposed for L-shaped nonuniform array with snapshot. It an online self-calibration and does require prior knowledge matrix initialization calibration source known position. An optimization approximation between no covariance interpolated transformation...

10.1155/2015/969042 article EN Mathematical Problems in Engineering 2015-01-01

An 8-antenna broadband MIMO array design for the fifth-generation (5G) smartphone application is proposed. The proposed antenna element has a small size of 33×5.5 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , and it composed feeding structure pair asymmetric grounded element. This can completely cover 5G New Radio Band n77/n78 (3.3–4.2 GHz), good isolation better than 11 dB realized between any two adjacent elements across bands...

10.23919/isap47258.2021.9614566 article EN 2022 International Symposium on Antennas and Propagation (ISAP) 2021-10-19

The theoretical operating temperature of Silicon Carbide power semiconductors is much higher than that traditional silicon semiconductors. Due to mismatched packaging and integration technologies, there a lack research on the characteristics unipolar semiconductor over wide range, which hinders development electronic technology towards high density. In this paper, bipolar planar MOSFET Schottky diodes as typical devices at extremely temperatures are discovered investigated, based static...

10.1109/peas58692.2023.10395696 article EN 2023-11-10

In recent years, railway safety accidents have repeatedly occurred. Any omission in the process of management or operation can easily very serious consequences. This study aimed to examine causes and transmission mechanisms risks engineering departments. First, multi-objective particle swarm optimization algorithm was employed determine key risk factors, allowing for indicator screening that line with requirements practical applications. Then, Bayesian networks were used, their structure...

10.3390/app14072739 article EN cc-by Applied Sciences 2024-03-25
Coming Soon ...