A5042632385- Electrodeposition and Electroless Coatings
- 2D Materials and Applications
- Electronic Packaging and Soldering Technologies
- Gas Sensing Nanomaterials and Sensors
- Nanofabrication and Lithography Techniques
- MXene and MAX Phase Materials
- Nanoporous metals and alloys
- Virology and Viral Diseases
- Electron and X-Ray Spectroscopy Techniques
- Plasma Diagnostics and Applications
- Semiconductor materials and devices
- Copper Interconnects and Reliability
- Respiratory viral infections research
- Electronic and Structural Properties of Oxides
- Quantum Dots Synthesis And Properties
- Nanomaterials and Printing Technologies
- Metallurgical and Alloy Processes
- ZnO doping and properties
- Metal and Thin Film Mechanics
- 3D IC and TSV technologies
- SARS-CoV-2 and COVID-19 Research
- Chalcogenide Semiconductor Thin Films
KU Leuven
2015-2021
IMEC
2015-2021
McGill University
2020
Baikal State University
2020
Irkutsk Research Institute of the Forestry Industry
2020
We demonstrate the impact of reducing agents for Chemical Vapor Deposition (CVD) and Atomic Layer (ALD) WS2 from WF6 H2S precursors. Nanocrystalline layers with a two-dimensional structure can be obtained at low deposition temperatures (300-450 °C) without using template or anneal.
In this paper we report on electrodeposition of CuNi alloys with low Ni content for applications in three-dimensional stacking integrated circuits (SIC). For practical reasons related to compatibility SIC processing, a common sulfate-based electrolyte solution was chosen and the high copper/low nickel deposited achieved through introduction organic additive benzotriazole (BTA). BTA is known as strong inhibitor Cu deposition, but its effects alloy deposition were not before. We hypothesized...
Electrodeposition is a prevailing method in fabrication of Cu interconnects microelectronics due to its ability fill complex structures having wide range critical dimensions. A typical acidified electrolyte contains number additives, organic and inorganic species ppm amounts, with specific role the plating process. The additives have been extensively studied past couple decades, grouped according their filling/creating features for applications. This categorization not uniform one, it might...
A pressing issue in flip-chip and stacked integrated circuit (SIC) technology is the breakdown of microbumps over time. These are physical electrical connections between chips. They consist out Cu stages on both chips which typically soldered together by Sn. Due to diffusion electromigration, Sn form two intermetallic phases 3 induces microvoids at Sn/Cu interface causing turn microbump. Chemical modelling shows that a CuNi alloy, with an approximate 9:1 Cu:Ni ratio, doesn’t compound thus...
We investigated the benzotriazole enabled growth of low Ni content (5–15 at.%) CuNi alloy deposits by characterisation its morphology and elemental composition as a function substrate metal (Cu Ni), charge density, current potential-time response measured during electrodeposition. Alloy deposition starts in favor Cu, forming Cu-rich layer on islands Cu after which aggregates only form substrate, due to ability (BTAH) chemically bond but not surface. Furthermore, preferably grain boundaries,...