Seungho Ryu

ORCID: 0009-0004-3103-0429
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About
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Research Areas
  • Semiconductor materials and devices
  • Advanced Memory and Neural Computing
  • Advancements in Semiconductor Devices and Circuit Design
  • Ferroelectric and Negative Capacitance Devices
  • Advancements in Photolithography Techniques
  • Electronic Packaging and Soldering Technologies
  • Nanowire Synthesis and Applications
  • Gas Sensing Nanomaterials and Sensors
  • Thin-Film Transistor Technologies
  • Copper-based nanomaterials and applications
  • CCD and CMOS Imaging Sensors
  • 3D IC and TSV technologies
  • Plasma Diagnostics and Applications
  • Engineering Applied Research
  • Neural Networks and Reservoir Computing
  • ZnO doping and properties
  • Copper Interconnects and Reliability

Korea University
2024

Dongbu HiTek (South Korea)
2008

Yeungnam University
2006

Oregon State University
2006

Virginia Tech
2002

Abstract Capacitorless two‐transistor (2T0C) dynamic random‐access memory (DRAM) cells comprising oxide thin‐film transistors (TFTs) show potential as low‐power and high‐density DRAM cells; however, the multiply–accumulate (MAC) operation using these is not yet realized. In this study, 2T0C amorphous indium–tin–gallium–zinc TFTs are fabricated for MAC operations. a cell, one transistor acts write other read transistor, whose gate capacitance corresponds to data storage capacitance. The have...

10.1002/admt.202302209 article EN cc-by-nc-nd Advanced Materials Technologies 2024-05-09

Abstract In this study, we demonstrate binary and ternary logic-in-memory (LIM) operations of inverters NAND NOR gates comprising nanosheet (NS) feedback field-effect transistors (FBFETs) with a triple-gated structure. The NS FBFETs are reconfigured in p- or n-channel modes depending on the polarity gate bias voltage exhibit steep switching characteristics an extremely low subthreshold swing 1.08 mV dec –1 high ON/OFF current ratio approximately 10 7 . Logic circuits consisting perform logic...

10.1038/s41598-024-57290-w article EN cc-by Scientific Reports 2024-03-18

A novel approach to deposit transparent thin films is reported. This uses a continuous-flow microreactor generate flux of nanoparticles which then impinge on heated substrate. The as-deposited film consists highly nanocrystalline with dilated optical bandgap . Functional metal-insulator-semiconductor field-effect-transistors (MISFETs) were successfully fabricated using this technique after post-air-annealing process. MISFET an effective mobility and current on-to-off ratio was produced....

10.1149/1.2372228 article EN Electrochemical and Solid-State Letters 2006-11-21

Abstract In this study, a triple‐gated transistor with p + ‐i‐n silicon nanosheet (NS) is proposed as single synaptic device, and bidirectional functions are realized using reconfigurable memory characteristics. The NS features steep switching bistable characteristics subthreshold swing below 5 mV dec −1 an ON/OFF current ratio of ≈5 × 10 6 for both the n‐ p‐channel modes. This exhibits electrically symmetric ON 1.02 Moreover, weight updates binarized spike‐timing‐dependent plasticity...

10.1002/aelm.202300764 article EN cc-by Advanced Electronic Materials 2024-03-11

In this study, we investigate the gate-bias stability of triple-gated feedback field-effect transistors (FBFETs) with Si nanosheet channels. The subthreshold swing (SS) FBFETs increases from 0.3 mV dec

10.1088/1361-6528/ad3b04 article EN cc-by-nc-nd Nanotechnology 2024-04-05

10.7567/ssdm.2008.p-2-14 article EN Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials 2008-09-25

Ferroelectric switching emission, dielectric and pyroelectric emission were studied by patterning images on electron resist for lithography applications. It was observed that the is most acceptable a high throughput 1:1 projection application. A demonstrated with line widths of 30 /spl mu/m utilizing emission. degradation property material during repeated heating cycles below phase transition temperature ferroelectric material. Annealing excursions above prevented emitter.

10.1109/isaf.2000.941544 article EN 2002-11-11
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