A5083929505- Electronic Packaging and Soldering Technologies
- Hydrogen Storage and Materials
- Electrocatalysts for Energy Conversion
- 3D IC and TSV technologies
- Micro and Nano Robotics
- Silicon Carbide Semiconductor Technologies
- Thermodynamic properties of mixtures
- Advanced battery technologies research
- Spectroscopy and Quantum Chemical Studies
- Advanced Sensor and Energy Harvesting Materials
- Injection Molding Process and Properties
- Material Dynamics and Properties
- Copper-based nanomaterials and applications
- Metal and Thin Film Mechanics
- Advanced Materials and Mechanics
- Advanced Materials Characterization Techniques
- Electrohydrodynamics and Fluid Dynamics
- Rheology and Fluid Dynamics Studies
- Conducting polymers and applications
- Hemoglobin structure and function
- Metallic Glasses and Amorphous Alloys
- NMR spectroscopy and applications
- Granular flow and fluidized beds
- RFID technology advancements
- Recycling and Waste Management Techniques
Tsinghua University
2024-2025
Norsk Hydro (Germany)
2025
University of California, Berkeley
2024
Lawrence Berkeley National Laboratory
2024
Inner Mongolia Normal University
2023
Fujian University of Technology
2021
Hong Kong University of Science and Technology
2011-2013
University of Hong Kong
2011-2012
Abstract An active droplet system, programmed to repeatedly move autonomously at a specific velocity in well‐defined direction, is demonstrated. Coulombic energy stored oversaturated interfacial assemblies of charged nanoparticle‐surfactants by an applied DC electric field and can be released on demand. Spontaneous emulsification suppressed increase the stiffness assemblies. Rapidly removing releases explosive event that propels droplet, where thousands microdroplets are ballistically...
In this study, we use molecular dynamics simulations of liquid water to investigate how shear thinning affects the viscosity by structural changes hydrogen bond network. The effect on can be divided into two parts: shear-induced destruction network and influence structure viscosity. First, strong destroys tetrahedral structures thus reduces connectivity It is mainly because deformation, characterized compression expansion axes, respectively, triggers formation bonds, resulting in anisotropic...
Abstract The advance of printed electronics is significantly bolstered by the development liquid‐state that overcome inherent limitations in flexibility and reconfigurability solid‐state electronics. By integrating biocompatibility conductivity sulfonated polyaniline (S‐PANI) phytic acid (PA) with structured liquids, highly conductive all‐liquid threads are developed. dense packing overlap PA/S‐PANI complexes at an oil/water interface promotes in‐plane electron transport, standard four‐point...
In aqueous solutions, the impact of ions on hydrogen bond networks plays a crucial role in transport properties. We used molecular dynamics simulations to explain how affect viscosity through structural changes. developed quantitative model describe effect viscosity. The comprises two parts: addition alters networks, and changes exponentially lead influence involves following mechanisms: first, can disrupt tetrahedral structures within first solvation shell into three-coordinated...
Structural indicators, also known as structural descriptors, including order parameters, have been proposed to quantify the properties of water account for its anomalous behaviors. However, these mainly designed bulk water, are not naturally transferrable vicinity ions due disruptions in immediate neighboring space and a resulting loss feature completeness. To address non-bulk defects, we introduced indicator that draws on concept clique number from graph theory criterion agglomerative...
Abstract It remains a challenge to produce soft robots that can mimic the responsive adaptability of living organisms. Rather than fabricating from bulk hydrogels,hydrogels are integrated into interfacial assembly aqueous two‐phase systems generate ultra‐soft and elastic all‐aqueous aquabots exhibit adaptability, shrink on demand have electrically conductive functions. The adaptive functions provide new platform develop minimally invasive surgical devices, targeted drug delivery systems,...
Small Outline Transistor (SOT) packages, widely used in consumer electronics, are very small, inexpensive surface-mount plastic molded packages. In order to maximize product throughput, the array matrix is employed for products fabrication, which leads a potential critical wire sweep issue SOT package during transfer molding process. The unreasonably large will extremely influence reliability, and even lead failure of product. this study, both experimental simulated works were resorted...
Small outline transistor (SOT) packages, because of their low cost and profile, are widely used in consumer electronics. Ni/Fe alloy (A42) is the most leadframe material SOT packages its good formability coefficient thermal expansion (CTE) match with silicon die. The very small size allow a higher package density on board, but close proximity make management difficult. conductivity A42, which less than one tenth that copper, makes conduction even more Thus, method copper plating A42 to...
Small Outline Transistor (SOT) packages, due to their low cost and profile, are widely used in consumer electronics. Ni/Fe alloy (A42) is the most leadframe material of SOT packages because its cost, good formability CTE (coefficient thermal expansion) match with silicon die. The very small size allow a higher package density on board, but close proximity make management difficult. conductivity A42, which less than one tenth that copper, makes conduction even more Thus, method copper plating...
Radio frequency identification (RFID) is a rapidly developing technology which uses radio signals for automatic of objects. In this paper, novel design an active RFID packaged on flexible film presented. The designed ultra-high (UHF) tag consists thin battery, RF chip and antenna, provides many advantages, including small size, light weight, flexibility in shape. materials geometric structures were selected optimized based finite element method (FEM) simulation with considerations the...
In order to maximize product throughput, an increasing number of electronic packages, such as Small Outline Transistor (SOT) package, are manufactured in a package array mold. Due the complicated structure design and mold cavity, wire sweep is becoming increasingly severe problem. this study, numerical model which had been validated by experimental work was used for analysis. Firstly, leadframe studied. Given thin thickness relative position bond loop, has very limited influence on value....