A5101423729- Advanced Surface Polishing Techniques
- Advanced machining processes and optimization
- Thin-Film Transistor Technologies
- Silicon and Solar Cell Technologies
- Advanced Machining and Optimization Techniques
- Diamond and Carbon-based Materials Research
- Nanowire Synthesis and Applications
- Force Microscopy Techniques and Applications
- Copper Interconnects and Reliability
- Silicon Nanostructures and Photoluminescence
- Molecular Junctions and Nanostructures
- Food Quality and Safety Studies
- Agriculture, Soil, Plant Science
- Electrostatic Discharge in Electronics
- Musculoskeletal synovial abnormalities and treatments
- Fuel Cells and Related Materials
- Magnesium Alloys: Properties and Applications
- Semiconductor materials and devices
- Polyamine Metabolism and Applications
- Advanced Sensor and Energy Harvesting Materials
- Gout, Hyperuricemia, Uric Acid
- Vascular Procedures and Complications
- Elbow and Forearm Trauma Treatment
- Nanofabrication and Lithography Techniques
- Hydrogen Storage and Materials
Jeonbuk National University
2019-2024
Chonbuk National University Hospital
2018-2024
Weatherford College
2020
Pohang University of Science and Technology
2009-2017
Hanyang University
2007-2014
Center for Nano Science and Technology
2014
Institute of Nano Science and Technology
2014
Sungkyunkwan University
2008-2010
Magnesium alloys are biodegradable metals receiving increasing attention, but the clinical applications of these materials delayed by concerns over rapid corrosion rate and gas formation. Unlike corrosion, which weakens mechanical properties, formation issue has received little attention. Therefore, we evaluated biological effects for Mg implants through preclinical (immersed in Earle's balanced salt solution vivo) studies. The immersion test examined volume composition. vivo study also...
Abstract Chemical mechanical planarization (CMP) has become one of the most critical processes in semiconductor device fabrication to achieve global planarization. To an efficient for node dimensions less than 32 nm, a comprehensive understanding physical, chemical, and tribo-mechanical/chemical action at interface between pad wafer presence slurry medium is essential. During CMP process, some issues such as film delamination, scratching, dishing, erosion, corrosion can generate defects...
We report a unique, highly conductive, dendrite-inhibited, solid-state polymer electrolyte platform that demonstrates excellent battery performance at subzero temperatures. A design based on functionalized inorganic nanoparticles with interconnected mesopores contain surface nitrile groups is the key to this development. Solid-state hybrid electrolytes succinonitrile (SN) and porous were fabricated via simple UV-curing process. SN effectively confined within mesopores. This stimulated...
Delirium is a serious complication for elderly patients after orthopedic surgery. The purpose of this study was to assess the etiology and related factors delirium surgery in Korea.We retrospectively reviewed medical records 3,611 over 50 years who had age (50s, 60s, 70s, > 80s), type anesthesia (general, spinal, local), operation time (more than 2 hours vs. less hours), surgical site (spine, hip, knee, or others), (trauma disease) were compared determine possible risk surgery.Of patients,...
The generation of pad debris during the chemical mechanical planarization (CMP) process was studied. A fresh conditioned with deionized water alone without polishing any wafer in order to characterize exclusively. It found that presented several size ranges irregular shapes, mostly agglomerated form. Polishing experiments were performed continuously conditioning pad, and byproducts gathered times process. No slurry this process, but dispersion some silica particles observed. CMP processes...
In this study, a ruthenium (Ru) chemical mechanical planarization (CMP) slurry was developed and characterized to fabricate Ru bottom electrodes in capacitor structures. Sodium periodate chosen as both the oxidant etchant due its strong oxidizing power. The effect of on etching polishing behaviors investigated function concentration condition. largest removal rate 70 nm/min obtained 0.1 M 2 wt % alumina particles at pH 9 pressure 4 psi. Planarization isolation each successfully performed with slurry.
This study documents our experience with acute forearm compartment syndrome after percutaneous transradial coronary artery intervention and suggests several strategies to achieve good results. A retrospective review identified the medical records of four patients who were treated by urgent fasciotomy. The mean time from onset symptoms operation was 5.7 hours. In three cases bleeding radial rupture at puncture site, one case caused brachial level distal humerus proximal forearm. We obtained...
Background: Osteochondral defects of the talus can be effectively treated using microfracture, which is technically safe, accessible, and affordable. However, fibrous tissue fibrocartilage comprise majority repairs resulting from these procedures. These types lack mechanical characteristics native hyaline cartilage might significantly contribute to decline in long-term outcomes. Recombinant human-bone morphogenetic protein–2 (rhBMP-2) has been shown promote matrix synthesis increase...
In this paper, the polishing and etching behavior of single polycrystalline silicon were studied. Prior to chemical mechanical (CMP) process, surfaces treated with dilute hydrofluoric acid (DHF) remove native oxides. The surface analysis shows that poly contains trace amount oxygen even after DHF treatment. static dynamic etch rates, removal rates measured as a function slurry pH. showed higher rate than poly. After measurements, roughness more hydrophilic which indicates is different from...
During chemical mechanical planarization (CMP), a copper/low- k surface is often contaminated by abrasive particles, organic materials and other additives. These contaminants need to be removed in the subsequent cleaning process with minimum material loss. In this study, dilute amine-based alkaline solution used along physical force form of megasonic energy remove particles contaminants. Tetramethylammonium hydroxide (TMAH) monoethanolamine (MEA) are as an base complexing agent,...
Post Ru CMP cleaning solution for particle (alumina) removal was successfully developed by controlling surface zeta potentials and choosing the proper etchant. The of both alumina particles were measured as a function pH. It found that 1000 ppm citric is good enough to modify at pH 10. At this condition, will have negative which cause repulsion between them. This effect confirmed measuring adhesion force using distance method different values. lowest an observed in acid However, can be...
In the silicon dioxide chemical–mechanical polishing (CMP) process, one of most challenging issues is formation defects such as scratches. this study, scratch behavior and CMP performance were evaluated on high-density plasma oxide (HDP), plasma-enhanced tetraethylorthosilicate (PETEOS), borophosphosilicate glass (BPSG) wafers. To evaluate number scratches after contaminated abrasive particles removed using an optimized post-CMP cleaning process consisting scrubber dilute SC1 megasonic...
In general, HF cleaning is well known to remove the slurry residue particles in W plugs. chemistry lifts off by etching plug during scrubbing and effectively removes particles. It sometimes impossible apply on due degradation of electrical characteristics a device. this paper, post CMP process proposed without applying chemistry. After CMP, recessed plugs are created, therefore they easily trap process. These not easy brush when NH4OH used for because surface can reach area Higher profiles...
We report the arthroscopic and clinical findings of patients with chronic wrist pain following distal radius fracture (DRF) who underwent diagnostic arthroscopy arthroscopically-assisted tailored treatment. retrospectively analyzed records 15 DRF, treatment from 2010 to 2017. The average patient age was 44 years (range, 20–68 years), time injury 21 ± 23.46 months 3–96 months) follow up period 20.13 8.71 12–39 months). functional outcome evaluated by comparing preoperative final values range...