Gabriel Fellner

ORCID: 0000-0001-6061-4280
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About
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Research Areas
  • Electrostatic Discharge in Electronics
  • Electromagnetic Compatibility and Noise Suppression
  • Integrated Circuits and Semiconductor Failure Analysis
  • Physical Unclonable Functions (PUFs) and Hardware Security
  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • High voltage insulation and dielectric phenomena
  • Transportation Systems and Safety
  • Radio Frequency Integrated Circuit Design
  • Plasma Diagnostics and Applications

Graz University of Technology
2021-2025

10.1109/temc.2025.3549294 article EN IEEE Transactions on Electromagnetic Compatibility 2025-01-01

Well-insulated portable devices are exposed to field coupled impulsive ESDs if they carried e.g., in a backpack. These pulses created by tribo-charging of metallic objects as result movement and subsequent discharges. Due the size low charge voltages, frequency spectrum exceeds 5 GHz. The can damage or upset devices. paper quantifies voltages transient strength reproducing typical scenario capturing fields with bandwidth more than 10 estimated comparing measurements numerical modeling

10.1109/emceurope51680.2022.9901123 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2022-09-05

10.1109/emceurope59828.2024.10722655 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2024-09-02

This paper presents a novel peak detect and hold (PDH) circuit for the measurement of voltage electromagnetic-field probes. These probes are used to capture fields generated by electrostatic discharge (ESD) events in non-grounded portable devices. Therefore, combining small size, low power consumption nano-second operation is needed. A topology using discrete bipolar transistor structure with OTA common-base storage capacitor charge control optimally meets requirements. The performance...

10.1109/tim.2023.3289555 article EN IEEE Transactions on Instrumentation and Measurement 2023-01-01

ESD susceptibility scanning is an effective method to find the causes of soft failures in electronic systems. A local probe used scan system for sensitive areas. However, voltages induced by are often unknown. This paper quantifies from different probes when injected into traces and flex cables, compares values caused IEC 61000-4-2 gun contact mode. The goal guide reader select voltage levels during scans a way that avoids may be associated with injection cause failure.

10.1109/emc/si/pi/emceurope52599.2021.9559374 article EN 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium 2021-07-26

As a first step in survey of the ESD risk to mobile devices, small, battery powered portable system that emulates device for purpose capturing its electrostatic discharge environment is described. The contains multiple electric, magnetic field sensors as well current sensor capture events and their associated transient fields. Bandwidths > 2 GHz are achieved. connected via an analog optical fiber. It intended provide reference data fields captured controlled conditions order determine type...

10.1109/emc/si/pi/emceurope52599.2021.9559289 article EN 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium 2021-07-26

ESD discharges to antennas can damage the RF front end. In particular, with highly inductive ground connections allow large ESD-induced voltages at their terminals. This work investigates properties of an switch used as antenna tuner by measuring and currents its terminals building a SPICE model. The goal is predict threshold when in

10.1109/emc/si/pi/emceurope52599.2021.9559387 article EN 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium 2021-07-26
Felicitas Modlinger F. Heidler Christian Karch Jesper Lansink Rotgerink Stephen Dominiak and 95 more Gerd Dietrich Zdeněk Řezníček Alessandro Giordani Emiliano Scione Alice Nicole Casling Giovanni Maria Mongini Maria Sabrina Sarto J. M. de Pedro Albertino Arteiro Robert Honke Yuri Konter Koen Blaauw Ryota Sakai Koh Watanabe Sosuke Ashida Hiraku Uehara Satoshi Tanaka Makoto Nagata Marc Pous Marco A. Azpúrua Dongsheng Zhao Ferran Silva Toru Kasai Toshio Onigata Carlos J. Arranz V. Marchese Jean‐Michel Léger María Vallmitjana Thomas Jäger Annamaria Sârbu Paul Bechet Sara Linder Kia Wiklundh Karina Fors Peter E. Holm Antoine Duguet Tristan Dubois Geneviève Duchamp David T. Hardy Franck Salvador Brian Leeman Tim Claeys Sofie Pollin Hans Hallez Davy Pissoort Aleksandr Ovechkin Dries Vanoost Guy A. E. Vandenbosch Yukihiro Tozawa Takeshi Ishida Jiaqing Wang Osamu Fujiwara Abraham Reithofer Maoxing Zhang Jan Hansen David Pommerenke Esd Spark Leonie Wiesel Carina Krieger Gabriel Fellner Amin Pak Lukas Pertoll Stefan Haensel Janina Teller Stephan Frei Alexandre Boyer Sébastien Serpaud Sonia Ben Dhia Fpga Maximilian Lemke Tobias Dörlemann Arne Pahl Kai-Uwe Rathjen Stefan Dickmann Damian Patrick Leonardo Koch Niek Correa Malburg Frank Moonen Georgios Mademlis L. Hasselgren Henrik Holst Bálint Pintér Arnold Bingler Márk Csörnyei Alfredo De Leo Ramiro Serra Paola Russo Mariani Primiani Jan Ückerseifer Shuchen Xu Frank Gronwald Alan Aliyali Mattias Elfsberg Tomas Hurtig P. Vallejós

10.1109/emceurope57790.2023.10274158 article RO 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2023-09-04

This paper describes two modifications to an ESD generator: One that approximates human skin ESD, and another one discharges body worn equipment. generators follow the IEC 61000-4-2 or related standards. Variations mainly refer changes in RC network remove rise time filtering structures for obtaining times contact mode faster than 0.85 ns. from equipment shows up 3 larger peak values 3.75 A/kV specified standard. To test equipment, it is reasonable increase current a given voltage. The first...

10.1109/emceurope57790.2023.10274271 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2023-09-04

Downscaled semiconductors are at risk of CDM like ESD events during manufacturing, packaging, testing and placement. The reduction in silicon area spent for protection circuits modern ICs makes the devices more vulnerable by reducing damaging thresholds. Following this trend industry it is getting crucial to monitor processes where these handled. A new type sensor using multiple antennas along a coax-cable used locate events. Due large quantity antennas, has potential be complex environments...

10.1109/emceurope57790.2023.10274257 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2023-09-04

Detecting personal ESD by using electric field sensors attached to the clothing was evaluated across different realistic charge and discharge scenarios. The event itself is detected associated fast collapse of at human. Its magnitude determined E-field change calibration that relates on body voltage body. Two are used enhance accuracy. One these positions hereby front-side leg other back-side. paper explains measurement principle gives example results.

10.1109/emceurope51680.2022.9901093 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2022-09-05
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