Abstract A hermetic sealing method of sub‐millimeter‐sized microelectronic chiplets for wireless body implants is presented by ultrathin and electromagnetically transparent atomic layer deposition (ALD) coatings. Fully 3D conformal encapsulation wirelessly powered microdevices demonstrated both with without opening windows electrophysiological measurements. The embedding custom application‐specific integrated circuits (ASICs) radio frequency (RF) transmitters are encapsulated a stack...

We studied the effect of Gd doping on structural properties solution processed, crystalline In2O3 for thin-film transistor (TFT) application. With increasing in up to 20%, material structure changes into amorphous phase, and oxygen vacancy concentration decreases from 15.4 8.4%, M-OH bonds 33.5 23.7%. The field-effect mobility doped TFTs threshold voltage shifts positive with concentration. In addition, stability processed can also be improved by As a result, optimum is found ∼5% 5% Y2O3...

Abstract The emergence of stretchable devices that combine with conductive properties offers new exciting opportunities for wearable applications. Here, a novel, convenient and inexpensive solution process was demonstrated to prepare in situ silver (Ag) or platinum (Pt) nanoparticles (NPs)-embedded rGO hybrid materials using formic acid duality the presence AgNO 3 H 2 PtCl 6 at low temperature. reduction can convert graphene oxide (GO) simultaneously deposit positively charged metal ion NP...

A vastly enhanced capability to bi-directionally interface with cortical microcircuits in a clinically viable way is the ultimate aspiration neuroengineering. This necessitates paradigm shift neural system design beyond current bulky, monolithic constructs which are challenging scale past 100-200 channels due anatomic and engineering constraints. relying on spatially-distributed network of wireless microscale implantable sensors offers highly scalable, robust adaptive architecture for...

Networks of spatially distributed radiofrequency identification sensors could be used to collect data in wearable or implantable biomedical applications. However, the development scalable networks remains challenging. Here we report a wireless network approach that can capture sparse event-driven from large populations autonomous microsensors. We use spectrally efficient, low-error-rate asynchronous networking concept based on code-division multiple-access method. experimentally demonstrate...

Current state-of-the-art Brain-Machine Interfaces (BMIs) rely on invasive "passive" microelectrode technologies, which are prohibitively challenging to scale beyond several hundred channels due physical constraints. Further performance enhancement in BMIs relies the ability develop implantable sensor technologies that would be scalable thousands of without significant biological overhead. In this work., we describe prototype testing a distributed system CMOS "Neurograins," provide high...

Direct electronic communication with sensory areas of the neocortex is a challenging ambition for brain-computer interfaces. Here, we report first successful neural decoding English words high intelligibility from intracortical spike-based population activity recorded secondary auditory cortex macaques. We acquired 96-channel full-broadband recordings using microelectrode arrays in rostral and caudal parabelt regions superior temporal gyrus (STG). leveraged new processing toolkit to...

Transmitting meaningful information into brain circuits by electronic means is a challenge facing brain-computer interfaces. A key goal to find an approach inject spatially structured local current stimuli across swaths of sensory areas the cortex. Here, we introduce wireless multipoint patterned electrical microstimulation distributed epicortically implanted network silicon microchips target specific Each sub-millimeter-sized microchip harvests energy from external radio-frequency source...

The widespread H5 clade 2.3.4.4b highly pathogenic avian influenza virus (HPAI) poses a significant threat to both domestic and wild mammals because of its rapid genetic evolution, cross-species transmissibility, host-range expansion. increasing number cases in mammalian species highlights the need for proactive measures driven by One Health approach. In this study, we explored potential use previously developed Newcastle disease (NDV)-vectored vaccine expressing hemagglutinin (rK148/22-H5)...

This letter presents a miniaturized neural recording analog front-end (AFE) suitable for distributed sub-mm implants. Including reference generators, this AFE occupies an area of only 0.01 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , thanks to mostly digital architecture with more than half being scalable logic. Implemented in 65-nm CMOS, the is measured consume 3.2 μW power from 0.6-V supply, and achieves input-referred noise...

We describe a custom wireless power and data transmission (WPDT) link analyze its performance in prototype implantable sensor system of ensembles CMOS ASICs ("Neurograins") embedding 0.5 mm × planar microcoil antennas. use near-field RF at ~1 GHz for powering resonant 3-coil architecture including an implanted relay coil quadrant layout to maximize coverage area transfer efficiency. demonstrate successful WPDT across antenna cross-section benchtop proxy physiological tests. Demodulation...

Scalability of implantable neural interface devices is a critical bottleneck in enhancing the performance cortical Brain-Computer Interfaces (BCIs) through access to high density and multi-areal signals. This challenging achieve current monolithic constructs with 100-200 channels, often bulky tethering packaging, spatially distributed sensor approach has recently been explored by few groups, including our laboratories [1]. In this paper, we describe microscale (500 μm) programmable...

In this paper, the optimal design of a brushless direct current motor with three-dimensional (3D) structure using response surface methodology (RSM) is presented. There were two optimization goals: reduction cogging torque and maintenance back electromotive force to prevent performance degradation. For motors 3D structure, finite element method analysis essential, though it requires considerable computation time. Therefore, reduce time, was placed on 2D plane. Thereafter, corrected model...

To dramatically increase the scale and spatial resolution for future chronic electrocorticography (ECoG) applications, we propose a wireless brain-machine interface (BMI) system based on high number (up to 1000) of freely distributed, sub-mm sized (0.25 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) IC implants. The chip features an onchip antenna RF energy harvesting at 900 MHz data backscattering 10 Mbps. In order synchronize...

Development of an in situ technique for measuring electrochemical impedance spectra real time during experiment is described. The based on staircase voltammetry with relatively large step heights, which a series increasing potential steps are applied to system, and the resulting currents sampled. first derivatives thus obtained then converted ac current signals frequency domain, impedances computed from them. To demonstrate as tool studying electrode/electrolyte interface reaction, we chose...

The effects of high frequency repetitive transcranial magnetic stimulation on sensory perception and the pain tolerance thresholds were investigated applying both motor cortex medial frontal in normal study participants. Both significantly increased stimulation, whereas thresholds, but not was decreased stimulation. These results suggest dissociable modulating by regulating system, lateral system.

Implantable active electronic microchips are being developed as multinode in-body sensors and actuators. There is a need to develop high throughput microfabrication techniques applicable complementary metal-oxide-semiconductor (CMOS)-based silicon electronics in order process bare dies from foundry physiologically compatible implant ensembles. Post-processing of miniature CMOS chip by usual methods challenging the typically sub-mm size small hard handle not readily with standard...

Semiconductor products used in high-performance computing (HPC) and artificial intelligence (AI) applications require higher memory bandwidth, greater input/output (I/O) count, better power delivery network (PDN) performance improved heat dissipation characteristics. To meet these requirements, a 2.5D package architecture with Through Silicon Via (TSV)-bearing silicon (Si) interposer is mainly volume production. However, redistribution layer (RDL) emerging as cost effective alternative....

Wearable and implantable microscale electronic sensors have been developed for a range of biomedical applications. The sensors, typically millimeter size silicon microchips, are sought multiple sensing functions but severely constrained by power. To address these challenges, hardware programmable application-specific integrated circuit design is proposed post-process methodology exemplified the battery-less wireless microchips. Specifically, both mixed-signal radio frequency circuits...