The thermal management of semiconductor devices is still a hot topic. Most designers, who are aware the aspects IC design, know that new, cheaper and more efficient methods required to keep temperature electronic systems low. Research by different teams regarding cooling stacked die structures in progress. In this paper an improved characterization method will be presented determine flow dependent partial resistance integrated microchannel based heat sinks. This reliable does not demand...

Since the first microchannel heat sink was introduced, intense research on based sinks has been conducted to study transfer mechanism and fluid flow characteristics in microscale channel structures. In this paper determination of proper length sink(s) is presented. The main aim introduce a methodology define maximum applicable order achieve from substrate without realizing unnecessarily long channels. It important because superfluous parts channel(s) point view occupy areas where further can...

In this article, an innovative approach to enhance heat transfer mechanisms in 2.5-D heterogeneous packages by integrating microchannels into the silicon interposer is presented. An analytical model introduced determine main thermal properties of cooling system. To demonstrate performance device, a 3-D created, and total 12 cases for four scenarios are investigated numerically. The results compared with classical applying 10–100 cm3/min water flow microchannels. It demonstrated that case...

Airlines are constantly looking for ways to cut flight delays, in order enhance service quality and reduce operational costs. The goal of the data science contest, GE Flight Quest (https://www.gequest.com/c/flight), was make flights more efficient by improving accuracy arrival time estimates. set contest 128 GB size contained 252 columns arranged 34 tables. This paper presents my solution that won third prize under team name Taki. employs a 6-stage model consisting successive ridge...

In the frame of thermal management electronic devices, finding efficient cooling solutions next generation equipment is a hot topic. If new or improved solution presented it always requires characterization methods to prove benefits compared its predecessor. case microscale heatsink structures which are integral parts modern chip package level concepts, an measurement method needed analyse performance with different layouts and/or manufacturing technologies. This paper presents enhanced...

As microscale cooling structures are integral parts of modern chip level concepts, the understanding behavior different assemblies is desirable to create a novel co-design concepts where thermal design embedded into conventional IC flow. The first step general formula which describes heat transfer mechanism and can be implemented in CAD environments. This paper presents an analytical study this channel based structures. A closed also given calculate partial resistance. Numerical analyses...

In this article a new methodology is introduced to create ladder-type analytical thermal model of different microscale channel structures. The presented applicable determine the local heat transfer(s) and temperature distribution along depending on geometries, properties fluid wall temperature(s). cut down into several segments for each segment T-equivalent circuit created. obtained by applying subcircuit as building block can be used compact structures in electro/logi-thermal simulation...

The work presents a new solution proposal to the cooling of concentrator photovoltaic cells. In our concept microscale channels are integrated into back surface metallization, formed by electroplating copper around photoresist channel pattern. This approach has advantage that it no restrictions regarding solar cell material and technology. this we give description on process technology, perform mechanical simulations for feasibility approach, optimize geometry 20 × mm estimate performance...

This paper describes our solution for the GE Flight Quest 2 (FQ2) challenge, organized by Kaggle. FQ2 aimed at optimizing flight routes so that overall cost depending on fuel consumption and delay is as low possible. The contestants could use several data tables inputs, including aircraft positions destinations, weather information other aviation related data. Their task was to produce a plan each flight, given list of (latitude, longitude, altitude, airspeed) quadruplets. plans evaluated...

In many theories and applications, generalized models can give a good head start for further research where the implementation of new elements and/or boundary conditions could become quite complex. this paper development compact thermal model an infrared sensor will be presented. This includes not only resistances capacitances structure itself but radiative convective to ambience between plate heat source (thermal transfer impedance) which is important when are in close proximity....

Cooling of CPV devices is one the essential issues to enable full exploitation advantages light concentration. To address problem cooling this research work proposes an improved method for processing back metallization integrated microcoolers photovoltaic devices. The microcooler has advantage not being applicable a wide variety semiconductor solar cell and requiring any TIM material. proposed process based on evaporation titanium copper dual layer with subsequent photoresist patterning...

In the field of thermal management, engineers are well aware challenges posed by increasing level dissipation. Among many possible solutions to counter threat overheating, one is dealing with usage microscale heat exchangers, where forced air or liquid cooling solution integrated into electronic package itself. As System-on-Package integration not a straightforward task, fabrication steps have be fully developed before successful chip-level system ready used. this paper, as these steps, we...

Concentrator photovoltaics (CPV) is one of the promising solutions in fields green energy production. Their main advantage that concentration incident light significantly increases their efficiency compared to traditional photovoltaics. Unfortunately, also temperature, which has a negative effect on so, cooling CPVs an essential issue fully utilize potentials. The idea presented by our team use microchannels integrated into backside metallization PV-devices. proposed process based evaporated...

In this paper, a novel tool and methodology are introduced to create thermally driven digital cell placement capability that considers the cooling of integrated microscale heatsink structures. Normally, realization kind would require time-consuming computation fluid dynamics (CFD) simulations. With presented solution, CFD can be replaced by thermal simulator, which incorporates analytical compact models. By approach, determination precise local heat transfer coefficient(s) (thus efficiency)...