A5016857933- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Sensor and Energy Harvesting Materials
- Semiconductor materials and devices
- GaN-based semiconductor devices and materials
- Silicon Carbide Semiconductor Technologies
- Thermal properties of materials
- Copper Interconnects and Reliability
- Ga2O3 and related materials
- Nanomaterials and Printing Technologies
- Conducting polymers and applications
- Intermetallics and Advanced Alloy Properties
- Thermal Radiation and Cooling Technologies
- Electronic and Structural Properties of Oxides
- ZnO doping and properties
- Semiconductor Quantum Structures and Devices
- Ultrasound and Cavitation Phenomena
- Tactile and Sensory Interactions
- Thin-Film Transistor Technologies
- Fluid Dynamics Simulations and Interactions
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Welding Techniques Analysis
- Advanced Materials and Mechanics
- Advancements in Semiconductor Devices and Circuit Design
- Leaf Properties and Growth Measurement
Shandong University
2022-2024
China Electronic Product Reliability and Environmental Test Institute
2020-2024
Northeastern University
2023-2024
Shanghai Jiao Tong University
2023
Ministry of Industry and Information Technology
2017-2023
Fujian Electric Power Survey & Design Institute
2016-2023
Suzhou Research Institute
2023
Renji Hospital
2023
City University of Hong Kong, Shenzhen Research Institute
2023
Zhejiang Sci-Tech University
2023
Abstract In recent years, significant progress has been made in the research and development of conventional hydrogel sensors. However, hydrogels with special structures, achieved through specific designs or fabrication strategies, remains relatively scarce. Inspired by aloe, a specially structured (named Skin‐Polyvinyl alcohol‐Polyaniline‐AgNWs, S‐PPA) is successfully prepared skin. Innovatively utilizing hydrogen bonding interaction between ions water molecules, surface treated to create...
Abstract The development of bioinspired gradient hydrogels with self-sensing actuated capabilities for remote interaction soft-hard robots remains a challenging endeavor. Here, we propose novel multifunctional hydrogel that combines ultrafast actuation and high sensitivity robotic hand. network structure, achieved through wettability difference method involving the rapid precipitation MoO 2 nanosheets, introduces hydrophilic disparities between two sides within hydrogel. This distinctive...
Abstract To realize high performance flexible transparent electronics with extreme environmental adaptivity, Ag nanowires (Ag NWs) electrodes should simultaneously meet the requirements of high-temperature tolerance, chemical and mechanical robustness. Herein, a scalable NWs bundle micro-meshes embedded in polyimide BMs/ePI) conducting film via facile spray coating transfer method is reported. Due to synergistic effect micromesh architecture, BMs/ePI electrode exhibits thermal stability (370...
Designing a flexible transparent electronic device with biological functions is of great interest for the future wearable integrated artificial intelligence equipment. Nociceptor vitally important receptor sensory neuron, which responsible providing warning signal by recognizing noxious stimuli to reduce potential physical injury. Here, nociceptor demonstrated simulate based on indium tin oxide (ITO) memristor, exhibits forming-free and reproducible threshold resistive switching behaviors....
Nanoscale thermal transport at solid-liquid interfaces plays an essential role in many engineering fields. This work performs deep potential molecular dynamics (DPMD) simulations to investigate across copper-water interfaces. Unlike traditional classical (CMD) simulations, we independently train a learning (DLP) based on density functional theory (DFT) calculations and demonstrated its high computational efficiency accuracy. The trained DLP predicts radial distribution functions (RDFs),...
An energy-saving scheme that can simultaneously realize electromagnetic interference (EMI) shielding, passive solar radiative heating, and active Joule heating in a single wearable device is still huge challenge. Here, by combining the unique properties of Ti3C2Tx MXene biocompatible cellulose nanofibers (CNFs), flexible, degradable, antibacterial multifunctional Ti3C2Tx/CNF paper (∼0.6 Ω/sq) constructed through facile vacuum filtration strategy. The resultant not only exhibits an admirable...
Gallium nitride high electron mobility transistor (GaN HEMT) devices have become critical components in the manufacturing of high-performance radio frequency (RF) or power electronic modules due to their superior characteristics, such as saturation speeds and densities. However, heat characteristics GaN HEMTs make device level cooling a problem solve since performance degradation even failure may occur under temperatures. In this paper, we proposed 2.5D integration method with device-level...
Flexible transparent and biodegradable conductors with excellent performance are quite desirable for the development of portable electrical heaters electromagnetic interference (EMI) shielding. As a promising candidate, homogeneity stability required silver nanowire (Ag NW) network conductor to increase its reliability robustness. Herein, an optimally well organized micromesh NMs) electrode embedded in poly(l-lactic acid) NMs/ePLLA) is prepared without template by virtue coffee-ring effect....
A facile template-less spray-assembly strategy for ordered Ag nanowires micromesh (Ag NMs) fabrication is proposed inspired by the coffee ring effect, where NMs can be achieved on arbitrary substrates manipulating contact angle.
With the advent of next-generation smart panels, it is highly desirable to integrate multiple functions for application in intelligent buildings, human–machine interfaces, art exhibitions, etc.
Alloying Ga2O3 with Al2O3 yields diverse structural phases distinctive optoelectronic properties, making them promising candidates for ultrawide bandgap semiconductors in next-generation power electronics. Yet, there is a lack of sound knowledge the carrier dynamics (AlxGa1−x)2O3 alloys due to their complexity. Herein, we focus on ordered β-(AlxGa1−x)2O3 alloys, predict mobility, and determine intrinsic electron mobility limit based solving linearized Boltzmann transport equations from first...
High-performance electrical heaters with a rapid thermal response, homogeneous temperature distribution, and chemical mechanical robustness are desirable for inevitable use in various areas such as defrosting windows wearable thermotherapy. Herein, optimally engineered ordered Ag nanowire micromeshes partially embedded poly(ethylene terephthalate) matrix (Ag NMs/ePET) via facile spray coating transfer approach flexible transparent conductor heater applications, which exhibit slight sheet...
The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution. It observed that there a rotation phenomenon during current stressing by electron backscattered diffraction (EBSD). angle calculated, which indicated reorientation led decrease resistance joints. On other hand, β-Sn played critical role in determining migration Cu atoms migration. When between flow direction c-axis Sn (defined as α)...
Increasing power density and miniaturization in three-dimensional (3D) packaged electronics demand innovative thermal management. Yet, the performance of electrically insulated packages for is currently limited by ultralow conductivity conventional interface materials (TIMs) their poor ability directing heat current to sink. Herein, we have prepared a highly thermally conductive insulating TIM composite based on boron nitride nanobars (BNNB). The polar characteristics B–N bond BNNB outer...
Exploring interfacial thermal transport of a heterojunction interface is crucial to achieving advanced management for gallium nitride-based high electron mobility transistor devices. The current research primarily focuses on material enhancements and microstructure design at the interfaces epitaxial layers, buffer substrates, such as GaN/SiC GaN/AlN interface. Yet, influence different concentrations Al/Ga atoms roughness conductance (ITC) AlGaN/GaN interface, closest hot spot, still poorly...