A5004422633- Electronic Packaging and Soldering Technologies
- Advanced Sensor and Energy Harvesting Materials
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
- Tactile and Sensory Interactions
- Aluminum Alloys Composites Properties
- Injection Molding Process and Properties
- Surface Modification and Superhydrophobicity
- Silicon Carbide Semiconductor Technologies
- Metal Alloys Wear and Properties
- Electrodeposition and Electroless Coatings
- 2D Materials and Applications
- High Entropy Alloys Studies
- Additive Manufacturing and 3D Printing Technologies
- Copper Interconnects and Reliability
- Interactive and Immersive Displays
- Ferroelectric and Negative Capacitance Devices
- Fluid Dynamics and Heat Transfer
- Surface Treatment and Coatings
- ZnO doping and properties
- Advanced Memory and Neural Computing
- Graphene research and applications
- Powder Metallurgy Techniques and Materials
- Nanowire Synthesis and Applications
- Ga2O3 and related materials
Tsinghua University
2018-2024
State Key Laboratory of Tribology
2020-2023
Materials Processing (United States)
2020
Ministry of Education of the People's Republic of China
2020
Abstract The realization of liquid metal‐based wearable systems will be a milestone toward high‐performance, integrated electronic skin. However, despite the revolutionary progress achieved in many other components skin, flexible sensors still suffer from poor sensitivity due to insufficient resistance change metal deformation. Herein, nacre‐inspired architecture composed biphasic pattern (liquid with Cr/Cu underlayer) as “bricks” and strain‐sensitive Ag film “mortar” is developed, which...
Preventing condensation frosting is crucial for air conditioning units, refrigeration systems, and other cryogenic equipment. Coalescence-induced self-propelled jumping of condensed microdroplets on superhydrophobic surfaces serves as a favorable strategy against frosting. In previous reports, efforts were dedicated to enhance the efficiency by constructing appropriate surface structures surfaces. However, incorporation results in larger area available occur, leading an increase total amount...
Ag–Cu bimetallic nanoparticles, combining the advantages of both Ag and Cu, are a promising material for power electronic packaging. In this work, supersaturated Ag–7.3 wt % Cu alloy nanoparticle film was developed by using pulsed laser deposition. Unlike nanoparticles can conduct bonding in air without assistance reduction agent. The shear strength >20 MPa when temperature reached 300 °C, which above die standard (MIL-STD-883 K, 7.8 MPa) compatible with typical attach process. separating...
Hierarchically structured aluminum superhydrophobic surfaces are prepared, and it is demonstrated that appropriate microstructural size scale required to achieve improved droplet jumping anti-frosting performance of the surfaces.
Decreasing the interconnecting temperature is essential for 3D and heterogeneous device integrations, which play indispensable roles in coming era of "more than Moore". Although nanomaterials exhibit a decreased onset interconnecting, such an effect always deeply impaired because organic additives practical integrations. Meanwhile, current organic-free integration strategies suffer from roughness contaminants at bonding interface. Herein, novel bilayer nanoarchitecture simultaneously...
Future electronic skin systems require stretchable conductors and low-temperature integration of external components, which remains challenging for traditional metal films. Herein, a bioinspired design concept is reported to endow films with 200% stretchability as well room-temperature capability diverse components. It revealed that by controllable implantation defects, distinctive venation-mimicking cracking modes can be induced in strained films, leading profound regulation. An intriguing...
2D materials exhibit intriguing electrical and optical properties, making them promising candidates for next-generation nanoelectronic devices. However, the high contact resistance of to electrode material often limits ultimate performance potential In this work, we demonstrate a localized femtosecond (fs) laser irradiation process substantially minimize MoS2–metal contacts. A reduction exceeding three orders magnitude is achieved mechanically exfoliated MoS2, which remarkably improves...
The integration of 2D materials with other dimensional opens up rich possibilities for both fundamental physics and exotic nanodevices. However, current mixed-dimensional heterostructures often suffer from interfacial contact issues environment-induced degradation, which severely limits their performance in electronics/optoelectronics. Herein, we demonstrate a novel BN-encapsulated CuO/MoS2 2D-1D van der Waals heterostructure photodetector an ultrahigh photoresponsivity is 10-fold higher...
A pufferfish-inspired, interlayer regulation strategy is proposed to endow common metal films with either ultra-stretchability (295% strain) or sensitivity (maximum GF: ∼5500) on demand, which vital for advancing film-based electronic skins.
Abstract Low‐temperature bonding (≤300 o C) using Ag nanoparticles (Ag NPs) is considered to be the new generation of technology in power electronics. The oxygen‐accelerated sintering has been observed by many researchers which attributed decomposition organics covered on NPs. In this work, organic‐free NPs are fabricated eliminate influence organics, and it found that accelerated process oxygen strongly correlated self‐confined amorphous Ag‐O compound shell surface experiments, apparently...
A new cobalt-based coating, CoNiTi, was developed for brake disc applications. The effect of temperature on the tensile and thermal fatigue cracking properties CoNiTi evaluated between room (RT) 700 °C, compared with those commercial CoCrMoW Stellite 6 coatings. strength all coatings decreased increasing test temperature, elongation to fracture increased temperature. However, presented deterioration in at 400 ~ 500 °C. In addition, crack propagation rate also a trend accelerated increase...