Zhenyu Zhao

ORCID: 0000-0002-5025-5576
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Electronic Packaging and Soldering Technologies
  • Aluminum Alloys Composites Properties
  • Advanced machining processes and optimization
  • Advanced Surface Polishing Techniques
  • 3D IC and TSV technologies
  • Advanced ceramic materials synthesis
  • Metal Alloys Wear and Properties
  • Silicon Carbide Semiconductor Technologies
  • Injection Molding Process and Properties
  • High-Temperature Coating Behaviors
  • Microwave Dielectric Ceramics Synthesis
  • Carbon Nanotubes in Composites
  • Synthesis and properties of polymers
  • Advanced Machining and Optimization Techniques
  • Ferroelectric and Piezoelectric Materials
  • Recycling and utilization of industrial and municipal waste in materials production
  • Manufacturing Process and Optimization
  • Advanced Numerical Analysis Techniques
  • Electrical and Thermal Properties of Materials
  • Design Education and Practice
  • Aerosol Filtration and Electrostatic Precipitation
  • Cellular and Composite Structures
  • Advanced oxidation water treatment
  • Clay minerals and soil interactions
  • Fluid Dynamics and Heat Transfer

Tsinghua University
2013-2024

State Key Laboratory of Pollution Control and Resource Reuse
2024

Tongji University
2024

Shandong University of Science and Technology
2024

Xiangtan University
2024

Shenzhen Institute of Information Technology
1970-2022

State Key Laboratory of Tribology
2020

Harbin Normal University
2013

North University of China
2012

University of Houston
2011

In order to meet the requirements of sustainable growth and development for human beings, biomedical research has been focus our attention. Terahertz (THz) is recognized as one most promising technologies it widely used in biomedicine. A depiction basic principle THz spectroscopy imaging at beginning this article, some emerging techniques like microfluidic chips scattering-type scanning near-field (S-SNTS) are investigated well indicated that these have potential tackle shortcomings...

10.1080/05704928.2019.1670202 article EN Applied Spectroscopy Reviews 2019-10-12

10.1016/j.jmatprotec.2007.04.096 article EN Journal of Materials Processing Technology 2007-04-20

10.1016/j.tust.2024.105863 article EN Tunnelling and Underground Space Technology 2024-06-05

10.1016/j.surfcoat.2006.07.055 article EN Surface and Coatings Technology 2006-08-24

Infiltration of liquid aluminum alloy onto SiC particles requires them to be in wet contact at a high temperature, i.e., wetting angle θ <90°. The chemical reaction between these substances also promotes wetting. calculation shows that the interfacial reduces 66°from more than 120°. It is found infiltration process can roughly divided into following four steps: (1) gestation, (2) for high-temperature particles, (3) tiny pores, and (4) solidification form composite materials. time gestation...

10.1080/10426914.2010.537420 article EN Materials and Manufacturing Processes 2011-04-20

This article presents a wireless packaging design for SiC power device, which displays low induction, good thermal management performance, and excellent high-temperature reliability. A novel organic-free nanomaterial fabricated by ultrafast pulsed laser deposition (PLD) is employed as the bonding material both die attach top. With t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> = 20 s ΔT...

10.1109/tcpmt.2020.3038430 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2020-11-17

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver–oxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form paste, which used bond the Ag-coated copper (Cu) bulks. results revealed that high helpful increase strength, and joints average shear strength can reach 21.9 MPa at 523 K under 2 for 5 min. And mechanism reaction sintering bonding basically made clear by...

10.2320/matertrans.md201231 article EN MATERIALS TRANSACTIONS 2013-01-01

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package measured simulated. It found that sensitive to thickness inside chips. A FEM method considering viscoelastic property mold compound introduced simulate warpage. The CTE mismatch contributes more than 90% value reflowing at peak temperature. measure threshold, smallest may lead HiP....

10.2320/matertrans.mi201404 article EN MATERIALS TRANSACTIONS 2015-01-01

10.1016/j.jmatprotec.2005.02.165 article EN Journal of Materials Processing Technology 2005-04-04

Carbon nanofiber (CNF) reinforced elastomer composites with light weight, sustainability of large deformation, chemical stability, corrosion and fatigue resistance, vibration noise reduction capability can have positive impact on a wide range applications. However, this type composite is still under studied research area due to the difficulties in material handling processing. To improve processing control reproducibility for scale engineering applications, cost effective carbon nanofibers...

10.1166/jnn.2011.3074 article EN Journal of Nanoscience and Nanotechnology 2011-01-15

<title>Abstract</title> Recognizing that reinforced concrete has a shorter lifespan than anticipated and contributes to environmental pollution, timber structures have regained attention for their renewability eco-friendliness. However, the availability of large-scale suitable modern structural engineering is exceedingly limited. Consequently, reciprocal frames (RF), which utilize small-scale components achieve large spans, opened up new architectural possibilities in construction....

10.21203/rs.3.rs-4799666/v1 preprint EN cc-by Research Square (Research Square) 2024-10-28

Abstract Foam concrete is one of the most valuable porous materials used in civil and industrial buildings. Sepiolite, a fibrous hydrous magnesium silicate, possesses exceptional qualities such as low thermal conductivity, non-polluting nature, eco-friendliness. In this paper, multi-functional sepiolite-based foam has been fabricated using physical foaming technology. The high sepiolite content unique hierarchical structure endow with excellent adsorption insulation properties. exhibits...

10.1088/2053-1591/ad1ef7 article EN cc-by Materials Research Express 2024-01-01

Download This Paper Open PDF in Browser Add to My Library Share: Permalink Using these links will ensure access this page indefinitely Copy URL DOI

10.2139/ssrn.4755791 preprint EN 2024-01-01
Coming Soon ...