A5101425174- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Copper Interconnects and Reliability
- Thin-Film Transistor Technologies
- Semiconductor materials and devices
- Additive Manufacturing and 3D Printing Technologies
- ZnO doping and properties
- Advanced Welding Techniques Analysis
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Electrodeposition and Electroless Coatings
- Radio Frequency Integrated Circuit Design
- Advancements in Semiconductor Devices and Circuit Design
- Nanowire Synthesis and Applications
- Advanced MEMS and NEMS Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and interfaces
- Aluminum Alloys Composites Properties
- GaN-based semiconductor devices and materials
- Silicon Carbide Semiconductor Technologies
- Metal and Thin Film Mechanics
- Acoustic Wave Resonator Technologies
- Collaboration in agile enterprises
- Material Properties and Processing
- Antenna Design and Analysis
Northwestern Polytechnical University
2025
Shenzhen Second People's Hospital
2025
Tsinghua University
2015-2024
National Engineering Research Center for Information Technology in Agriculture
2020-2024
Peking University
2005-2023
South China Normal University
2023
Jiangnan University
2023
Institute of Microelectronics
2011-2020
Fudan University
2017-2019
Chinese Academy of Sciences
2013-2018
Multiband detection has always been a challenge and drawn much attention in the development of photodetectors (PDs). Herein, we present controllable synthesis SnO2 wires with different sizes via chemical vapor deposition formed composites CsPbBr3 particles to realize dual spectral response. We constructed PDs based on single millimeter wire decorated (SnO2 MMW/CsPbBr3), which showed stepped spectrum, fast response speed, self-powered function. Meanwhile, microwires/CsPbBr3 MWs/CsPbBr3) were...
Abstract Transparent ultraviolet (UV) photodetectors are an essential component of next‐generation “see‐through” electronics. However, the current often suffer from relatively slow response speeds and high driving voltages. Here, all‐solution‐processed UV reported that facilely prepared environmentally friendly abundant materials. The composed a titanium dioxide thin film as photosensitive layer sandwiched between two different transparent electrodes to form asymmetric Schottky junctions....
Abstract Herein, a single‐crystal SnO 2 microwire photodetector (PD) is demonstrated with fast response speed owing to low concentration of point defects. However, the presence surface defects (e.g., oxygen vacancies) still limits its optoelectronic performance. To further improve photoresponse such device, core–shell p–n junction constructed by simply coating new p‐type transparent conductive (CuS) 0.35 :(ZnS) 0.65 nanocomposite film (CuZnS) on n‐type microwire. As result, not only...
The pollution of heavy metals, especially cadmium in wastewater, is a big concern for the environment and humans. In this study, biochar was prepared by pyrolysis bamboo particles after impregnation phosphate (Na2HPO4). biochars before modification were characterized environmental scanning electron microscope (ESEM), Brunet–Emmet–Teller (BET), X-ray diffraction (XRD) analyses. results indicate that surface properties are improved compounds chemically bound to functional groups on surface....
In RRAM devices, electrodes play a significant role during the switching process. this paper, different top are used for TaO y /Ta2O5-x /AlO σ triple-oxide-layer devices. Top electrode-induced digital resistive to analog was observed. For Pt electrode (TE) abrupt behavior observed, while Al TE devices showed gradual behavior. Devices with various AlO thicknesses and sizes were fabricated characterized evaluate reliability of switching. The physical mechanisms responsible discussed.
High-performance transparent low-temperature top-gate type aluminum doped zinc oxide (AZO) thin-film transistors (TFTs) ( <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$W/L=100$</tex></formula> or 10 Notation="TeX">$\mu{\rm m}$</tex></formula> ) are successfully fabricated on glass substrate. All the process temperature is below 100 Notation="TeX">$^{\circ}{\rm C}$</tex></formula> . For...
Abstract Well‐integration of multiple bioactive components into a biological patch without damaging its cellular matrix structure is crucial for infectious abdominal wall defect repair but remains challenging. Herein, novel asymmetric composite (bPVA/SIS + ‐NP) developed by in situ introducing zwitterionic polyvinyl alcohol molecular brush (bPVA) hydrogel to cationic small intestinal submucosal decellularized (SIS ) via self‐induced phase separation based united strategy. Due high hydrogen...
To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured resistance used as interface material (TIM) by laser flash technique, and a less than 5 mm2 K/W was achieved for TIM. The also showed good reliability terms after cycling, indicating that it can be promising candidate TIM electronics applications. In addition, estimated contact at plate with assistance scanning acoustic microscopy....
Low-temperature Cu/Sn/Cu solid-state-diffusion (SSD) bonding has been investigated in this paper. Twenty-micrometer fine-pitch bumps with daisy-chain and Kelvin structures were fabricated by high-efficiency low-cost electroplating process. Before bonding, the bump surface was treated Ar(5% H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) plasma. Wafer-level performed a pressure of 6.7 MPa at 200 °C for 60 min. Microstructure as-bonded...
Collaborative engineering design involves various stakeholders with different perspectives. The process is relatively complex and difficult to handle. Various conflicts always happen among the tasks affect team performance. Therefore, represent collaborative capture evolution of perspectives in a structured way, it critical manage improve productivity. This article provides generic model based on sociotechnical framework. has topological format adopts analysis techniques from Petri Nets. By...
Copper nanoparticles (Cu NPs) fabricated by physical vapor deposition (PVD) were introduced in Cu-Cu bonding as surface modification. The structure with Ti adhesive/barrier layer and Cu substrate was on both surfaces first. Loose NPs then deposited magnetron sputtering a high pressure environment. Solid state process accomplished at 200°C for 3min under the of 20MPa. Die shear test carried out an average strength 36.75MPa achieved. analysis fracture revealed high-reliability structure....