- High voltage insulation and dielectric phenomena
- Advanced Sensor and Energy Harvesting Materials
- GaN-based semiconductor devices and materials
- Neuroscience and Neural Engineering
- Optical Coherence Tomography Applications
- 3D IC and TSV technologies
- Embedded Systems and FPGA Design
- Microwave Engineering and Waveguides
- Semiconductor Lasers and Optical Devices
- Power Transformer Diagnostics and Insulation
- Image and Signal Denoising Methods
- Ga2O3 and related materials
- Semiconductor Quantum Structures and Devices
- Photoacoustic and Ultrasonic Imaging
- Muscle activation and electromyography studies
- Electronic Packaging and Soldering Technologies
- Ideological and Political Education
- Advanced Antenna and Metasurface Technologies
- Lightning and Electromagnetic Phenomena
- Geophysics and Gravity Measurements
- Millimeter-Wave Propagation and Modeling
- Power Line Communications and Noise
- Photonic and Optical Devices
- Silicon Carbide Semiconductor Technologies
- Orbital Angular Momentum in Optics
Zhejiang International Studies University
2025
Beihang University
2025
University of Pennsylvania
2018-2024
Chongqing University of Technology
2002-2024
Neurotech (United States)
2024
Beijing Institute of Technology
2024
The Ohio State University
2024
Ministry of Industry and Information Technology
2024
Northwestern Polytechnical University
2024
Shandong University
2024
Needle-shaped beams (NBs) featuring a long depth-of-focus (DOF) can drastically improve the resolution of microscopy systems. However, thus far, implementation specific NB has been onerous due to lack common, flexible generation method. Here we develop spatially multiplexed phase pattern that creates many axially closely spaced foci as universal platform for customizing various NBs, allowing manipulations beam length and diameter, uniform axial intensity, sub-diffraction-limit beams. NBs...
In this work, AlGaN double channel heterostructure is proposed and grown by metal organic chemical vapor deposition (MOCVD), high-performance high electron mobility transistors (HEMTs) are fabricated investigated. The implementation of feature effectively improves the transport properties heterostructures. On one hand, total two dimensional gas (2DEG) density promoted due to potential wells along vertical direction enhanced carrier confinement. other average 2DEG in each reduced, elevated...
Cellular-resolution optical coherence tomography (OCT) is a powerful tool offering noninvasive histology-like imaging. However, like other microscopy tools, high numerical aperture (N.A.) lens required to generate tight focus, generating narrow depth of field, which necessitates dynamic focusing and limiting the imaging speed. To overcome this limitation, we developed metasurface platform that generates multiple axial foci, multiplies volumetric OCT speed by several focal planes. This offers...
Abstract The sense of touch is critical to dexterous use the hands and thus an essential component efforts restore hand function after amputation or paralysis. Prosthetic systems have addressed this goal with wearable tactile sensors. However, such sensors are suboptimal for neuroprosthetic designed reanimate a patient’s own paralyzed hand. Here, we developed implantable sensing system intended subdermal placement. composed microfabricated capacitive pressure sensor, custom integrated...
Abstract Optical imaging techniques provide low-cost, non-radiative images with high spatiotemporal resolution, making them advantageous for long-term dynamic observation of blood perfusion in stroke research and other brain studies compared to non-optical methods. However, high-resolution optical microscopy fundamentally requires a tight focus, thus limited depth field (DOF). Consequently, large-scale, non-stitched, curved surfaces, like brains, are difficult acquire without z-axis...
This study presents a phase-modulation technique capable of flexibly extending the depth-of-field (DOF) any diffraction pattern. method, deep diffractive optics (DDO), involves integrating needle-shaped beam phase modulator with conventional pattern design. Our findings reveal that these current can significantly extend over traditional by factor 5. method holds broad potential for applications in various optical devices, systems, and emerging fields photonics.
In this letter, a millimeter-wave filter constructed by 3-D substrate-integrated circular waveguide (SICW) resonant cavity is numerically and experimentally investigated. The SICW with the sidewall structure of via fences pads fully integrated in low-temperature co-fired ceramic (LTCC) substrate. fundamental mode (quasi-TE111 mode) TE <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">130</sub> , xmlns:xlink="http://www.w3.org/1999/xlink">140</sub>...
This paper presents the development and characterization of biodegradable electrical interconnects for transient implantable medical devices. The comprised micropatterned conductive polymer composites, which were developed using iron (Fe) microparticles as filler polycaprolactone (PCL) insulating matrix. properties composites investigated under various degradation conditions. Electrical percolation was observed at 17% Fe volume fraction, but higher fractions exhibited more stable resistivity...
Capacitive sensors are prevalent in IoT and healthcare devices due to their low cost zero static power consumption. As a pivotal component these devices, the sensor interface [1–4] poses distinct design challenges, especially wireless systems with considerable channel loss. In this work, an IC is implemented for one such application, where it combined force create subcutaneous implant tactile sensing. Through sensor-brain interface, device aims help restore somatosensation, important yet...
A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN high-electron-mobility-transistors (HEMTs). For HEMTs with gate–drain spacing L GD = 2.5 μm, the V BR increases from 518 582 by increasing h 0.2 μm 0.4 μm. 7 953 1310 0.8 1.6 The enhancement results increase of sidewall capacitance depletion region extension. Al Ga 0.6 N HEMT 1535 1763 resulting a high average electric field 2.51 MV/cm. Simulation analysis indicate that an effective method...
In this article, we carry out the parameter shift of quasi-vertical GaN-on-Si Schottky barrier diodes (SBDs) under ON-state stress with a high forward current 2–4 kA/cm2. Turn-on voltage <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{{\mathrm {\mathbf {on}}}}$ </tex-math></inline-formula> , ON-resistance notation="LaTeX">$R_{ON}$ reverse leakage notation="LaTeX">${I}_{\text {reverse}}$ height...
This paper introduces a computerized on-line partial discharge (PD) monitoring and diagnostic system for transformers. The system, which is already in use power station, uses wide-band active transducers data acquisition unit with modularized exchangeable components. software equipment based on the component object model, was developed multiple parameters supply systems. statistical characteristics of PDs transformers were studied using 7 experimental models simulating 3 interfering...
Hermetic packages compatible with complementary metal-oxide-semiconductor (CMOS) processes and capable of transmitting RF optical energy are in high demand. A hermetic packaging process based on the localized fusion bonding patterned stacked fused silica wafers to encapsulate a CMOS chip has been successfully demonstrated. The also allows for feedthroughs be fabricated within package wired interconnection encapsulated devices. carbon dioxide laser is applied achieve stack. Exploiting vector...
We develop a hermetic package process based on laser machining that simultaneously achieves dicing and localized fusion bonding of stacked, patterned bulk silica wafers; this enables rapid encapsulation foundry CMOS/MEMS. Because the extremely low thermal diffusivity fused silica, as well controllable nature spot illumination, interwafer molten bond line penetrates less than 200 microns laterally into device, sparing CMOS chip extreme heat bonding. Metallic feedthroughs can be incorporated...
This article presents an implantable low-power wireless integrated system for tactile sensing applications. The reported ASIC utilizes a low-loss magnetic human body communication channel both power and data transfer. chip is hybrid-integrated with in-house fabricated MEMS capacitive force sensor to form artificial mechanoreceptor. An on-chip correlated double sampling capacitance time converter consumes 750nW from 1.2V regulated supply, achieving 2.0fF resolution input of 14pF FoM 49 fJ/c-s...
A new terahertz (THz) filtering antenna realised by 3D substrate integrated circular waveguide (3D‐SICW) is presented. The designed on a low‐temperature co‐fired ceramic substrate. Different from traditional planar structure, the direction of power in 3D‐SICW along Z ‐axis and this will significantly enhance performance devices at THz frequency. constructed two cavities standard (SIW) cavity, where one SICW cavity SIW form bandpass filter using electric coupling other used as antenna....
This paper presents a digital pre-distortion scheme to reduce carrier-leakage in wideband FMCW radars that use circulator provide isolation between the transmitter and receiver. The proposed technique first power combines leakage signal with second pre-distorting prior entering radar Phase & amplitude of this are adjusted for partitions chirp cancellation. Transitions sections pulse shaped eliminate broadband frequency content.
A low-power wireless chip for an implantable tactile sensor system is presented. The reported ASIC utilizes the low-loss magnetic human body communication channel both powering and data transfer. hybrid-integrated with in-house fabricated MEMS capacitive force to form artificial mechanoreceptor (IAM). An on-chip correlated double sampling capacitance-to-time converter consumes 3.9μW from a 1.2V regulated supply achieves resolution of 22.8fF over input capacitance range 100pF, while occupying...
This paper reports a microfabricated triaxial capacitive force sensor. The sensor is fully encapsulated with inert and biocompatible glass (fused silica) material. comprises two plates, on which four capacitors are located. intended for subdermal implantation in fingertips palms providing tactile sensing capabilities patients paralyzed hands. Additional electronic components, such as passives IC chips, can also be integrated the hermetic package to achieve an implantable system. Through...