A5033486470- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Additive Manufacturing and 3D Printing Technologies
- Thermal properties of materials
- Semiconductor materials and devices
- Advanced Sensor and Energy Harvesting Materials
- 2D Materials and Applications
- Advanced ceramic materials synthesis
- Electronic and Structural Properties of Oxides
- Synthesis and properties of polymers
- Adhesion, Friction, and Surface Interactions
- Energy Harvesting in Wireless Networks
- Antenna Design and Analysis
- Heat Transfer and Boiling Studies
- Aluminum Alloys Composites Properties
- Graphene research and applications
- Innovative Energy Harvesting Technologies
- Nanofabrication and Lithography Techniques
- Aerogels and thermal insulation
- Gas Sensing Nanomaterials and Sensors
- Advancements in Photolithography Techniques
- Advanced Materials and Mechanics
- Polymer Nanocomposites and Properties
National University of Singapore
2022-2023
Shanghai Power Equipment Research Institute
2021-2023
Hunan University
2022
Shanghai Jiao Tong University
2011-2021
The supermoiré lattice, built by stacking two moiré patterns, provides a platform for creating flat mini-bands and studying electron correlations. An ultimate challenge in assembling graphene lattice is the deterministic control of its rotational alignment, which made highly aleatory due to random nature edge chirality crystal symmetry. Employing so-called "golden rule three", here we present an experimental strategy overcome this realize controlled alignment double-aligned hBN/graphene/hBN...
In this paper, we have designed a fabrication process for microgenerators by bonding piezoelectric ceramic Pb(Zr,Ti)O3 (PZT) plate to silicon on insulator (SOI) wafer. The key techniques of the include low-temperature technique using conductive epoxy resin, thinning bulk PZT mechanical lapping and wet-etching combined method, micromachining ceramics dicing. Through development optimization process, MEMS power generator array was successfully fabricated. typical device is selected...
A piezoelectric generator with nonlinear spring oscillator is proposed to provide multiple resonant modes for operation and improve conversion efficiency. In order scavenge the vibration energy of frequencies from a certain source, two types springs have been employed tested. The maximum output power 5, 17.83, 23.39 μW 8.3 N/m 1 g acceleration has obtained under frequency 89, 104, 130 Hz, respectively. Its total 46.22 obviously larger than one 28.35 traditional second-order spring-mass linear system.
Low thermal conductivity and large coefficient of expansion (CTE) are the most serious disadvantages polymer dielectric for interposer redistribution layer (RDL). In this paper, a high low CTE composite with polyimide (PI) matrix diamond nanoparticles/SiC whiskers reinforcement is proposed. The preparation characterization film presented effects on improvement properties investigated. With 10 wt% diamond-nanoparticles 7 SiC-whiskers, has 1.63 W/m·K 16.7 ppm/°C (compared 0.19 55.6 PI)....
2.5D Si interposer with finer through silicon via (TSV) and high density interconnections on the redistribution layer (RDL) is increasingly widespread applied in system packaging. A promising design, composite film of Polyimide SiC-whisker particles, adopted as dielectric layers RDL. The proposed material serving possess higher thermal conductivity smaller expansion mismatch conducting (electro-plating Cu) RDL substrate. By using this interconnecting a functional chip (10W/cm2), gradient was...
This paper presents a flexible bond pad (FBP) with hollow annular protuberance to improve the thermal fatigue lifetime for its application through-silicon vias (TSVs). The structure across interface between filled copper in TSV and silicon substrate not only isolates FBP from stress/strain concentration regions (the corners of TSV) but also disperses TSV-induced deformation. plastic strain distributions conventional plate-type (CPBP) were simulated by finite element method (FEM) under...
Signal and power incomplete are the main problems of integrated circuits(IC) due to loss between through-silicon vias(TSVs) in TSV arrays. The finite element method is employed simulate transmission performance crosstalk arrays four shapes, each shape divided into two ground-signal(GS) distributions. Pentagon-pattern with signal-in-center obtains best return characteristics TSVs square-pattern minimal. tiniest when signal located vertices square-pattern. This paper may provide useful...
Abstract The hybrid interface between 2D materials and complex oxides offers a rich platform to explore fascinating physical phenomena like helical edge states, broken-symmetry phases, giant magnetoresistance. While current research primarily focuses on the influence of layered materials, reverse—how affect oxides—remains largely unexplored. Here, we examined impact graphene layers formation oxygen vacancies in SrTiO 3 (STO) during high-temperature annealing. Our findings, supported by Raman...
The hybrid material of PI (with SiC whisker, particle, AlN and diamond particle) is proposed to satisfy the requirement higher thermal conductivity for high density package system. materials with a moderate amount doping can be improved about 6-12 times. films are fabricated by mechanical ball-milling process, speed stirring spin-coating process. When redistribution layer (from 0.15 W/m.K 1.5 W/m.K), maximal temperature Si interposer reduced 0.89 °C- 3.47 °C (2.50%-4.41%) gradient decreased...
Due to the mismatch between coefficients of thermal expansion (CTE) two adjacent films, residual stress was growing up during cycling. The aim this work is extend Stoney equation for multilayer thin films with heterostructure (voids filled gas or other solids) unsmooth interface. general theoretical models were built elastic and elastic-plastic deformation in void region solid gas. proposed closed solution (CS) simplified analyzing micro/nano devices micromachined multilayered structure that...
A "folding-fan-like" composite heat sink integrating flexible materials and ductile metals is proposed fabricated. PDMS served as the "fan surface" for sealing deformation, Ag-microchannel used bone" with a fixed end to enhance cooling effect supporting strength. The polymer-metal-polymer structure combines advantages of effective transfer in metal microchannels flexibility polymer materials. rigid-flexible frame features micro-gaps exchange at fluid-solid interface, optimize thermal...
This prospective randomized controlled analysis aimed to assess the changes in laryngopharyngeal reflux (LPR) children with adenoid hypertrophy (AH). Study design: a prospective, randomized, and analysis.The symptom index (RSI) finding score (RFS) scores were used evaluate diagnosed hypertrophy. The pepsin concentration salivary samples was examined, positive sensitivity specificity of RSI, RFS, RSI combined RFS forecasting LPR.In 43 AH, scale (used alone or combination) diagnosing...
Thermal management is a crucial factor in electronic devices with increasing power density due to the miniaturization, high power, and performance of these devices. To meet dual requirements heat flux low consumption, sink based on fractal microchannel hierarchical ribs structure multiple outlets proposed this work. The rib increases dissipation by enlarging transfer area disturbing flow. However, addition also narrows microchannel, which pressure drop. further reduce drop, optimized, are...
A compact antenna is designed as a CPW fed monopole with T shape, Y shape and meander shape. Based on the larger range of adjustable parameters this antenna, optimized relative high radiation performance. In order to enhance performance antenna-in-package, an antenna-in-package based through-silicon-interposer embedded air cavity polyimide dielectric micro-substrate proposed. The shielding structure covered among RF device reduce influence electromagnetic interference AiP. Under design,...