A5013848908- Piezoelectric Actuators and Control
- Electronic Packaging and Soldering Technologies
- Ultrasonics and Acoustic Wave Propagation
- Iterative Learning Control Systems
- Advanced machining processes and optimization
- Structural Health Monitoring Techniques
- Wireless Power Transfer Systems
- Adhesion, Friction, and Surface Interactions
- 3D IC and TSV technologies
- Advanced Welding Techniques Analysis
- Advanced Machining and Optimization Techniques
- Advanced MEMS and NEMS Technologies
- Engineering Applied Research
- Advanced Measurement and Metrology Techniques
- Non-Destructive Testing Techniques
- Microfluidic and Bio-sensing Technologies
- Flow Measurement and Analysis
- Aluminum Alloy Microstructure Properties
- Teleoperation and Haptic Systems
- Advanced Surface Polishing Techniques
- Geophysical Methods and Applications
- Tactile and Sensory Interactions
- Metallurgy and Material Forming
- Indoor and Outdoor Localization Technologies
- Micro and Nano Robotics
Harbin Institute of Technology
2015-2024
Shenzhen Technology University
2017
Huazhong University of Science and Technology
2014-2016
Changsha University of Science and Technology
2010-2011
Central South University
2004-2010
Ministry of Education of the People's Republic of China
2010
Central South University of Forestry and Technology
2008
Gesture recognition is an emerging technology of human–computer interaction. Compared to the conventional technologies such as wearable devices, cameras, and radars, ultrasound-based gesture has advantages low cost, power consumption, appropriates fog or dark environment. In this study, we propose a trajectory device via ultrasonic signal, which successfully applied in classification for gestures 3-D space. First, sensing hardware software configurations transmitting receiving signals are...
Static force, ultrasonic amplitude, feed rate, and rolling spacing parameters of 42CrMo steel treated by the surface process (USRP) were optimized Grey-Taguchi method. Nine sets experiments based on an orthogonal array design grey relational analysis used to obtain optimum combination mechanical properties for USRP. The influence processing was investigated analysis. results indicated that rate is dominant parameter affecting properties, followed space, static force. effects plastic strain...
A microgripper capable of accurately releasing or clamping the microgold wire for ultrasonic bonding is a key component in integrated circuit and light-emitting diode bonders. novel gripper with piezoelectric (PZT) stack flexible mechanism presented. dynamic model PZT established, method suppression control residual vibration proposed. The characteristics are calculated using finite-element modeling (FEM) to obtain natural frequency, mode, displacement. An input-shaping algorithm applied...
The electrical packaging for high power devices such as IGBT or MOSFET is achieved by heavy aluminum ultrasonic wire bonding. In this process, the amplitude stability of transducer determines bonding quality, which demands more accuracy in resonant frequency tracking (RFT) and constant control (CAC). investigation, we proposed a vector based (VRFT) (VCAC) to transducer. current dynamic branch was conducted calculating voltage Small signal model established applied into RFT CAC. A strategy...
Grouted splice sleeve (GSS) connectors are mainly used in precast concrete structures. However, errors manual operation during construction cause grouted defects the GSS connector, which can lead to a negative effect on overall mechanical properties of Owing complex structure members with it is difficult detect effectively using traditional ultrasonic parameters. In this paper, wavelet packet analysis algorithm was developed method, and verified experiment carried out. Laboratory detection...
Thermosonic flip chip bonding is used in certain fine pitch IC packaging for its unique features. By using this process paper, 1 mm times with 8 gold bumps has been bonded onto a silver-coated substrate. Dynamical properties of transducer system, which the key component providing ultrasonic energy, have investigated finite element model (FEM) and measurement impedance analyzer laser Doppler vibrometer (LDV). The simulation results show that vibrates by coupling all excited modes, therefore...
The effect of the temperature on bondability and bonding process for wire are investigated. Bondability is characterized by shear strength represented input output power ultrasonic transducer. A laser Doppler vibrometer Labview software were used to record velocity, voltage current transducer at different settings. K-type thermocouple sensor was measure temperature. Experimental results show that unsuccessful happens low temperature, over appears if too high. Only when appropriate settings,...
Ultrasonic wedge bonding is an important step in the manufacture of integrated circuits (ICs). Due to small size IC chips, methods for maintaining reliability are necessary avoid large amounts material waste and low production efficiency. Wire loss or wire error a typical failure bond process. This paper presents monitoring method that detects aluminum during ultrasonic During process, impedance from transducer measured, then compared with predetermined threshold assess whether has been...
Structural health monitoring technologies have provided extensive methods to sense the stress of steel structures. However, monitored is a relative value rather than an absolute in structure's current state. Among all measurement methods, ultrasonic shown great promise. The shear-wave amplitude spectrum and phase contain information along propagation path. In this study, influence uniaxial on spectra shear wave propagating members was investigated. Furthermore, were compared terms...